JPH028081U - - Google Patents
Info
- Publication number
- JPH028081U JPH028081U JP8378588U JP8378588U JPH028081U JP H028081 U JPH028081 U JP H028081U JP 8378588 U JP8378588 U JP 8378588U JP 8378588 U JP8378588 U JP 8378588U JP H028081 U JPH028081 U JP H028081U
- Authority
- JP
- Japan
- Prior art keywords
- conductor land
- mounting hole
- component mounting
- land
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ないし第３図は本考案の一実施例を示す
図であつて、第１図はその平面図、第２図は第１
図中−線に沿う矢視断面図、第３図は半田の
流れを示す平面図、第４図は従来の導体ランドの
半田の流れを示す平面図、第５図ないし第７図は
他の従来の導体ランドを示す図であつて、第５図
はその平面図、第６図は第５図中−線に沿う
矢視断面図、第７図は導体ランドの半田の流れを
示す平面図である。
２２……部品取付孔、２３……導体ランド、２
５……半田阻止部。
1 to 3 are diagrams showing one embodiment of the present invention, in which FIG. 1 is a plan view thereof, and FIG. 2 is a first embodiment of the present invention.
Fig. 3 is a plan view showing the flow of solder, Fig. 4 is a plan view showing the flow of solder in a conventional conductor land, and Figs. FIG. 5 is a plan view of a conventional conductor land, FIG. 6 is a sectional view taken along the line - in FIG. 5, and FIG. 7 is a plan view showing the flow of solder on the conductor land. It is. 22...Component mounting hole, 23...Conductor land, 2
5...Solder blocking section.
Claims (1)
リント配線板において、前記導体ランドの上面の
一部に前記導体ランドの内側から外側へ至るソル
ダーレジストの被膜を設けたことを特徴とするプ
リント配線板。 A printed wiring board in which a conductor land is formed on the outer periphery of a component mounting hole, characterized in that a solder resist coating is provided on a part of the upper surface of the conductor land from the inside to the outside of the conductor land. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8378588U JPH028081U (en) | 1988-06-24 | 1988-06-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8378588U JPH028081U (en) | 1988-06-24 | 1988-06-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028081U true JPH028081U (en) | 1990-01-18 |
Family
ID=31308495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8378588U Pending JPH028081U (en) | 1988-06-24 | 1988-06-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028081U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6173396A (en) * | 1984-09-19 | 1986-04-15 | 株式会社日立製作所 | Printed board |
| JPS62219690A (en) * | 1986-03-20 | 1987-09-26 | 松下電器産業株式会社 | Printed wiring board |
-
1988
- 1988-06-24 JP JP8378588U patent/JPH028081U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6173396A (en) * | 1984-09-19 | 1986-04-15 | 株式会社日立製作所 | Printed board |
| JPS62219690A (en) * | 1986-03-20 | 1987-09-26 | 松下電器産業株式会社 | Printed wiring board |