JPH028098U - - Google Patents

Info

Publication number
JPH028098U
JPH028098U JP8540888U JP8540888U JPH028098U JP H028098 U JPH028098 U JP H028098U JP 8540888 U JP8540888 U JP 8540888U JP 8540888 U JP8540888 U JP 8540888U JP H028098 U JPH028098 U JP H028098U
Authority
JP
Japan
Prior art keywords
fixing structure
frequency electronic
heat sink
fixed
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8540888U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8540888U priority Critical patent/JPH028098U/ja
Publication of JPH028098U publication Critical patent/JPH028098U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す断面図、第２
図は従来の固定構造を示す断面図、第３図は構造
概略図、第４図はネジの単位長当りの容量を示す
説明図である。 １……放熱板、２……トランジスタの放熱板、
３……絶縁シート、４……トランジスタのモール
ド、５……低静電容量ビス。 Fig. 1 is a sectional view showing one embodiment of the present invention;
3 is a schematic diagram of the structure, and FIG. 4 is an explanatory diagram showing the capacity per unit length of the screw. 1... Heat sink, 2... Transistor heat sink,
3...Insulating sheet, 4...Transistor mold, 5...Low capacitance screw.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 高周波用電子部品を絶縁シートを介して、金属
ビスにより、放熱板に固定する固定構造において
、前記、高周波用電子部品の放熱部近傍が、固定
構造部よりも径を小さくした金属ビスで固定する
ことを特徴とする高周波用電子部品の固定構造。 In a fixing structure in which a high-frequency electronic component is fixed to a heat sink with metal screws through an insulating sheet, the vicinity of the heat sink of the high-frequency electronic component is fixed with a metal screw having a diameter smaller than that of the fixing structure. A fixing structure for high frequency electronic components.
JP8540888U 1988-06-27 1988-06-27 Pending JPH028098U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8540888U JPH028098U (en) 1988-06-27 1988-06-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8540888U JPH028098U (en) 1988-06-27 1988-06-27

Publications (1)

Publication Number Publication Date
JPH028098U true JPH028098U (en) 1990-01-18

Family

ID=31310077

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8540888U Pending JPH028098U (en) 1988-06-27 1988-06-27

Country Status (1)

Country Link
JP (1) JPH028098U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62156621U (en) * 1986-03-27 1987-10-05
JPH09139592A (en) * 1995-11-15 1997-05-27 Nec Corp Heat dissipation structure of electronic device
JP2016503969A (en) * 2013-01-16 2016-02-08 シーメンス リサーチ センター リミテッド ライアビリティ カンパニーＳｉｅｍｅｎｓ Ｒｅｓｅａｒｃｈ Ｃｅｎｔｅｒ Ｌｉｍｉｔｅｄ Ｌｉａｂｉｌｉｔｙ Ｃｏｍｐａｎｙ Chip package assembly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62156621U (en) * 1986-03-27 1987-10-05
JPH09139592A (en) * 1995-11-15 1997-05-27 Nec Corp Heat dissipation structure of electronic device
JP2016503969A (en) * 2013-01-16 2016-02-08 シーメンス リサーチ センター リミテッド ライアビリティ カンパニーＳｉｅｍｅｎｓ Ｒｅｓｅａｒｃｈ Ｃｅｎｔｅｒ Ｌｉｍｉｔｅｄ Ｌｉａｂｉｌｉｔｙ Ｃｏｍｐａｎｙ Chip package assembly

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