JPH0282207A - Production of light emitting element connector - Google Patents

Production of light emitting element connector

Info

Publication number
JPH0282207A
JPH0282207A JP23358188A JP23358188A JPH0282207A JP H0282207 A JPH0282207 A JP H0282207A JP 23358188 A JP23358188 A JP 23358188A JP 23358188 A JP23358188 A JP 23358188A JP H0282207 A JPH0282207 A JP H0282207A
Authority
JP
Japan
Prior art keywords
joint
laser
light emitting
lens holder
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23358188A
Other languages
Japanese (ja)
Inventor
Hiroatsu Aoki
青木 弘淳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP23358188A priority Critical patent/JPH0282207A/en
Publication of JPH0282207A publication Critical patent/JPH0282207A/en
Pending legal-status Critical Current

Links

Landscapes

  • Optical Couplings Of Light Guides (AREA)

Abstract

PURPOSE:To enhance welding joint strength without increasing laser output and to decrease welding points by forming recesses to respective joint parts and irradiating the recesses with a laser, thereby welding the joint parts. CONSTITUTION:The V-shaped recesses 5 are formed to the peripheral part at the top end of a laser releasing end 11 and the peripheral part of the joint surfaces of the joint part 2a of the laser releasing end 11 and a lens holder 2. The joint part 2a of the lens holder 2 is thereafter superposed on the laser releasing end 11. The recesses 5 are thereafter formed similarly to the peripheral part of the respective joint parts. These recesses 5 are irradiated with the laser. Since the surface area of the joint part subjected to the irradiation of the layer is widened in this way, the joint strength is improved. The strength to torsion and bend in particular is increased.

Description

【発明の詳細な説明】 〔概要〕 発光素子コンネクタの製造方法の改良に関し、特に、発
光素子コンネクタ製造工程において使用されるレーザ溶
接方法の改良に関し、 レーザ出力を増加することなく溶接接合強度を高め、そ
の結果、溶接個所を減少することを可能とし、さらには
、接合部の周辺部各個所の溶接を均等に行って被溶接部
材に歪みが生ずることのない発光素子コンネクタの製造
方法を提供することを目的とし、 発光素子の光放出端部と、レンズホルダと、中子ホルダ
と、光ファイバーとをレーザ溶接してなす発光素子コン
ネクタの製造方法において、前記光放出端部の上端部と
前記光放出端部と前記レンズホルダとの接合部の下端部
との周辺部と、前記レンズホルダの上端部と前記レンズ
ホルダと前記中子ホルダとの接合部の下端部との周辺部
と、前記中子ホルダの上端部と前記中子ホルダと前記光
ファイバーとの接合部の周辺部とに、凹部を形成し、該
凹部に対してレーザを照射して、前記光放出端部と前記
光放出端部と前記レンズホルダとの接合部と、前記レン
ズホルダと前記レンズホルダと前記中子ホルダとの接合
部と、前記中子ホルダと前記中子ホルダと前記光ファイ
バーとを、それぞれ、溶接して接続する工程をもって構
成される。
[Detailed Description of the Invention] [Summary] The present invention relates to an improvement in the manufacturing method of a light emitting device connector, and in particular, to an improvement in a laser welding method used in the manufacturing process of a light emitting device connector, to increase the strength of the welded joint without increasing the laser output. As a result, it is possible to reduce the number of welding points, and furthermore, to provide a method for manufacturing a light emitting element connector in which the welding is carried out evenly at various points around the joint part, so that distortion does not occur in the welded parts. A method for manufacturing a light emitting element connector in which a light emitting end of a light emitting element, a lens holder, a core holder, and an optical fiber are welded together by laser welding, wherein an upper end of the light emitting end and the light emitting element are welded together. a periphery between the lower end of the joint between the emission end and the lens holder; a periphery between the upper end of the lens holder and the lower end of the joint between the lens holder and the core holder; A recess is formed in the upper end of the child holder and the peripheral part of the joint between the core holder and the optical fiber, and the recess is irradiated with a laser to form the light emitting end and the light emitting end. and a joint between the lens holder and the lens holder, a joint between the lens holder, the lens holder, and the core holder, and a joint between the core holder, the core holder, and the optical fiber by welding and connecting, respectively. It is composed of processes.

(産業上の利用分野) 本発明は、発光素子コンネクタの製造方法の改良に関す
る。特に、発光素子コンネクタ製造工程において使用さ
れるレーザ溶接方法の改良に関する。
(Industrial Application Field) The present invention relates to an improvement in a method for manufacturing a light emitting device connector. In particular, the present invention relates to improvements in laser welding methods used in the manufacturing process of light emitting device connectors.

〔従来の技術] 従来技術に係る発光素子コンネクタの製造方法について
図を参照して説明する。
[Prior Art] A method of manufacturing a light emitting device connector according to a prior art will be described with reference to the drawings.

第3図参照 図は発光素子コンネクタの1例としての半導体レーザコ
ンネクタの構造を示しており、1は発光素子の1例とし
ての半導体レーザであり、11は光放出端部の1例とし
てのレーザ放出端部であり、2はレンズホルダであり、
3は中子ホルダであり、4は光ファイバーである。
The reference figure in FIG. 3 shows the structure of a semiconductor laser connector as an example of a light emitting element connector, where 1 is a semiconductor laser as an example of a light emitting element, and 11 is an example of a light emitting end. 2 is a laser emitting end, and 2 is a lens holder;
3 is a core holder, and 4 is an optical fiber.

半導体レーザ1から放出されるレーザビームが、レーザ
放出端部11を介して光ファイバー4に入射する入射量
が最大となるように、レーザ放出端部11とレンズホル
ダ2と中子ホルダ3と光ファイバー4との相対位置関係
を整合した後、半導体レーザ1のレーザ放出端部11の
上端部とレーザ放出端部11とレンズホルダ2との接合
部2aの下端部との周辺部の複数個所と、レンズホルダ
2の上端部とレンズホルダ2と中子ホルダ3との接合部
3aの下端部との周辺部の複数個所と、中子ホルダ3の
上端部と中子ホルダ3と光ファイバー4との接合部の周
辺部の複数個所とに、それぞれ、YAGレーザ等のレー
ザを照射して溶接する。溶接接合強度を高めるためには
、レーザの出力を高めるか、溶接個所を多くすることが
存効である。
The laser emitting end 11, the lens holder 2, the core holder 3, and the optical fiber 4 are arranged so that the amount of laser beam emitted from the semiconductor laser 1 entering the optical fiber 4 via the laser emitting end 11 is maximized. After adjusting the relative positional relationship between the semiconductor laser 1 and the lens holder 2, the lens Multiple locations around the upper end of the holder 2 and the lower end of the joint 3a between the lens holder 2 and core holder 3, and the joint between the upper end of the core holder 3, the core holder 3, and the optical fiber 4. Welding is performed by irradiating a laser such as a YAG laser to a plurality of locations around the periphery. In order to increase the strength of welded joints, it is effective to increase the laser output or increase the number of welded parts.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

ところで、微細な部材をレーザ溶接する場合に、レーザ
出力を高めて溶接接合強度を高めようとすると、微細な
被溶接部材そのものが変形したり、熔融してしまうため
、レーザ出力を高めるには限界がある。また、溶接個所
を多くして溶接接合強度を高めようとしても、被溶接部
材を溶接のために相互に固定する治具等がレーザ照射の
障害となって溶接個所を増加できない場合が多く、仮に
増加できたとしても製造工数が増加して経済的負担が増
すという不利益をともなう、また、二つの被溶接部材の
接合面に正確にレーザのビームスポットを照射すること
は、現実的に難しく、ビームスポットの中心が接合面か
らいずれかの方向にずれることが多い、この結果、接合
部周辺部の各溶接個所における被溶接部材の溶融量にイ
ンバランスが生ずるため、溶融した被溶接部材が冷却固
化する時不可避的に発生する収縮量にもインバランスが
生じて被溶接部材に歪みを生ずる。
By the way, when laser welding minute parts, if you try to increase the laser output to increase the weld joint strength, the minute parts to be welded will deform or melt, so there is a limit to increasing the laser output. There is. In addition, even if we try to increase the strength of welded joints by increasing the number of welding points, it is often impossible to increase the number of welding points because the jigs that fix the parts to be welded to each other for welding interfere with laser irradiation. Even if it were possible to increase the number of welded parts, it would have the disadvantage of increasing manufacturing man-hours and increasing the economic burden.Also, it is practically difficult to accurately irradiate the joining surface of two welded parts with the laser beam spot. The center of the beam spot often deviates from the welding surface in one direction or the other, resulting in an imbalance in the amount of melted workpiece at each welding point around the joint, causing the melted workpiece to cool down. An imbalance also occurs in the amount of shrinkage that inevitably occurs during solidification, causing distortion in the welded member.

本発明の目的は、これらの欠点を解消することにあり、
レーザ出力を増加することなく溶接接合強度を高め、そ
の結果、溶接個所を減らすことを可能とし、さらには、
接合部の周辺部各個所の溶接を均等に行って被溶接部材
に歪みを生ずることのない発光素子コンネクタの製造方
法を提供することにある。
The purpose of the present invention is to eliminate these drawbacks,
It is possible to increase the strength of the welded joint without increasing the laser power, and as a result, it is possible to reduce the number of welding points, and furthermore,
It is an object of the present invention to provide a method for manufacturing a light emitting element connector in which each part of the peripheral part of a joint part is uniformly welded so that distortion is not caused in a member to be welded.

〔課題を解決するための手段〕[Means to solve the problem]

上記の目的は、発光素子(1)の光放出端部(11)と
、レンズホルダ(2)と、中子ホルダ(3)と、光ファ
イバー(4)とをレーザ溶接してなす発光素子コンネク
タの製造方法において、前記光放出端部(11)の上端
部と前記光放出端部(11)と前記レンズホルダ(2)
との接合部(2a)の下端部との周辺部と、前記レンズ
ホルダ(2)の上端部と前記レンズホルダ(2)と前記
中子ホルダ(3)との接合部(3a)の下端部との周辺
部と、前記中子ホルダ(3)の上端部と前記中子ホルダ
(3)と前記光ファイバー(4)との接合部の周辺部と
に、凹部(5)を形成し、該凹部(5)に対してレーザ
を照射して、前記光放出端部(11)と前記光放出端部
(11)と前記レンズホルダ(2)との接合部(2a)
と、前記レンズホルダ(2)と前記レンズホルダ(2)
と前記中子ホルダ(3)との接合部(3a)と、前記中
子ホルダ(3)と前記中子ホルダ(3)と前記光ファイ
バー(4)とを、それぞれ、溶接して接続する工程を存
する発光素子コンネクタの製造方法によって達成される
The above purpose is to create a light emitting element connector which is formed by laser welding the light emitting end (11) of the light emitting element (1), the lens holder (2), the core holder (3) and the optical fiber (4). In the manufacturing method, an upper end of the light emitting end (11), the light emitting end (11), and the lens holder (2)
The peripheral part of the lower end of the joint (2a) with the lens holder (2), the lower end of the joint (3a) between the upper end of the lens holder (2) and the lens holder (2) and the core holder (3) A recess (5) is formed in the peripheral part of the core holder (3) and the peripheral part of the upper end of the core holder (3) and the joint part of the core holder (3) and the optical fiber (4), (5) by irradiating a laser to the light emitting end (11) and the joint (2a) between the light emitting end (11) and the lens holder (2).
and the lens holder (2) and the lens holder (2).
and the step of welding and connecting the joint portion (3a) between the core holder (3), the core holder (3), the core holder (3), and the optical fiber (4), respectively. This is achieved by the existing method for manufacturing a light emitting device connector.

〔作用] 第2図参照 図はレーザ溶接部における母材の溶融後の固化状態を示
し、左半部は接合部の周辺部に凹部を設けない従来のレ
ーザ溶接方法により溶接した結果を示し、右半部は凹部
を設けた本発明に係る発光素子コンネクタの製造方法に
おいて使用されるレーザ溶接方法により溶接した結果を
示す。
[Function] The figure shown in Fig. 2 shows the solidified state of the base metal after melting in the laser welded part, and the left half shows the result of welding by a conventional laser welding method that does not provide a recess around the joint part, The right half shows the result of welding by the laser welding method used in the method for manufacturing a light emitting device connector according to the present invention provided with a recessed portion.

本発明に係る発光素子コンネクタの製造方法においては
、各接合部の周辺部に凹部5を形成し、この凹部5に対
してレーザを照射するので、凹部を形成しない従来の方
法に比べて、レーザの照射を受ける接合部の表面積が広
くなる。この結果、同じ出力のレーザを照射しても接合
部の母材の溶融する領域が増加し、これが固化して形成
される溶接接合面積は、第2図右半部に示すように、第
2図左半部に示す従来の方法による場合に比べて増大し
、接合強度が向上する。特に、ねじりや曲げに対する強
度が増大する。また、レーザによる被溶接部材の溶融固
化が、接合部周辺部に形成された凹部内でなされるので
、溶融固化した金属が被溶接部材の表面に突出すること
はない、また、接合部の周辺部に形成された凹部5にレ
ーザのビームスポットを正確に位置合わせすることば比
較的容易であるので、接合部の周辺各個所の溶接は均等
になされて、被溶接部材に歪みを生ずることはない。
In the method for manufacturing a light emitting device connector according to the present invention, a recess 5 is formed in the peripheral part of each joint, and the recess 5 is irradiated with laser, so compared to the conventional method in which no recess is formed, the laser The surface area of the joint exposed to irradiation is increased. As a result, even if the laser beam of the same output is irradiated, the area in which the base metal of the joint part melts increases, and the area of the welded joint formed by solidifying this increases, as shown in the right half of Figure 2. The bonding strength is increased compared to the conventional method shown in the left half of the figure, and the bonding strength is improved. In particular, the strength against twisting and bending is increased. In addition, since the laser melts and solidifies the parts to be welded within the recess formed around the joint, the melted and solidified metal does not protrude onto the surface of the parts to be welded. It is relatively easy to accurately align the laser beam spot with the recess 5 formed in the joint, so welding is done evenly at various points around the joint, and no distortion occurs in the welded parts. .

〔実施例〕〔Example〕

以下、図面を参照しつ一1本発明の一実施例に係る発光
素子コンネクタの1例としてのレーザコンネクタの製造
方法について説明する。
Hereinafter, a method for manufacturing a laser connector as an example of a light emitting device connector according to an embodiment of the present invention will be described with reference to the drawings.

第1b図、第1C図参照 第1b図は、レーザ放出端部11とレンズホルダ2とを
レンズホルダ2の接合部2aを介して重ねた状態の断面
図であり、第1C図は、レーザ放出端部11をレンズホ
ルダ2の側から見た平面図である。
See Figures 1b and 1C. Figure 1b is a sectional view of the laser emitting end 11 and lens holder 2 stacked together via the joint 2a of the lens holder 2, and Figure 1C is a cross-sectional view of the laser emitting end 11 and the lens holder 2, which are stacked together via the joint 2a of the lens holder 2. FIG. 3 is a plan view of the end portion 11 viewed from the lens holder 2 side.

レーザ放出端部11の上端部の周辺部とレーザ放出端部
11とレンズホルダ2との接合部2aの接合面の周辺部
とに、図に示す1字状の凹部5を例えば4個形成する。
For example, four character-shaped recesses 5 as shown in the figure are formed in the periphery of the upper end of the laser emission end 11 and the periphery of the joint surface of the joint 2a between the laser emission end 11 and the lens holder 2. .

形成する1字状の凹部5の数は、この接合面の大きさ等
によって選定される。その後、レンズホルダ2の接合部
2aがレーザ放出端部11と重ね合わせられる。以下同
様に、レンズホルダ2の上端部の周辺部とレンズホルダ
2と中子ホルダ3との接合部3aの接合面の周辺部とに
v字状の凹部5を形成して、レンズホルダ2と中子ホル
ダ3とを重ね合わせ、次いで、中子ホルダ3の上端部の
周辺部と光ファイバー4との接合面の周辺部とに、それ
ぞれ、1字状の凹部5を形成して中子ホルダ3の上端部
の周辺部と光ファイバー4と重ね合わせる。
The number of single-shaped recesses 5 to be formed is selected depending on the size of this joint surface, etc. Thereafter, the joint portion 2a of the lens holder 2 is overlapped with the laser emission end portion 11. Similarly, a V-shaped recess 5 is formed in the periphery of the upper end of the lens holder 2 and the periphery of the joint surface of the joint 3a between the lens holder 2 and the core holder 3. The core holder 3 is overlapped with the core holder 3, and then a single-shaped recess 5 is formed in the periphery of the upper end of the core holder 3 and the periphery of the joint surface with the optical fiber 4, respectively. The peripheral part of the upper end of the optical fiber 4 is overlapped with the optical fiber 4.

第1a図参照 図は、上記工程を経て組み立てられたレーザコンネクタ
の組み立て図である。1は半導体レーザであり、11は
レーザ放出端部であり、2は集束レンズ等を保持するレ
ンズホルダであり、2aはレンズホルダ2をレーザ放出
端部11に接合する接合部であり、3は中子ホルダであ
り、3aは中子ホルダ3をレンズホルダ2に接合する接
合部であり、4は光ファイバーである。レーザ放出端部
11の周辺部とレンズホルダ2の接合部2aの周辺部と
、レンズホルダ2の周辺部と中子ホルダ3の接合部3a
の周辺部と、中子ホルダ3の周辺部と光ファイバー4の
周辺部とに、それぞれ、第1b図、第1c図に示す凹部
5と同様の凹部(図示せず)が形成されている。半導体
レーザ1に電圧を印加して、その発生するレーザビーム
の光ファイバー4への入射量が最大となるように、半導
体レーザ1のレーザ放出端部11とレンズホルダ2と中
子ホルダ3と光ファイバー4との相対位置を整合した後
、前記の各凹部5に例えばYAGレーザ等のレーザを照
射して、上記の各部材を溶接する。
The drawing referred to in FIG. 1a is an assembled view of the laser connector assembled through the above steps. 1 is a semiconductor laser, 11 is a laser emission end, 2 is a lens holder that holds a focusing lens, etc., 2a is a joint that joins the lens holder 2 to the laser emission end 11, and 3 is a It is a core holder, 3a is a joining part which joins the core holder 3 to the lens holder 2, and 4 is an optical fiber. The peripheral part of the laser emission end 11 and the peripheral part of the joint 2a of the lens holder 2, and the peripheral part of the lens holder 2 and the joint 3a of the core holder 3.
Recesses (not shown) similar to the recesses 5 shown in FIGS. 1b and 1c are formed in the periphery of the core holder 3 and the optical fiber 4, respectively. A voltage is applied to the semiconductor laser 1, and the laser emitting end 11 of the semiconductor laser 1, the lens holder 2, the core holder 3, and the optical fiber 4 are connected so that the amount of the generated laser beam incident on the optical fiber 4 is maximized. After aligning their relative positions, each of the recesses 5 is irradiated with a laser such as a YAG laser to weld the members together.

第1d図参照 なお、各接合部の周辺部に形成される凹部5の形状は、
前記のv字状の形状に限定されるものではなく、例えば
第1d図に示す矩形状としてもよい。
Refer to FIG. 1d. The shape of the recess 5 formed around each joint is as follows:
The shape is not limited to the V-shape described above, but may be a rectangular shape as shown in FIG. 1d, for example.

〔発明の効果] 以上説明せるとおり、本発明に係る発光素子コンネクタ
の製造方法においては、発光素子の光放出端部と、レン
ズホルダと、中子ホルダと、光ファイバーとをレーザ溶
接してなす発光素子コンネクタの製造方法において、前
記光放出端部の上端部と前記光放出端部と前記レンズホ
ルダとの接合部の下端部との周辺部と、前記レンズホル
ダの上端部と前記レンズホルダと前記中子ホルダとの接
合部の下端部との周辺部と、前記中子ホルダの上端部と
前記中子ホルダと前記光ファイバーとの接合部の周辺部
とに、凹部を形成し、該凹部に対してレーザを照射して
、前記光放出端部と前記光放出端部と前記レンズホルダ
との接合部と、前記レンズホルダと前記レンズホルダと
前記中子ホルダとの接合部と、前記中子ホルダと前記中
子ホルダと前記光ファイバーとを、それぞれ、溶接して
接続するので、溶接接合面積が増大し、レーザ出力を増
加しなくても接合強度を高くすることができる。その結
果、溶接個所を従来より減らすことが可能となり、経済
的利益を高めることができる。
[Effects of the Invention] As explained above, in the method for manufacturing a light emitting element connector according to the present invention, light emission is achieved by laser welding the light emitting end of the light emitting element, the lens holder, the core holder, and the optical fiber. In the method for manufacturing an element connector, a peripheral portion between an upper end of the light emitting end and a lower end of a joint between the light emitting end and the lens holder, an upper end of the lens holder, the lens holder, and the A recess is formed in the periphery of the lower end of the joint with the core holder, the upper end of the core holder, and the periphery of the joint between the core holder and the optical fiber; irradiate the laser with a laser beam to remove the joint between the light emitting end, the light emitting end, and the lens holder, the joint between the lens holder, the lens holder, and the core holder, and the core holder. Since the core holder and the optical fiber are connected by welding, the welded joint area increases and the joint strength can be increased without increasing the laser output. As a result, it is possible to reduce the number of welding locations compared to the conventional method, thereby increasing economic benefits.

また、この凹部にレーザのビームスポットを正確に合わ
せることは容易であるから、そのため、接合部の周辺部
各個所の溶接を均等に行うことができるので、溶接後に
被溶接部材に歪みを生ずることがない。
Additionally, since it is easy to precisely align the laser beam spot with this recess, it is possible to weld evenly at each location around the joint, which eliminates distortion in the welded parts after welding. There is no.

【図面の簡単な説明】[Brief explanation of the drawing]

第1a図は、本発明の一実施例に係るレーザコンネクタ
の組立図である。 第1b図は、本発明の一実施例に係るレーザコンネクタ
のレーザ放出端部とレンズホルダの接合部との接合面に
形成される凹部を示す断面図である。 第1c図は、本発明の一実施例に係るレーザコンネクタ
のレーザ放出端部に形成される凹部を示す平面図である
。 第1d図は、本発明の一実施例に係るレーザコンネクタ
のレーザ放出端部とレンズホルダの接合部との接合面に
形成される凹部の改変例を示す断面図である。 第2図は、レーザ溶接部の母材溶は込み状況の本発明と
従来技術との比較図である。 第3図は、従来技術に係るレーザコンネクタの組立図で
ある。 l ・ ・ 11・ ・ 2 ・ ・ 2a ・ 3 ・ ・ 3a ・ 4 ・ ・ 5 ・ ・ 発光素子(半導体レーザ)、 レーザ放出端部、 レンズホルダ、 レンズホルダの接合部、 中子ホルダ、 中子ホルダの接合部、 光ファイバー 凹部。
FIG. 1a is an assembled view of a laser connector according to an embodiment of the present invention. FIG. 1b is a sectional view showing a recess formed in the joint surface between the laser emitting end of the laser connector and the joint of the lens holder according to an embodiment of the present invention. FIG. 1c is a plan view showing a recess formed in a laser emitting end of a laser connector according to an embodiment of the present invention. FIG. 1d is a sectional view showing a modified example of a recess formed in the joint surface between the laser emitting end of the laser connector and the joint of the lens holder according to an embodiment of the present invention. FIG. 2 is a comparison diagram of the base metal weld penetration state of the laser welded part between the present invention and the prior art. FIG. 3 is an assembly diagram of a laser connector according to the prior art. l ・ ・ 11 ・ 2 ・ ・ 2a ・ 3 ・ ・ 3a ・ 4 ・ ・ 5 ・ ・ Light emitting element (semiconductor laser), laser emission end, lens holder, lens holder joint, core holder, core holder junction, optical fiber recess.

Claims (1)

【特許請求の範囲】 発光素子(1)の光放出端部(11)と、レンズホルダ
(2)と、中子ホルダ(3)と、光ファイバー(4)と
をレーザ溶接してなす発光素子コンネクタの製造方法に
おいて、 前記光放出端部(11)の上端部と前記光放出端部(1
1)と前記レンズホルダ(2)との接合部(2a)の下
端部との周辺部と、前記レンズホルダ(2)の上端部と
前記レンズホルダ(2)と前記中子ホルダ(3)との接
合部(3a)の下端部との周辺部と、前記中子ホルダ(
3)の上端部と前記中子ホルダ(3)と前記光ファイバ
ー(4)との接合部の周辺部とに、凹部(5)を形成し
、該凹部(5)に対してレーザを照射して、前記光放出
端部(11)と前記光放出端部(11)と前記レンズホ
ルダ(2)との接合部(2a)と、前記レンズホルダ(
2)と前記レンズホルダ(2)と前記中子ホルダ(3)
との接合部(3a)と、前記中子ホルダ(3)と前記中
子ホルダ(3)と前記光ファイバー(4)とを、それぞ
れ、溶接して接続する工程を有する ことを特徴とする発光素子コンネクタの製造方法。
[Claims] A light emitting element connector formed by laser welding a light emitting end (11) of a light emitting element (1), a lens holder (2), a core holder (3), and an optical fiber (4). In the manufacturing method, the upper end of the light emitting end (11) and the light emitting end (1
1) and the lower end of the joint (2a) of the lens holder (2), and the upper end of the lens holder (2), the lens holder (2), and the core holder (3). The periphery of the lower end of the joint (3a) and the core holder (
3) forming a recess (5) in the upper end and a peripheral part of the joint between the core holder (3) and the optical fiber (4), and irradiating the recess (5) with a laser; , the light emitting end (11), the joint (2a) between the light emitting end (11) and the lens holder (2), and the lens holder (
2), the lens holder (2), and the core holder (3)
A light emitting element comprising the step of welding and connecting a joint portion (3a) with a core holder (3), a core holder (3), and an optical fiber (4), respectively. How to manufacture the connector.
JP23358188A 1988-09-20 1988-09-20 Production of light emitting element connector Pending JPH0282207A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23358188A JPH0282207A (en) 1988-09-20 1988-09-20 Production of light emitting element connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23358188A JPH0282207A (en) 1988-09-20 1988-09-20 Production of light emitting element connector

Publications (1)

Publication Number Publication Date
JPH0282207A true JPH0282207A (en) 1990-03-22

Family

ID=16957311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23358188A Pending JPH0282207A (en) 1988-09-20 1988-09-20 Production of light emitting element connector

Country Status (1)

Country Link
JP (1) JPH0282207A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62187807A (en) * 1986-02-14 1987-08-17 Matsushita Electric Ind Co Ltd Receiving/emitting module
JPS62217212A (en) * 1986-03-19 1987-09-24 Mitsubishi Electric Corp Semiconductor laser module for optical communication

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62187807A (en) * 1986-02-14 1987-08-17 Matsushita Electric Ind Co Ltd Receiving/emitting module
JPS62217212A (en) * 1986-03-19 1987-09-24 Mitsubishi Electric Corp Semiconductor laser module for optical communication

Similar Documents

Publication Publication Date Title
US4794231A (en) Method of and arrangement for laser welding
JPS6240180B2 (en)
TWI623177B (en) Induction motor rotor and method of manufacturing same
CN107671420A (en) The method for laser welding of lenticular wire
JP7512950B2 (en) Laser Welding Method
CN114824672B (en) Preparation method of battery module and battery module
JPH0282207A (en) Production of light emitting element connector
JP2834901B2 (en) Method for manufacturing stem for semiconductor laser device
JPH04253587A (en) laser processing equipment
JPH01137204A (en) Sleeve for optical semiconductor coupler and its welding and fixing method
JPH028241Y2 (en)
JPH0375710A (en) Optical semiconductor device and production thereof
JPH03127476A (en) Connecting method of flat cable and connector
JPH01161207A (en) Semiconductor light receiving/emitting device
JPS63155110A (en) Optical coupling device and its manufacture
JPS6238781A (en) Joining method with high density heat source beam
JP2000071334A (en) Method and apparatus for welding resin members
JPH01225909A (en) Optical coupler
KR100456969B1 (en) Hybrid Welding method using Laser Welding and Arc Welding
JPS63137594A (en) Laser welding structure
JPH02303690A (en) Method for joining contact point material
JPH08150488A (en) Welding method of wire and forming jig for welding
JPS59127984A (en) Removing method of coating of lead wire with laser
JPS63163416A (en) Manufacture of optical semiconductor device
JPS63223723A (en) Structure for fixing photosemiconductor collimator