JPH0281759U - - Google Patents
Info
- Publication number
- JPH0281759U JPH0281759U JP15922888U JP15922888U JPH0281759U JP H0281759 U JPH0281759 U JP H0281759U JP 15922888 U JP15922888 U JP 15922888U JP 15922888 U JP15922888 U JP 15922888U JP H0281759 U JPH0281759 U JP H0281759U
- Authority
- JP
- Japan
- Prior art keywords
- soldering chip
- soldering
- color
- solder
- constituted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
図面は本考案の一実施例を示し、第１図は電気
半田こての分解斜視図、第２図はこて先チツプの
断面図である。
１……支持筒、３……ホルダ、４……こて先チ
ツプ、５……発熱体、６……取つ手、１５……銅
製基材、１６……鉄メツキ層、１７……半田メツ
キ層、１８……変色層、Ａ……色見本。
The drawings show an embodiment of the present invention; FIG. 1 is an exploded perspective view of an electric soldering iron, and FIG. 2 is a sectional view of the soldering iron tip. DESCRIPTION OF SYMBOLS 1...Support tube, 3...Holder, 4...Soldering tip, 5...Heating element, 6...Handle, 15...Copper base material, 16...Iron plating layer, 17...Solder Plated layer, 18... discoloration layer, A... color sample.
Claims (1)
田の略溶融温度の前後で色が変わる変色層で構成
したことを特徴とする半田用チツプ。 A soldering chip characterized in that at least a part of the outer surface of the soldering chip is constituted by a color-changing layer that changes color around the approximate melting temperature of the solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15922888U JPH0281759U (en) | 1988-12-07 | 1988-12-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15922888U JPH0281759U (en) | 1988-12-07 | 1988-12-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0281759U true JPH0281759U (en) | 1990-06-25 |
Family
ID=31440254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15922888U Pending JPH0281759U (en) | 1988-12-07 | 1988-12-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0281759U (en) |
-
1988
- 1988-12-07 JP JP15922888U patent/JPH0281759U/ja active Pending