JPH0276844U - - Google Patents
Info
- Publication number
- JPH0276844U JPH0276844U JP15674688U JP15674688U JPH0276844U JP H0276844 U JPH0276844 U JP H0276844U JP 15674688 U JP15674688 U JP 15674688U JP 15674688 U JP15674688 U JP 15674688U JP H0276844 U JPH0276844 U JP H0276844U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- semiconductor device
- heat dissipation
- dissipation fin
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Description
第１図は本考案第一実施例の半導体装置の横断
平面図、第２図は同じくその縦断側面図、第３図
は同じくそのリード端子を示す斜視図、第４図は
本考案第二実施例の半導体装置の放熱フインの正
面図、第５図は本考案第三実施例半導体装置の放
熱フインの正面図、第６図は本考案第四実施例の
半導体装置の放熱フインの正面図、第７図は従来
の半導体装置の横断平面図、第８図は同じく縦断
側面図である。
１０：回路基板、１１：ヒートスプレツダ、１
２：リード端子、１３：樹脂、１４：外装、１５
ａ，１５ｂ：放熱フイン。
FIG. 1 is a cross-sectional plan view of a semiconductor device according to a first embodiment of the present invention, FIG. 2 is a vertical side view thereof, FIG. 3 is a perspective view showing lead terminals thereof, and FIG. 4 is a second embodiment of a semiconductor device according to the present invention. FIG. 5 is a front view of the heat dissipation fin of the semiconductor device according to the third embodiment of the present invention; FIG. 6 is a front view of the heat dissipation fin of the semiconductor device according to the fourth embodiment of the present invention; FIG. 7 is a cross-sectional plan view of a conventional semiconductor device, and FIG. 8 is a vertical cross-sectional side view of the same. 10: Circuit board, 11: Heat spreader, 1
2: Lead terminal, 13: Resin, 14: Exterior, 15
a, 15b: Heat dissipation fin.
Claims (1)
トスプレツダと、前記回路基板より外部へ接続さ
れるリード端子と、これらを樹脂にて封止して成
る外装とから構成され、前記リード端子の一部に
、放熱フインが設けられたことを特徴とする半導
体装置。 It consists of a circuit board and a heat spreader on which internal circuit components are mounted, lead terminals connected to the outside from the circuit board, and an exterior that seals these with resin. A semiconductor device characterized in that a heat dissipation fin is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15674688U JPH0276844U (en) | 1988-11-30 | 1988-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15674688U JPH0276844U (en) | 1988-11-30 | 1988-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0276844U true JPH0276844U (en) | 1990-06-13 |
Family
ID=31435562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15674688U Pending JPH0276844U (en) | 1988-11-30 | 1988-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0276844U (en) |
-
1988
- 1988-11-30 JP JP15674688U patent/JPH0276844U/ja active Pending
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