JPH0282644A - Semiconductor device - Google Patents

Abstract

PURPOSE:To lighten a semiconductor device, and to improve its heat dissipation by sealing and molding a semiconductor chip by the use of a resin sealant using hollow fine solid granular bodies composed of an insulating material having thermal conductivity as fillers. CONSTITUTION:Hollow fine solid granular bodies 23 consisting of an insulating material having excellent thermal conductivity are mixed into a resin sealing section 22 as fillers. Hollow spheres, etc., which are made up of the insulating material of a composition containing an silicon oxide and an aluminum oxide and outside diameters of which are brought to 10-180mumphi and apparent density of which is brought to approximately 0.7-0.8g/cm<3>, can be employed as the fillers. It is proper that the fillers are kept within the range of 46-69vol.% and a high molecular material within the range of 31-54vol.% at the composition ratio of the fillers and the high molecular material composed of an epoxy resin, a curing material, etc. Accordingly, the resin sealing section is lightened, and excellent heat-dissipation characteristics can be maintained.

Description

DETAILED DESCRIPTION OF THE INVENTION (Summary) The present invention relates to an improvement of a plastic type semiconductor device by reducing its weight and preventing the semiconductor device from colliding with the packaging material during handling or transportation. The purpose is to provide a semiconductor device with less deformation and damage to the outer leads and good heat dissipation when the semiconductor devices collide with each other or when they collide with each other. The device comprises a semiconductor device in which a semiconductor chip is encapsulated with a resin sealant using hollow microscopic solid particles as a filler.

[Industrial application field]

The present invention relates to improvements in semiconductor devices. In particular, the present invention relates to improvements in semiconductor devices mounted in plastic-type packages sealed with epoxy sealants.

BACKGROUND OF THE INVENTION A partially cut-away perspective view of a conventional plastic package is shown in FIG. 4, and is manufactured as described below. First, as shown in Fig. 5, a semiconductor chip (3) is mounted on a guide stage (2) of a sheet-shaped lead frame (1) made of 42 alloy material, copper material, etc. using gold-silicon, silver paste, solder, etc. Then, the bonding pad (4) of the semiconductor chip (3) and the inner lead (5) of the lead frame (1) are connected using gold wire>copper wire, etc. Connect by wire bonding.

Next, using an epoxy sealant, molding is performed by a low pressure transfer method to perform resin sealing.

The figure shows a state in which the resin sealing part (20) is partially cut. Here, the epoxy sealant is usually number/nΦ~1
Quartz (silicon oxide) particles with particle size of oanΦ 60 to 8
Polymer material 2 consisting of 0% by weight (46-69% by volume), epoxy resin, curing agent, catalyst, mold release agent, nonflammable agent, pigment, etc.
0 to 40% by weight (31 to 54% by volume) are mixed and kneaded at a predetermined temperature for a predetermined time, and this is compression molded into a cylindrical shape as an intermediate product called a so-called B-stage. be.

The quartz particles are fused silica and have an amorphous shape.

Next, exterior solder plating is applied to the outer lead portion shown in (6) of FIG. 6, and then the tie bar (7) and the outer lead are cut to a predetermined size to complete the package structure shown in FIG. 4. Quartz particles (21) are mixed into the resin sealing part (20) of this package.

Next, the product name and other information are stamped on the surface of the pancake, and finally, a characteristic test is conducted and non-defective products are shipped.

(Problems to be Solved by the Invention) In recent years, semiconductor ICs have become multifunctional and customized, and as a result, the number of pins and chips are rapidly increasing. Currently, the number of pins has reached 200 to 300 pins, the chip size has reached 10 to 15 mm+, and power consumption is also increasing, so the packages in which these semiconductor ICs are mounted are also becoming larger and have more pins. Some of them have external dimensions of 40x40x0.4cm and weigh more than 10g.

As described above, as the number of pins increases and the size of the package increases, the following problems become more serious.

B1 For example, multi-pin flat packages are packed in so-called carriers such as trays or embossed tapes, but when handling them for storage or transportation, the packages may come into contact with each other or the carrier and the package. Otherwise, the outer lead may be deformed or damaged due to the collision. This problem was first observed in a 100-pin flat package as shown in Figure 4, but since then, the incidence has gradually increased as packages have become larger, and improvements in lead strength and carrier Various countermeasures are currently being considered, including improvements to the system.

B. Printed board module equipped with a large package,
The weight of various parts increases. These modules and parts are being made smaller and more hybridized in response to the demand for smaller and lighter chip parts for various consumer devices. The current situation is that pan cages are becoming larger and heavier, going against the trend toward lighter weight.

C. When the package becomes larger, the heat conduction from the chin 7° to the pan cage surface may decrease, resulting in a decrease in heat dissipation.

The purpose of the present invention is to solve these problems,
40 The weight is small, and the outer leads of the semiconductor devices will not be deformed or damaged due to collisions between the semiconductor devices in the packaged carrier or the carrier during handling or transportation. Another object of the present invention is to provide a semiconductor device mounted in a pancase that has advantages such as good heat dissipation and the ability to mount a semiconductor IC with large power consumption.

[Means for Solving the Problems] The above object is to manufacture a semiconductor whose semiconductor knob is sealed with a resin sealant using as a filler hollow fine solid particles made of an insulating material with good thermal conductivity. achieved by the device.

Here, the filler is made of an insulating material of a composition containing, for example, silicon oxide and aluminum oxide, has an outer diameter of about 10 to 0nΦ, and has an apparent density of 0.7 to 0.0nΦ.
A hollow ball (trade name "Show Balloon BSJ" sold by Showa Denko ■) with a weight of about 0.8 g/cffl can be used. , hardening agent, catalyst, mold release agent,
The appropriate composition ratio of the polymeric material consisting of a flame retardant, pigment, etc. is in the range of 46 to 69% by volume for the former and 31 to 54% by volume for the latter. Outside this range, if the amount of filler is too small, there will be no effect of achieving the above object, and if the amount of polymeric material including epoxy resin is too small, molding will not be possible. It is known that metal oxides and metal nitrides such as aluminum oxide have good thermal conductivity, and the resin sealant according to the present invention is made of metal oxides such as aluminum oxide that have good thermal conductivity. It may be formed of an insulating material with good thermal conductivity, such as a composition containing a metal nitride or a metal nitride, and may be formed of fine solid particles that maintain a hollow state even after resin sealing. Further, aluminum oxide is preferable because it has a small coefficient of thermal expansion.

[Effect]

As described above, since the resin sealant according to the present invention contains hollow microscopic solid particles, a large number of hollow parts are formed within the resin sealing part, and the weight of the resin sealing part can be reduced. Furthermore,
Since the fine solid particles are made of an insulating material with good thermal conductivity, good heat dissipation characteristics can be maintained even if a hollow portion is formed.

[Embodiment] Hereinafter, a semiconductor device according to an embodiment of the present invention will be described with reference to the drawings.

The first perspective view is a partially cutaway view of the package of this example.
As shown in the figure. Inside the resin sealing part (22), hollow fine solid particles (23) made of an insulating material with good thermal conductivity are mixed. The method for manufacturing this package will be explained below.

As shown in Fig. 2, a semiconductor chip is mounted on a die stage (9) of a sheet-shaped lead frame (8) made of 42 alloy material, copper material, etc. using gold-silicon, silver paste, solder, etc. It is mounted using the die bonding method, and then a wire is connected between the bonding pad (11) of the semiconductor chip (10) and the inner lead (12) of the lead frame (8) using a gold wire, copper wire, etc. Connect by bonding method.

Next, sealing is performed using an epoxy sealant by a so-called low-pressure transfer molding method to produce a pancake having the structure shown in FIG.

Here, the epoxy sealing material used in this example is (a) hollow fine solid particles (23) sold by Showa Denko, for example, under the trade name [Chibo Balloon BS,
A large amount of ceramic particles (46 to 69% by volume) of type SL, epoxy resin, hardening agent, catalyst, mold release agent, nonflammable agent,
A polymeric material (31 to 54% by volume) consisting of a pigment, etc. is mixed, (b) kneaded at a predetermined temperature for a predetermined time to produce an intermediate reaction product called a so-called B-stage, and (c)
This intermediate reaction product is compression molded, for example, into a cylindrical shape. The ceramic grains are hollow inside, and the wall thickness is about 1/10 of the diameter of the ceramic grains.

The composition and characteristics of the product name ``Shiller Balloon BS'' sold by Showa Denko ■ are as shown below.

1oz A1□　03 Fe,　　○.

ilt Table 1 Composition 57.5-61.0% 29.0-32.5 3.0- 4.0 Table 2 Properties 54-56% 0.5- 1 1.5-2.5 Particle size density 10-0.71 100μmΦ 0.78g/cPo10-180μmΦ 0.68 -0.70g/cJ For example, in the case of the prior art described above, the epoxy sealant is
Polymer material with a specific gravity of approximately 1.2 (46-69% by volume)
and a filler with a specific gravity of approximately 2.1 (31 to 54% by volume)
The specific gravity of the sealed package is about 1.8 to 2.0.

In the epoxy sealant according to the present invention, the mixing ratio of the filler and the polymeric material is similar to that of the conventional one, but on the other hand, the specific gravity of the filler in the epoxy sealant according to the present invention is Since the specific gravity is approximately 0.68 to 0.78, which is approximately 33 to 38% of the specific gravity of conventional fillers, the weight of the package in which the semiconductor 1c according to the present invention is mounted is approximately 58 to 0.78% of the weight of the pan cage according to the conventional technology. It will be around 63%.

On the other hand, the thermal conductivity of aluminum oxide (alumina) is about 0.30 W/cm-deg, which is about 0.014 W/cm-deg of the thermal conductivity of silicon oxide (silica).
It is about 21 times larger than g. Therefore, the plastic package according to the present invention is a hollow microscopic solid granule,
Therefore, although it contains countless cavities (therefore, cavities occupying a considerable volume), experimental results show that the thermal resistance of the package is about 90% of that of the conventional plastic package, which is lower than that of the conventional plastic package. This is about the same as in the case of such plastic packages.

Next, the outer lead part shown in (13) in Fig. 3 is soldered by electrolytic plating, and then the tie bar (14) and the outer lead are cut to predetermined dimensions to form the structure shown in Fig. 1. A package with

Next, the product name and other information are stamped on the surface of the package, and finally a characteristic test is performed to remove defective products and the semiconductor device is completed.

〔Effect of the invention〕

In the semiconductor device of the present invention, since many hollow parts are formed in the resin sealing part, weight reduction is achieved, and therefore,
Semiconductor devices are less likely to collide with each other during handling, and semiconductor devices are less likely to collide with each other or with packaging materials during transportation, such as when packaged for transportation.

Furthermore, even in the event of a collision, there is little risk of deformation or damage to the outer lead. Furthermore, since the filler having a hollow portion is made of a solid body made of an insulating material with good thermal conductivity, heat dissipation is also improved.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a semiconductor device according to an embodiment of the present invention. FIG. 2 is a plan view of a lead frame mounted with a semiconductor chip according to an embodiment of the present invention. FIG. 3 shows a semiconductor device main body according to an embodiment of the present invention.
FIG. 7 is a plan view of the lead frame sealed with resin. 4 to 6 are a perspective view, a plan view, and a plan view for explaining a semiconductor device according to the prior art. 4.11・ 5.12・ 6.13・ 7.14・ Ponding pad, inner lead, outer lead, tie bar

Claims (1)

[Claims] A semiconductor device characterized in that a semiconductor chip is encapsulated with a resin encapsulant using as a filler hollow fine solid particles made of an insulating material with good thermal conductivity.