JPH0276664U - - Google Patents

Info

Publication number
JPH0276664U
JPH0276664U JP15242988U JP15242988U JPH0276664U JP H0276664 U JPH0276664 U JP H0276664U JP 15242988 U JP15242988 U JP 15242988U JP 15242988 U JP15242988 U JP 15242988U JP H0276664 U JPH0276664 U JP H0276664U
Authority
JP
Japan
Prior art keywords
solder
jet
reservoir
nozzle
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15242988U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15242988U priority Critical patent/JPH0276664U/ja
Publication of JPH0276664U publication Critical patent/JPH0276664U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の噴流はんだ槽の一部を断面に
した斜視図、第2図は本考案噴流はんだ槽の正面
図、第3図は同側面断面図である。 1…噴流はんだ槽、2…ノズル板、3…側板、
4…ノズル、5…溜板、6…はんだ貯溜槽、7…
開口、8…流量調整装置(摺動板)。
FIG. 1 is a partially sectional perspective view of the jet solder bath of the present invention, FIG. 2 is a front view of the jet solder bath of the present invention, and FIG. 3 is a side sectional view of the same. 1... Jet solder bath, 2... Nozzle plate, 3... Side plate,
4... Nozzle, 5... Reservoir plate, 6... Solder reservoir, 7...
Opening, 8...Flow rate adjustment device (sliding plate).

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ノズルの側方に、はんだ貯溜槽を設置した噴流
はんだ槽において、該はんだ貯溜槽の下方に流量
調整可能な幅広の開口を複数個設けたことを特徴
とする噴流はんだ槽。
1. A jet solder tank having a solder reservoir installed on the side of a nozzle, the jet solder tank having a plurality of wide openings below the solder reservoir that can adjust the flow rate.
JP15242988U 1988-11-25 1988-11-25 Pending JPH0276664U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15242988U JPH0276664U (en) 1988-11-25 1988-11-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15242988U JPH0276664U (en) 1988-11-25 1988-11-25

Publications (1)

Publication Number Publication Date
JPH0276664U true JPH0276664U (en) 1990-06-12

Family

ID=31427347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15242988U Pending JPH0276664U (en) 1988-11-25 1988-11-25

Country Status (1)

Country Link
JP (1) JPH0276664U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4834913U (en) * 1971-08-25 1973-04-26

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4834913U (en) * 1971-08-25 1973-04-26

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