JPH0280482U - - Google Patents
Info
- Publication number
- JPH0280482U JPH0280482U JP16058188U JP16058188U JPH0280482U JP H0280482 U JPH0280482 U JP H0280482U JP 16058188 U JP16058188 U JP 16058188U JP 16058188 U JP16058188 U JP 16058188U JP H0280482 U JPH0280482 U JP H0280482U
- Authority
- JP
- Japan
- Prior art keywords
- memory card
- semiconductor
- flexible board
- circuit board
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Credit Cards Or The Like (AREA)
Description
第１図は、この考案に係るメモリカード１６の
外観及びこのメモリカードを電子機器と電気的に
接続する電子機器端子部１７を示し、そのＡ―Ａ
断面図を第２図に示す。第３図は、メモリカード
内の本考案の実施例を示し、第４図（半田付前）
、第５図（半田付後）には、そのＢ―Ｂ断面図を
示す。第６図は回路基板にもスルーホールを設け
た例を示す。第７図、第８図には従来の実施例を
示す。
１，９，１２……フレキシブル基板、２，１０
，１３……回路基板、３……スルーホール部、３
ａ，８ａ……スルーホール、４……電極端子部、
４ａ，４ｂ……電極端子、５……銅箔、６，７，
１１，１４……半田、１５……メモリ半導体、１
６……メモリカード、１７……電子機器端子部、
１８……電子機器端子。
FIG. 1 shows the external appearance of a memory card 16 according to the invention and an electronic device terminal section 17 that electrically connects this memory card to an electronic device.
A cross-sectional view is shown in FIG. Figure 3 shows an embodiment of the present invention in a memory card, and Figure 4 (before soldering).
, FIG. 5 (after soldering) shows the BB sectional view. FIG. 6 shows an example in which through holes are also provided on the circuit board. FIGS. 7 and 8 show conventional embodiments. 1, 9, 12...Flexible board, 2, 10
, 13...Circuit board, 3...Through hole part, 3
a, 8a...Through hole, 4...Electrode terminal part,
4a, 4b... Electrode terminal, 5... Copper foil, 6, 7,
11, 14...Solder, 15...Memory semiconductor, 1
6...Memory card, 17...Electronic device terminal section,
18...Electronic device terminal.
Claims (1)
カードの端子部をフレキシブル基板とし、半導体
等を装着する回路基板との接合において、フレキ
シブル基板にスルーホールを設け、半田での接合
を容易かつ確実にする構造のメモリカード。 The terminal part of a memory card with a built-in memory semiconductor, etc. is made of a flexible board, and a through-hole is provided in the flexible board when joining the circuit board on which the semiconductor, etc. is mounted, making it easy and reliable to join with solder. structure memory card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16058188U JPH0280482U (en) | 1988-12-09 | 1988-12-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16058188U JPH0280482U (en) | 1988-12-09 | 1988-12-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0280482U true JPH0280482U (en) | 1990-06-21 |
Family
ID=31442770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16058188U Pending JPH0280482U (en) | 1988-12-09 | 1988-12-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0280482U (en) |
-
1988
- 1988-12-09 JP JP16058188U patent/JPH0280482U/ja active Pending
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