JPH0282083U - - Google Patents
Info
- Publication number
- JPH0282083U JPH0282083U JP16226388U JP16226388U JPH0282083U JP H0282083 U JPH0282083 U JP H0282083U JP 16226388 U JP16226388 U JP 16226388U JP 16226388 U JP16226388 U JP 16226388U JP H0282083 U JPH0282083 U JP H0282083U
- Authority
- JP
- Japan
- Prior art keywords
- board
- boards
- instrument
- density
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Multi-Conductor Connections (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の具体的実施例である高密度基
板実装構造計器の概要を示す図、第２図は従来の
航空計器等に用いられる高密度基板実装構造計器
の概要を示す図である。
１……計器外筐（ケース）、３，３ａ，３ｂ，
…３ｎ……電子回路基板（基板）、８……引出し
端子、９……バネ接点、１０……連絡基板、１１
……配線パターン。
Fig. 1 is a diagram showing an outline of a high-density board-mounted structured instrument that is a specific embodiment of the present invention, and Fig. 2 is a diagram showing an outline of a high-density board-mounted structured instrument used in conventional aviation instruments. . 1...Instrument outer casing (case), 3, 3a, 3b,
...3n...Electronic circuit board (board), 8...Output terminal, 9...Spring contact, 10...Connection board, 11
...Wiring pattern.
Claims (1)
た高密度基板実装構造計器において、前記筐体の
内壁に前記複数の基板間を連絡する電気導電性の
パターンが設けられた連絡基板が設けられ、前記
複数の基板の各基板の外周に他基板との電気的接
続をする為の引出し端子が設けられ、該引出し端
子の上に電気導電性を有し前記連絡基板のパター
ンに接触するバネ接点が配置され、前記連絡基板
のパターンを介して前記複数の基板間が電気的接
続されて成ることを特徴とする高密度基板実装構
造計器。 In an instrument with a high-density board mounting structure in which a plurality of boards are mounted and arranged in a high-density arrangement in an instrument housing, a connecting board is provided on an inner wall of the housing, and a connecting board is provided with an electrically conductive pattern that connects the plurality of boards. , a lead-out terminal for making an electrical connection with another board is provided on the outer periphery of each board of the plurality of boards, and a spring contact having electrical conductivity and contacting the pattern of the connection board is provided on the lead-out terminal. A high-density board-mounted structure instrument, characterized in that the plurality of boards are electrically connected through the pattern of the connection board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16226388U JPH0282083U (en) | 1988-12-14 | 1988-12-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16226388U JPH0282083U (en) | 1988-12-14 | 1988-12-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0282083U true JPH0282083U (en) | 1990-06-25 |
Family
ID=31445932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16226388U Pending JPH0282083U (en) | 1988-12-14 | 1988-12-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0282083U (en) |
-
1988
- 1988-12-14 JP JP16226388U patent/JPH0282083U/ja active Pending
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