JPH0282111U - - Google Patents
Info
- Publication number
- JPH0282111U JPH0282111U JP16141088U JP16141088U JPH0282111U JP H0282111 U JPH0282111 U JP H0282111U JP 16141088 U JP16141088 U JP 16141088U JP 16141088 U JP16141088 U JP 16141088U JP H0282111 U JPH0282111 U JP H0282111U
- Authority
- JP
- Japan
- Prior art keywords
- frequency circuit
- cylinder
- contact
- circuit board
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例の縦断面図、第２図
ａ及びｂは第２円筒の正面図及び底面図、第３図
は従来の高周波接続構造の縦断面図である。
１……パツケージ、２……入出力ピン、３……
接地金属板、４……貫通穴、５……外部高周波回
路基板、６……接地導体、７……配線導体、８…
…第１円筒、８ａ……テーパ面、９……第２円筒
、９ａ……テーパ面、９ｂ……スリツト。
FIG. 1 is a longitudinal sectional view of an embodiment of the present invention, FIGS. 2a and 2b are front and bottom views of a second cylinder, and FIG. 3 is a longitudinal sectional view of a conventional high frequency connection structure. 1...Package, 2...I/O pin, 3...
Ground metal plate, 4... Through hole, 5... External high frequency circuit board, 6... Ground conductor, 7... Wiring conductor, 8...
...first cylinder, 8a...tapered surface, 9...second cylinder, 9a...tapered surface, 9b...slit.
Claims (1)
部高周波回路基板を配置し、該金属接地板に開設
した貫通穴に入出力ピンを挿通させて前記高周波
回路パツケージと外部高周波回路基板とを電気接
続する構造において、前記貫通穴内には導電部材
からなる第１円筒と第２円筒を同心位置に内装し
、一方の円筒の端面をパツケージの底面に接触さ
せ、他方の円筒の端面を外部高周波回路基板の接
地導体に接触させ、かつ各円筒に形成したテーパ
面を相互に当接させて歪み力によつて両円筒に軸
方向外側に向けての力が作用するように構成した
ことを特徴とする高周波回路接続構造。 A structure in which a high-frequency circuit package and an external high-frequency circuit board are arranged with a metal grounding plate in between, and input/output pins are inserted through through holes formed in the metal grounding plate to electrically connect the high-frequency circuit package and the external high-frequency circuit board. In the through hole, a first cylinder and a second cylinder made of a conductive member are installed concentrically, the end surface of one cylinder is brought into contact with the bottom surface of the package, and the end surface of the other cylinder is connected to the ground of the external high frequency circuit board. A high frequency circuit characterized in that the tapered surfaces formed on each cylinder are brought into contact with a conductor and are in contact with each other so that a force is applied axially outward to both cylinders due to strain force. Connection structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16141088U JPH0282111U (en) | 1988-12-13 | 1988-12-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16141088U JPH0282111U (en) | 1988-12-13 | 1988-12-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0282111U true JPH0282111U (en) | 1990-06-25 |
Family
ID=31444319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16141088U Pending JPH0282111U (en) | 1988-12-13 | 1988-12-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0282111U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023068775A (en) * | 2021-11-04 | 2023-05-18 | 新光電気工業株式会社 | Metal parts and ceramic substrates |
-
1988
- 1988-12-13 JP JP16141088U patent/JPH0282111U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023068775A (en) * | 2021-11-04 | 2023-05-18 | 新光電気工業株式会社 | Metal parts and ceramic substrates |