JPH028079U - - Google Patents
Info
- Publication number
- JPH028079U JPH028079U JP8352188U JP8352188U JPH028079U JP H028079 U JPH028079 U JP H028079U JP 8352188 U JP8352188 U JP 8352188U JP 8352188 U JP8352188 U JP 8352188U JP H028079 U JPH028079 U JP H028079U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- leads
- wiring board
- printed wiring
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ａは本考案の印刷配線基板の一実施例を
示す斜視図、第１図ｂは第１図ａの実施例の一部
拡大図、第２図ａ，ｂは本実施例のパターン３と
従来のパターン１３との寸法比較図、第３図ａ，
ｂは従来例を示すそれぞれ斜視図、一部拡大図で
ある。
１……電子部品、２……リード、３……パター
ン。
Figure 1a is a perspective view showing an embodiment of the printed wiring board of the present invention, Figure 1b is a partially enlarged view of the embodiment of Figure 1a, and Figures 2a and b are patterns of this embodiment. 3 and the conventional pattern 13, Fig. 3a,
b is a perspective view and a partially enlarged view showing a conventional example, respectively. 1...Electronic parts, 2...Leads, 3...Patterns.
Claims (1)
が半田付けされる印刷配線基板において、 前記電子部品のリードが半田付けされる個所が
円形状のパターンであることを特徴とする印刷配
線基板。[Claims for Utility Model Registration] A printed wiring board to which electronic components, particularly electronic components having butted leads, are soldered, characterized in that the locations where the leads of the electronic components are soldered have a circular pattern. Printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8352188U JPH028079U (en) | 1988-06-23 | 1988-06-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8352188U JPH028079U (en) | 1988-06-23 | 1988-06-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028079U true JPH028079U (en) | 1990-01-18 |
Family
ID=31308234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8352188U Pending JPH028079U (en) | 1988-06-23 | 1988-06-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028079U (en) |
-
1988
- 1988-06-23 JP JP8352188U patent/JPH028079U/ja active Pending