JPH0284350U - - Google Patents

Info

Publication number
JPH0284350U
JPH0284350U JP1988164157U JP16415788U JPH0284350U JP H0284350 U JPH0284350 U JP H0284350U JP 1988164157 U JP1988164157 U JP 1988164157U JP 16415788 U JP16415788 U JP 16415788U JP H0284350 U JPH0284350 U JP H0284350U
Authority
JP
Japan
Prior art keywords
light emitting
chip
electrode
mount
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988164157U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988164157U priority Critical patent/JPH0284350U/ja
Publication of JPH0284350U publication Critical patent/JPH0284350U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1988164157U 1988-12-19 1988-12-19 Pending JPH0284350U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988164157U JPH0284350U (fr) 1988-12-19 1988-12-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988164157U JPH0284350U (fr) 1988-12-19 1988-12-19

Publications (1)

Publication Number Publication Date
JPH0284350U true JPH0284350U (fr) 1990-06-29

Family

ID=31449522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988164157U Pending JPH0284350U (fr) 1988-12-19 1988-12-19

Country Status (1)

Country Link
JP (1) JPH0284350U (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1787334A4 (fr) * 2004-02-05 2009-11-11 Gen Led Inc Structures electroluminescentes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1787334A4 (fr) * 2004-02-05 2009-11-11 Gen Led Inc Structures electroluminescentes

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