JPH0284372U - - Google Patents
Info
- Publication number
- JPH0284372U JPH0284372U JP16402588U JP16402588U JPH0284372U JP H0284372 U JPH0284372 U JP H0284372U JP 16402588 U JP16402588 U JP 16402588U JP 16402588 U JP16402588 U JP 16402588U JP H0284372 U JPH0284372 U JP H0284372U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- type electronic
- wiring board
- printed wiring
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案に係る印刷配線板装置のチツプ
部品の実装過程を示す説明図、第２図はチツプ部
品とデイスクリート部品が実装された本考案に係
る印刷配線板装置を示す断面図、第３図は従来の
印刷配線板装置のチツプ部品の仮固定を示す断面
図、第４図はチツプ部品とデイスクリート部品が
実装された従来の印刷配線板装置を示す断面図で
ある。
１１……基板、１２ａ，１２ｂ……チツプラン
ド、２０ａ，２０ｂ……ペースト半田。
FIG. 1 is an explanatory diagram showing the mounting process of chip components of a printed wiring board device according to the present invention, and FIG. 2 is a sectional view showing the printed wiring board device according to the present invention in which chip components and discrete components are mounted. FIG. 3 is a sectional view showing temporary fixing of chip components in a conventional printed wiring board device, and FIG. 4 is a sectional view showing a conventional printed wiring board device in which chip components and discrete components are mounted. 11... Board, 12a, 12b... Chip land, 20a, 20b... Paste solder.
Claims (1)
成した印刷配線板と、 前記チツプランドと前記チツプ型電子部品の電
極とを電気的に接続すべく前記チツプランドに塗
布した半田と、 前記チツプ型電子部品を仮固定すべく、前記半
田を塗布したチツプランドの付近に設けた仮固定
用接着剤とを具備し、 前記チツプ型電子部品を前記印刷配線板に対し
実装する際に、半田付けと共に接着剤の硬化も同
時に行うことにより構成される印刷配線板装置。[Claims for Utility Model Registration] A printed wiring board on which a chip land is formed to connect chip-type electronic components; solder applied to the chip land to electrically connect the chip land and the electrodes of the chip-type electronic component; In order to temporarily fix the chip type electronic component, a temporary fixing adhesive is provided near the chip land coated with the solder, and when the chip type electronic component is mounted on the printed wiring board, the solder is removed. A printed wiring board device that is constructed by attaching and curing the adhesive at the same time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16402588U JPH0284372U (en) | 1988-12-20 | 1988-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16402588U JPH0284372U (en) | 1988-12-20 | 1988-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0284372U true JPH0284372U (en) | 1990-06-29 |
Family
ID=31449272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16402588U Pending JPH0284372U (en) | 1988-12-20 | 1988-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0284372U (en) |
-
1988
- 1988-12-20 JP JP16402588U patent/JPH0284372U/ja active Pending
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