JPH028047U - - Google Patents
Info
- Publication number
- JPH028047U JPH028047U JP1988085488U JP8548888U JPH028047U JP H028047 U JPH028047 U JP H028047U JP 1988085488 U JP1988085488 U JP 1988085488U JP 8548888 U JP8548888 U JP 8548888U JP H028047 U JPH028047 U JP H028047U
- Authority
- JP
- Japan
- Prior art keywords
- longitudinal direction
- pellet
- leads
- lead frame
- mounts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988085488U JPH028047U (it) | 1988-06-27 | 1988-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988085488U JPH028047U (it) | 1988-06-27 | 1988-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028047U true JPH028047U (it) | 1990-01-18 |
Family
ID=31310156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988085488U Pending JPH028047U (it) | 1988-06-27 | 1988-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028047U (it) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5262095U (it) * | 1975-10-31 | 1977-05-07 | ||
| JP2003518733A (ja) * | 1999-11-01 | 2003-06-10 | ゼネラル セミコンダクター，インク． | プレーナハイブリッドダイオード整流器ブリッジ |
-
1988
- 1988-06-27 JP JP1988085488U patent/JPH028047U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5262095U (it) * | 1975-10-31 | 1977-05-07 | ||
| JP2003518733A (ja) * | 1999-11-01 | 2003-06-10 | ゼネラル セミコンダクター，インク． | プレーナハイブリッドダイオード整流器ブリッジ |
| JP4975925B2 (ja) * | 1999-11-01 | 2012-07-11 | ゼネラル セミコンダクター，インク． | プレーナ型ハイブリッドダイオード整流器ブリッジ |