JPH0281026U - - Google Patents

Info

Publication number
JPH0281026U
JPH0281026U JP16145488U JP16145488U JPH0281026U JP H0281026 U JPH0281026 U JP H0281026U JP 16145488 U JP16145488 U JP 16145488U JP 16145488 U JP16145488 U JP 16145488U JP H0281026 U JPH0281026 U JP H0281026U
Authority
JP
Japan
Prior art keywords
surface mounting
terminal
slit
electronic device
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16145488U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16145488U priority Critical patent/JPH0281026U/ja
Publication of JPH0281026U publication Critical patent/JPH0281026U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例の表面実装用パツケ
ージの斜視図、第2図aおよびbはこれをプリン
ト基板に実装した際の部分拡大図、第3図は従来
の表面実装用パツケージの斜視図、第4図aおよ
びbはこれをプリント基板に実装した際の部分拡
大図を示している。 図において、11,21,31,41……パツ
ケージ本体、12,22,32,42……リード
端子、13……スリツト、23,43……プリン
ト基板、24,44……ハンダフイレツト。
Fig. 1 is a perspective view of a surface mount package according to an embodiment of the present invention, Figs. 2 a and b are partially enlarged views of the package mounted on a printed circuit board, and Fig. 3 is a conventional surface mount package. The perspective view and FIGS. 4a and 4b show partially enlarged views when this is mounted on a printed circuit board. In the figure, 11, 21, 31, 41... package body, 12, 22, 32, 42... lead terminal, 13... slit, 23, 43... printed circuit board, 24, 44... solder fillet.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 表面実装用電子デバイスのリード端子において
、端子幅の中央部にスリツト又は穴をあけたこと
を特徴とする表面実装用リード端子の構造。
A structure of a lead terminal for surface mounting of an electronic device for surface mounting, characterized in that a slit or hole is formed in the center of the width of the terminal.
JP16145488U 1988-12-12 1988-12-12 Pending JPH0281026U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16145488U JPH0281026U (en) 1988-12-12 1988-12-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16145488U JPH0281026U (en) 1988-12-12 1988-12-12

Publications (1)

Publication Number Publication Date
JPH0281026U true JPH0281026U (en) 1990-06-22

Family

ID=31444406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16145488U Pending JPH0281026U (en) 1988-12-12 1988-12-12

Country Status (1)

Country Link
JP (1) JPH0281026U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007329419A (en) * 2006-06-09 2007-12-20 Koa Corp Metallic plate resistor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007329419A (en) * 2006-06-09 2007-12-20 Koa Corp Metallic plate resistor

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