JPH0280169A - Automatic jet type soldering device - Google Patents

Abstract

PURPOSE:To make the flow velocity of solder adjustable and to realize the soldering of high reliability being free from solder bridge by providing a back straightening vane which is installed so that an inclination angle can be adjusted on the rear side of the upper opening part of a nozzle body. CONSTITUTION:By turning an adjusting level 11 while tightening or loosening an adjusting screw 15, the inclination angle of a back straightening vane 9 is adjusted. In addition, by adjusting the degree of protrusion against a main plane of the back straightening vane 9 of a speed adjusting plate 18, the counterflow quantity of solder can be adjusted. In such a manner, the flow velocity of solder 2 which flows down through the back straightening vane 9 can be adjusted freely and with high accuracy together with the inclination angle of the back straightening vane 9, and a relative speed difference against a carrying speed of a printed board 4 can be eliminated. As a result, as for how to separate the solder 2 from a terminal 5 of the printed board 4, it is not torn off, a solder bridge between soldering terminals is scarcely generated, and soldering can be executed with high reliability.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a jet-type automatic soldering device that can be used when soldering electronic components to a printed circuit board.

2. Description of the Related Art Soldering of resistors, capacitors, jumper wires, etc. to printed circuit boards is automatically performed using a jet soldering device.

The structure and operation of a conventional soldering device of this type will be described below with reference to FIG. In Figure 3, l
2 is a solder tank, 2 is a molten solder, and 3 is a nozzle, which has a nozzle body 3a that is open at the top and bottom and a number of holes through which the molten solder 2 passes, and is fixed at the lower inside of the nozzle body 3a to collect the molten solder 2. The main elements are a punching panel 3b that determines the wave height H, a front rectifying plate 3C attached to the front side of the upper end of the nozzle body 3a by fitting, and a rear rectifying plate 3d similarly attached to the rear side by fitting. has been done. Although not shown, the nozzle 3 is connected to a jet source equipped with a propeller through a duct, and the rotation of the propeller causes the solder 2 to rise inside the nozzle body 3a.
It flows down into the solder bath 1 again along the front current plate 3c and the rear current plate 3d. The printed circuit board 4 is conveyed in the direction of the arrow (backward) by a conveyor such as a belt conveyor, and the soldering surface of the printed circuit board 4 comes into contact with the molten solder 2 on the nozzle 3 on the way, and parts such as resistors are soldered. It will be done. Here, by making the transport speed of the printed circuit board 4 and the flow velocity of the solder 2 the same (the flow velocity of the solder on the rear rectifier plate 3d), that is, by making the relative speed between the printed circuit board 4 and the solder flow velocity zero, the equivalent It becomes a static soldering state, and highly reliable automatic soldering can be performed.

For example, if the flow rate of the solder 2 is faster than the conveyance speed of the printed circuit board 4, the terminal 5 is separated from the molten solder 2 (at a point, the pull of the solder 2 on the terminal 5 is strong and the solder breaks off. This means that the amount of solder 2 remaining on the terminals 5 increases, causing the problem of forming solder bridges between the terminals 5. Especially in printed circuit boards that require high-density mounting, the spacing between the terminals is becoming narrower. There is a trend towards this, and countermeasures are eagerly awaited.

Problems to be Solved by the Invention In order to achieve this, in FIG.
It is conceivable to adjust the solder flow velocity in step d by the rotational speed of the jet source, or to adjust the conveyance speed of the printed circuit board 4. However, when the rotational speed of the jet source is slowed down, the solder 2 from the nozzle 3 does not bulge (wave height H) enough, causing the problem that the soldering of the printed circuit board 4 does not come into sufficient contact with the surface. If you increase the speed, solder 2
There is a problem in that the wave height H of the solder 2 becomes excessive and the solder 2 reaches the component mounting surface of the printed circuit board 4, causing a practical problem. Therefore, it is desirable that the wave height H of the solder 2 is always kept constant. On the other hand, the conveyance speed of the printed circuit board 4 is also required to be constant from the viewpoint of productivity, and as a result, it is difficult to reduce the relative velocity between the printed circuit board 4 and the solder flow velocity to zero.

In view of the above-mentioned problems, the present invention aims to improve the reliability of soldering by making the relative velocity between the conveyance speed of the printed circuit board and the solder flow velocity zero by adding a device to the configuration of the nozzle.

Means for Solving the Problems The jet-type automatic soldering device of the present invention is configured such that the inclination angle of the rear current plate can be adjusted, and furthermore, the tip of the rear current plate is provided with a direction that prevents the flow of solder. It is characterized by being provided with a speed adjustment plate that stands up.

Function: According to the jet type automatic soldering device of the present invention, since the inclination angle of the rear current plate can be adjusted and the degree of protrusion of the speed adjustment plate can be adjusted, the solder wave height H1 and the printed circuit board can be adjusted. It is possible to freely control the flow velocity of the solder flowing through the rear baffle plate while keeping the respective conveyance speeds constant, and as a result, the relative velocity between the conveyance speed of the printed circuit board and the solder flow velocity can be reduced to zero.

EXAMPLE An example of the present invention will be described below with reference to FIGS. 1 and 2. In the figure, 1 is a solder bath, 2 is molten solder, 3a is a nozzle body, and 3b is a punching panel, which are the same as those in FIG. 3. 7 is a front rectifying plate attached to the front wall of the upper opening of the nozzle body 3a by fitting, 8 is approximately U
This is a rear baffle plate attachment in the shape of a letter, and is fitted to the rear wall of the upper opening of the nozzle body 3a, and is attached by tightening screws if necessary. Reference numeral 9 denotes a rear rectifier plate, which is attached to the rear rectifier plate mount 8 by a hinge 10. Therefore, the rear current plate 9
The angle can be adjusted freely. Reference numeral 11 denotes a lever for adjusting the angle of the rear rectifying plate 9, which has a substantially doglegged shape, and is rotatably attached to a support shaft 12 fixed to the solder tank 1 at its bent part with a collar 13 and screws 14. It will be done. Reference numeral 15 denotes an adjustment screw for adjusting the rotation angle of the adjustment lever 11 and, by extension, the angle of the rear rectifying plate 9. The screw 15 screws into the adjustment screw mount 17 fixed to the solder bath 1 with a screw 16, and its tip is adjusted. It comes into contact with the tip of one side of the lever 11. Further, the tip of the other side of the adjustment lever 11 comes into contact with the back surface of the rear rectifying plate 9. 18 is the rear rectifier plate 9
This plate is a speed adjusting plate for the solder 2 flowing through the plate, and is fixed to the bent end portion of the rear rectifier plate 9 with a plurality of screws 19. The speed adjusting plate 18 projects in a direction to stop the solder 2 flowing down the rear rectifying plate 9, and the degree of the protrusion is adjusted by an elongated hole 20 provided in the speed adjusting plate 18.

Therefore, with this configuration, the inclination angle of the rear current plate 9 can be adjusted by rotating the adjustment lever 11 by tightening or loosening the adjustment screw 15. In addition, by adjusting the degree of protrusion of the speed adjustment plate 18 with respect to the main plane of the rear rectifying plate, the backflow amount of solder can be adjusted. The flow velocity of the solder 2 flowing down the solder 9 can be adjusted, and the relative velocity difference with the conveyance velocity of the printed circuit board 4 can be made zero.

As a result, the solder 2 is not separated from the terminals 5 of the printed circuit board 4 and is not torn off as in the conventional case. As a result, the adhesion of the solder 2 to the terminals 5 is reduced compared to that shown in FIG. 3, and solder bridges between the soldered terminals are less likely to occur, allowing highly reliable soldering. Therefore, it is particularly suitable for use in soldering high-density mounting boards, and high-quality printed boards can be produced.

In Fig. 2, reference numeral 21 denotes a pair of guide plates, which are installed so that their upper ends are higher than the opening surface of the noise main body 3a, so that the solder swells more at the ends and better soldering can be achieved. It is intended to do so.

Effects of the Invention As described above, according to the present invention, by making the inclination angle of the rear rectifying plate adjustable, solder flows down on the rear rectifying plate (the flow velocity of solder can be adjusted), and the solder flow rate can be adjusted. This allows for highly reliable soldering.

By making the degree of protrusion of the speed adjusting plate adjustable, the solder flow speed can be controlled more accurately and freely.

[Brief explanation of the drawing]

FIG. 1 is a side sectional view of a jet type automatic soldering apparatus according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of the same, and FIG. 3 is a side sectional view of a conventional jet type automatic soldering apparatus. 3a... Nozzle body, 8... Rear current plate attachment, 9... Rear current plate, 10...
・Hinge, 11...Adjustment lever, 18...
・Speed adjustment plate. Name of agent: Patent attorney Shigetaka Awano

Claims (3)

[Claims] (1) A jet stream characterized by comprising a nozzle body with openings at the top and bottom for raising molten solder, and a rear rectifying plate whose inclination angle is adjustable at the rear side of the upper opening of the nozzle body. Automatic soldering device. (2) A nozzle body with openings at the top and bottom for raising molten solder, a rear rectifier plate whose inclination angle can be adjusted at the rear side of the upper opening of the nozzle body, and a rear rectifier plate attached to the tip of the rear rectifier plate. A jet flow automatic soldering device is equipped with a speed adjustment plate that stands up to block the flow of molten solder flowing down a rear rectifier plate. (3) A nozzle body with an open top and bottom for raising molten solder, a rear rectifying plate rotatably attached via a hinge to the rear side of the upper opening of the nozzle body, and a rotatably supported and one end is in contact with the back surface of the rear rectifier plate,
The jet type is equipped with an inclination angle adjustment lever whose other end comes into contact with an adjustment screw that is screwed into the mounting base, and the inclination angle of the rear rectifying plate is adjusted via the adjustment lever by adjusting the adjustment screw. Automatic soldering equipment.