JPH0282022U - - Google Patents
Info
- Publication number
- JPH0282022U JPH0282022U JP16204288U JP16204288U JPH0282022U JP H0282022 U JPH0282022 U JP H0282022U JP 16204288 U JP16204288 U JP 16204288U JP 16204288 U JP16204288 U JP 16204288U JP H0282022 U JPH0282022 U JP H0282022U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- chip
- wiring board
- main body
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010408 film Substances 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 2
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は本考案の一実施例のチツプ状電子部品
の斜視図、第２図はその電子部品本体の斜視図、
第３図は本考案の他の実施例のチツプ状電子部品
の斜視図である。第４図は従来例のチツプ状電子
部品の斜視図、第５図はその電子部品本体の構成
の説明に供する分解斜視図、第６図はチツプ状電
子部品の配線基板への取り付け状態の説明に供す
る側面図である。
１……チツプ状電子部品、２……電子部品本体
、３……厚膜電極、４……薄膜電極、５……電子
部品本体の端部、６……電子部品本体の中間部。
FIG. 1 is a perspective view of a chip-shaped electronic component according to an embodiment of the present invention, FIG. 2 is a perspective view of the main body of the electronic component,
FIG. 3 is a perspective view of a chip-shaped electronic component according to another embodiment of the present invention. FIG. 4 is a perspective view of a conventional chip-shaped electronic component, FIG. 5 is an exploded perspective view illustrating the structure of the electronic component body, and FIG. 6 is an explanation of how the chip-shaped electronic component is attached to a wiring board. FIG. DESCRIPTION OF SYMBOLS 1... Chip-shaped electronic component, 2... Electronic component main body, 3... Thick film electrode, 4... Thin film electrode, 5... End part of electronic component main body, 6... Middle part of electronic component main body.
Claims (1)
もに、その中間部の相対向する位置に薄膜電極を
設け、それらの電極を配線基板の配線パターンに
直接取り付けるようにしてなるチツプ状電子部品
において、 その電子部品本体の両端部の厚みをその中間部
よりも薄くし、その薄くした両端部に設けた厚膜
電極の少なくとも配線基板の配線パターンに接す
る面と中間部の電子部品本体面とが少なくとも配
線基板への取り付け面側において略同一平面に位
置するように構成したことを特徴とするチツプ状
電子部品。[Claim for Utility Model Registration] Thick film electrodes are provided at both ends of an electronic component body, and thin film electrodes are provided at opposite positions in the middle, and these electrodes are directly attached to the wiring pattern of a wiring board. In a chip-shaped electronic component, the thickness of both ends of the electronic component body is made thinner than the middle part, and at least the surface in contact with the wiring pattern of the wiring board and the middle part of the thick film electrode provided at the thinned both ends. What is claimed is: 1. A chip-shaped electronic component, characterized in that the chip-shaped electronic component is configured such that the main body surface of the electronic component and the main body surface of the electronic component are located substantially on the same plane at least on the side of a mounting surface to a wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16204288U JPH0282022U (en) | 1988-12-13 | 1988-12-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16204288U JPH0282022U (en) | 1988-12-13 | 1988-12-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0282022U true JPH0282022U (en) | 1990-06-25 |
Family
ID=31445512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16204288U Pending JPH0282022U (en) | 1988-12-13 | 1988-12-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0282022U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022125514A (en) * | 2021-02-17 | 2022-08-29 | 太陽誘電株式会社 | Ceramic electronic component, circuit board, and manufacturing method of ceramic electronic component |
| JP2022129066A (en) * | 2021-02-24 | 2022-09-05 | 株式会社村田製作所 | Multilayer ceramic capacitor |
-
1988
- 1988-12-13 JP JP16204288U patent/JPH0282022U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022125514A (en) * | 2021-02-17 | 2022-08-29 | 太陽誘電株式会社 | Ceramic electronic component, circuit board, and manufacturing method of ceramic electronic component |
| JP2022129066A (en) * | 2021-02-24 | 2022-09-05 | 株式会社村田製作所 | Multilayer ceramic capacitor |
| US12249465B2 (en) | 2021-02-24 | 2025-03-11 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor |