JPH0280455U - - Google Patents
Info
- Publication number
- JPH0280455U JPH0280455U JP16110588U JP16110588U JPH0280455U JP H0280455 U JPH0280455 U JP H0280455U JP 16110588 U JP16110588 U JP 16110588U JP 16110588 U JP16110588 U JP 16110588U JP H0280455 U JPH0280455 U JP H0280455U
- Authority
- JP
- Japan
- Prior art keywords
- common electrode
- electrode
- substrate
- thermal head
- exposed portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 claims description 5
- 239000011241 protective layer Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 2
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案に係るサーマルヘツドの実施例
を示す要部断面図、第２図は従来のサーマルヘツ
ドを示す断面図である。
１１……絶縁性基板、１１ａ……基板露出部、
１２……グレーズ層、１３……発熱抵抗体、１４
……電極、１４Ａ……共通電極、１４Ｂ……個別
電極、１５……保護層、１６……集合電極、１７
……電極露出部、１８……端子、１９……集積回
路素子、２０……防湿コート。
FIG. 1 is a sectional view of a main part of a thermal head according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional thermal head. 11...Insulating substrate, 11a...Substrate exposed part,
12...Glaze layer, 13...Heating resistor, 14
...Electrode, 14A...Common electrode, 14B...Individual electrode, 15...Protective layer, 16...Collective electrode, 17
...Exposed electrode portion, 18...Terminal, 19...Integrated circuit element, 20...Moisture-proof coat.
Claims (1)
ーズ層上に複数の発熱抵抗体を形成し、各発熱抵
抗体から個別電極および共通電極をそれぞれ導出
し、前記発熱抵抗体、前記個別電極および前記共
通電極を保護層により被覆するとともに、前記絶
縁性基板上に前記個別電極を介して前記発熱抵抗
体に印字信号を出力する集積回路素子を搭載して
なるサーマルヘツドにおいて、前記絶縁性基板の
端部に前記グレーズ層を積層しない基板露出部を
形成し、前記共通電極を基板露出部まで延在し、
この基板露出部まで延在された前記共通電極およ
び前記個別電極のそれぞれの上にはんだ付けの容
易な金属をめつきし、前記共通電極上に集合電極
を形成するとともに、前記個別電極をめつきされ
た前記金属を介して前記集積回路素子に接続した
ことを特徴とするサーマルヘツド。 A glaze layer is laminated on an insulating substrate, a plurality of heating resistors are formed on the glaze layer, an individual electrode and a common electrode are led out from each heating resistor, and the heating resistor, the individual electrode, and the common electrode are led out from each heating resistor. In a thermal head in which a common electrode is covered with a protective layer and an integrated circuit element is mounted on the insulating substrate to output a print signal to the heat generating resistor via the individual electrodes, an edge of the insulating substrate is provided. forming an exposed portion of the substrate on which the glaze layer is not laminated, and extending the common electrode to the exposed portion of the substrate;
Easily soldered metal is plated on each of the common electrode and the individual electrodes that extend to the exposed portion of the substrate, and a collective electrode is formed on the common electrode, and the individual electrodes are plated. 1. A thermal head, wherein the thermal head is connected to the integrated circuit element through the metal layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16110588U JPH0280455U (en) | 1988-12-12 | 1988-12-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16110588U JPH0280455U (en) | 1988-12-12 | 1988-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0280455U true JPH0280455U (en) | 1990-06-21 |
Family
ID=31443761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16110588U Pending JPH0280455U (en) | 1988-12-12 | 1988-12-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0280455U (en) |
-
1988
- 1988-12-12 JP JP16110588U patent/JPH0280455U/ja active Pending