JPH0281463A - Cooled mounting structure of semiconductor device and method of cooling - Google Patents

Abstract

PURPOSE:To improve cooling performance with a simple structure by a method wherein a gap is formed between a semiconductor package and a wiring board and holes through which coolant is made to flow are drilled in the wiring board so as to face the semiconductor package and, at the same time, a cooling fin is attached to the semiconductor package. CONSTITUTION:A plurality of coolant introducing holes 6 are provided for one semiconductor package 2. The coolant is spouted against the rear of a wiring board 1 to introduce the coolant into a gap 7 and heat exchange is performed on the rear of an IC package 2 and around I/O pins 3. By providing a plurality of the holes 6, a cooling efficiency is improved and, moreover, the restriction given to the arrangement of conductor layers in the wiring board 1 by making one large hole in the wiring board 1 is avoided and the flow rate necessary for cooling can be insured. A cooling fin 8 is attached to the semiconductor package 2. The coolant is spouted against the rear of the wiring board 1 and introduced into the gap 7 and, after the heat exchange is performed on the rear of the semiconductor package 2 and around the I/O pins 3, the heat transmitted to the upper surface and the side surfaces of the semiconductor package 2 is discharged through the cooling fin 8, so that the cooling performance can be further improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cooling mounting structure and cooling method for a semiconductor device that can efficiently remove heat generated from a semiconductor chip of an integrated circuit.

[Conventional technology]

In recent years, large-scale computers require high-speed data processing, and as a result, devices have become highly integrated, and the amount of heat generated from one integrated circuit has increased dramatically. For this reason, there are concerns about excessive temperature rise in integrated circuits, which has not been considered a problem in the past, and cooling of integrated circuits has become an important issue when implementing large-scale computers.

Various methods have been used in the past to dissipate heat generated from semiconductor chips. Forced air cooling is a standard cooling technique. One of these forced air cooling methods is to provide a heat dissipation fin on the top of the integrated circuit semiconductor package, transfer the heat generated from the semiconductor chip to the heat dissipation fin, and cool the heat dissipation fin by forced air cooling. (For example, [Journal of Electronics and Communication Engineers JVoQ, 65 No. 7.
Year).

(pp. 748 to 753).

Further, as shown in FIG. 7, the heat generated in the semiconductor chip 4 is converted into one-phase power using the Bertier element 10, and then returned to heat, and this heat is transferred to the input/output pin 3. It has been proposed that the human output bin 3 is cooled by air cooling (IBM Technical Disclosure Pluten Vo12, 27 No.
,9. (1985), pp. 5096-5099 (IBM Technical Disclosure
Bulletin VaQ, 27 No. 9. (19
82), pp5096-5099)).

[Problems to be Solved by the Invention] However, among the above-mentioned conventional technologies, in those in which heat dissipation fins are provided, the bonding of the heat dissipation fins is limited to the top surface of the integrated circuit package, so it is difficult to sufficiently cool the semiconductor chip. requires an excessive amount of air. When the amount of air is increased, a noise problem arises, and its practicality has reached its limit.

Furthermore, in the case of using the Vertier element 10, the use of the Peltier element complicates the apparatus, which is disadvantageous in terms of cost and reliability.

An object of the present invention is to provide a cooling mounting structure and a cooling method for a semiconductor device that can be expected to have sufficient cooling performance with a simple structure.

[Means to solve the problem]

In order to achieve the above object, the present invention provides a semiconductor package that is equipped with at least one semiconductor chip and has a large number of input/output pins, is installed on a wiring board, and is provided between the semiconductor package and the wiring board. In a cooling mounting structure for a semiconductor device in which a gap is formed and a coolant flows into the gap to cool the semiconductor chip, a hole through which the coolant flows is formed in the wiring board so as to face the semiconductor package. be.

Further, the present invention provides a semiconductor package having at least one semiconductor chip mounted thereon and having a large number of input/output pins, installed on a wiring board, and forming a gap between the semiconductor package and the wiring board. In a cooling mounting structure for a semiconductor device in which the semiconductor chip is cooled by flowing a coolant into a gap, a hole through which the coolant flows is formed in the wiring board so as to face the semiconductor package;
The semiconductor package is provided with cooling fins.

Further, the present invention provides a semiconductor package having at least one semiconductor chip mounted thereon and having a large number of input/output pins, installed on a wiring board, and forming a gap between the semiconductor package and the wiring board. In a cooling mounting structure for a semiconductor device in which the semiconductor chip is cooled by flowing a coolant into a gap, a hole through which the coolant flows is formed in the wiring board so as to face the semiconductor package;
Cooling fins are provided at the base of the input/output pins of the semiconductor package.

Further, in the present invention, a semiconductor package mounted with at least one semiconductor chip and having a large number of input/output pins is installed on a wiring board, and a gap is formed between the semiconductor package and the wiring board, and In a cooling mounting structure for a semiconductor device in which the semiconductor chip is cooled by flowing a coolant into an air gap, an oblique hole through which the coolant flows is formed in the wiring board so as to face the semiconductor package, and A guide plate is formed to guide the refrigerant.

Furthermore, the present invention provides a method for cooling a semiconductor device in which the semiconductor chip is cooled by flowing a refrigerant into a gap between a semiconductor package on which a semiconductor chip is mounted and a wiring board on which the semiconductor package is installed. The refrigerant is introduced into the input/output pin side of the semiconductor package through the hole formed in the wiring board, and when the introduced refrigerant flows through the gap, the refrigerant cools between the semiconductor chip and the refrigerant. , to allow heat exchange to take place.

The present invention also provides a method for cooling a semiconductor device in which the semiconductor chip is cooled by flowing a refrigerant into a gap between a semiconductor package on which a semiconductor package is mounted and a wiring board on which the semiconductor package is attached. The coolant is caused to flow into the semiconductor package from above and introduced into the input/output pin side of the semiconductor package, and when the introduced coolant flows through the gap, between the semiconductor chip and the coolant, After the heat exchange is performed, the refrigerant is discharged through the hole formed in the wiring board.

Furthermore, one aspect of the present invention is a wiring board having at least one conductive layer and through holes for input/output pins, in which holes are formed to serve as flow paths for a cooling medium.

[Effect]

As mentioned above, if a hole is made in the wiring board facing the semiconductor package, when the coolant flows in a direction perpendicular to the wiring board, the coolant will flow through the hole, and the semiconductor package and input/output The pins can be cooled uniformly, improving cooling efficiency.

Furthermore, if cooling fins are provided at the base of the semiconductor package or the input/output pins, cooling efficiency can be further improved.

Additionally, if diagonal holes are drilled in the wiring board and a guide plate is provided, when the coolant flows in a direction parallel to the wiring board, the guide plate will guide the coolant into the diagonal hole, allowing the semiconductor The package and input/output pins can be efficiently cooled.

Further, in order to flow the coolant in a direction perpendicular to the wiring board, there are two possible ways to flow the coolant: from the top side of the semiconductor package, and from the bottom side of the semiconductor package, that is, from the back side of the wiring board.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, a semiconductor chip 4 is mounted on a multilayer substrate 11 consisting of a large number of conductive layers and insulating layers, and is electrically connected by spherical solder balls 5. As shown in FIG. Further, the semiconductor chip 4 mounted on the multilayer substrate 11 is sealed with a ceramic material or the like to form the semiconductor package 2. On the surface of the semiconductor package 2 facing the wiring board 1.

A large number of input/output pins 3 electrically connected to the semiconductor chip 4 are attached except for the central part of the blood. Furthermore, the tips of the input/output pins 3 attached to the semiconductor package 2 are connected to a wiring board 1 made of a multilayer board by silver brazing or the like. At this time, an appropriate gap 7 is secured between the semiconductor package 2 and the wiring board 1. Further, the wiring board 1 located at the bottom of the semiconductor package 2 is provided with a hole 6 that serves as a coolant passage.

FIG. 2 is a sectional view taken along the line ■-■ in FIG. 1. A hole 6, which serves as a passage for a cooling medium, is formed in the center of the surface of the wiring board 1 facing the semiconductor package 2.

During operation, heat generated in the semiconductor chip 4 is transferred to the solder balls 5 and the multilayer substrate 11, and then to the entire semiconductor package 2. Furthermore, it is transmitted to the input/output pin 3 and to the atmosphere. on the other hand.

The coolant sprayed directly onto the wiring board 1 flows into the gap 7 through the hole 6, exchanges heat with the back surface of the semiconductor package 2 and the circumferential surface of the output pin 3, and flows away from the wiring board 1. Through this series of steps, the semiconductor chip is effectively cooled.

FIG. 3 shows a semiconductor package 2 in which a plurality of coolant introduction holes 6 are provided. Similar to the embodiment described above, a refrigerant is injected onto the back surface of the wiring board 1 and introduced into the gap 7 to cause heat exchange between the back surface of the semiconductor package 2 and the circumferential surface of the input/output pins 3.

According to this embodiment, by providing a plurality of holes 6, the cooling efficiency is increased, and by making one large hole in the wiring board 1, the arrangement of the conductive layer in the wiring board 1 is restricted. It is possible to avoid this and secure the flow rate necessary for cooling.

FIG. 4 shows the embodiment shown in FIG. 1 in which cooling fins 8 are attached to the half-quad package 2. In FIG. In this embodiment, a refrigerant is injected onto the back surface of the wiring board 1 and introduced into the gap 7 to perform heat exchange on the back surface of the semiconductor package 2 and the circumferential surface of the input/output pins 3.
This is an example in which the cooling performance is further improved by removing the heat transferred to the top and side surfaces from the cooling fins 8.

FIG. 5 shows the number of people in the embodiment shown in FIG. 1.
Cooling fins 8A are provided at the base of the cooling fin 8A. In this way, the heat dissipation area around the input/output pin 3 becomes large, and the input/output pin 3 can be efficiently cooled by the refrigerant flowing through the gap 7.

In FIG. 6, diagonal holes 6A are bored in the wiring board 1, and a guide plate 9 is installed to help the cooling medium flow into the holes 6A. In this embodiment, by providing a guide plate 9 that helps the cooling medium flow, the wiring board l
Even when the cooling medium is flowing along the gap 7, the amount of cooling medium flowing into the gap 7 is ensured to perform efficient cooling.

This embodiment is effective when a large number of wiring boards 1 on which a large number of semiconductor packages 2 are mounted are installed in parallel, and a cooling medium supply device cannot be installed at a position facing the wiring boards 1.

〔Effect of the invention〕

As described above, according to the present invention, the semiconductor package and the input/output pins can be uniformly cooled, so that the cooling efficiency can be improved without increasing the amount of air. Furthermore, since the structure is simple, it is very advantageous in terms of cost and reliability.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a cooling mounting structure of a semiconductor device according to the present invention, FIG. 2 is a sectional view taken along line nn in FIG. 1, and FIGS. FIG. 7 is a cross-sectional view showing an embodiment of the present invention, and FIG. 7 is a cross-sectional view showing a conventional cooling mounting structure for a semiconductor device. 1... Wiring board, 2... Semiconductor package, 3...
・Input/output pin, 4...Semiconductor chip, 5...Solder ball, 6.6A...Hole, 7...Gap, 8,8A...
・Cooling fin, 9...Guide plate.

Claims (9)

[Claims] 1. A semiconductor package mounted with at least one semiconductor chip and having a large number of input/output pins is installed on a wiring board, a gap is formed between the semiconductor package and the wiring board, and a coolant is flowed into the gap. 1. A cooling mounting structure for a semiconductor device that cools the semiconductor chip using a cooling method, wherein a hole through which the coolant flows is formed in the wiring board so as to face the semiconductor package. 2. 2. The cooling mounting structure for a semiconductor device according to claim 1, wherein the hole is formed at a position facing substantially the center of the semiconductor package. 3. In the cooling mounting structure according to claim 1, a plurality of holes are formed, one hole facing a substantially central portion of the semiconductor package, and the other holes facing a peripheral portion of the semiconductor package. A cooling mounting structure for a semiconductor device characterized by being provided with each. 4. A semiconductor package mounted with at least one semiconductor chip and having a large number of input/output pins is installed on a wiring board, a gap is formed between the semiconductor package and the wiring board, and a coolant is flowed into the gap. A cooling mounting structure for a semiconductor device in which the semiconductor chip is cooled by cooling the semiconductor chip, characterized in that holes through which the coolant flows are formed in the wiring board so as to face the semiconductor package, and cooling fins are provided on the semiconductor package. Cooling mounting structure for semiconductor devices. 5. A semiconductor package mounted with at least one semiconductor chip and having a large number of input/output pins is installed on a wiring board, a gap is formed between the semiconductor package and the wiring board, and a coolant is flowed into the gap. In the cooling mounting structure of the semiconductor device, the hole through which the coolant flows is formed in the wiring board so as to face the semiconductor package, and cooling fins are provided at the base of the input/output pins of the semiconductor package. A cooling mounting structure for a semiconductor device, characterized in that it is provided with a cooling mounting structure for a semiconductor device. 6. A semiconductor package mounted with at least one semiconductor chip and having a large number of input/output pins is installed on a wiring board, a gap is formed between the semiconductor package and the wiring board, and a coolant is flowed into the gap. In the cooling mounting structure for a semiconductor device that cools the semiconductor chip using a cooling device, an oblique hole through which the coolant flows is formed in the wiring board so as to face the semiconductor package, and a guide for guiding the coolant to the hole. A cooling mounting structure for a semiconductor device characterized by forming a plate. 7. In the gap between the semiconductor package on which the semiconductor chip is mounted and the wiring board on which the semiconductor package is installed,
In a method for cooling a semiconductor device in which the semiconductor chip is cooled by flowing a refrigerant, the refrigerant is introduced to the input/output pin side of the semiconductor package through a hole formed in the wiring board, and the introduced refrigerant is A method for cooling a semiconductor device, characterized in that heat exchange is performed between the semiconductor chip and the refrigerant when the refrigerant flows through the gap. 8. In a method for cooling a semiconductor device in which the semiconductor chip is cooled by flowing a refrigerant into a gap between a semiconductor package on which the semiconductor package is mounted and a wiring board on which the semiconductor package is installed, the semiconductor package is cooled from above. The refrigerant is introduced into the input/output pin side of the semiconductor package by flowing the refrigerant, and when the introduced refrigerant flows through the gap, heat exchange is performed between the semiconductor chip and the refrigerant. A method for cooling a semiconductor device, characterized in that the refrigerant is then discharged through a hole formed in the wiring board. 9. A wiring board having at least one conductive layer and through-holes for input/output pins, in which a hole is bored to serve as a flow path for a cooling medium.