JPH028044U - - Google Patents
Info
- Publication number
- JPH028044U JPH028044U JP1988083507U JP8350788U JPH028044U JP H028044 U JPH028044 U JP H028044U JP 1988083507 U JP1988083507 U JP 1988083507U JP 8350788 U JP8350788 U JP 8350788U JP H028044 U JPH028044 U JP H028044U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- fixed
- lower heat
- thermal conductivity
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988083507U JPH028044U (th) | 1988-06-23 | 1988-06-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988083507U JPH028044U (th) | 1988-06-23 | 1988-06-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028044U true JPH028044U (th) | 1990-01-18 |
Family
ID=31308222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988083507U Pending JPH028044U (th) | 1988-06-23 | 1988-06-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028044U (th) |
-
1988
- 1988-06-23 JP JP1988083507U patent/JPH028044U/ja active Pending