JPH028539U - - Google Patents
Info
- Publication number
- JPH028539U JPH028539U JP8442388U JP8442388U JPH028539U JP H028539 U JPH028539 U JP H028539U JP 8442388 U JP8442388 U JP 8442388U JP 8442388 U JP8442388 U JP 8442388U JP H028539 U JPH028539 U JP H028539U
- Authority
- JP
- Japan
- Prior art keywords
- grounded electrode
- workpiece
- plasma processing
- plasma
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Physical Or Chemical Processes And Apparatus (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Description
第１図は本考案装置の実施例を示す概要図、ま
た第２図は従来の非接地電極、第３図は本考案の
非接地電極のそれぞれ斜視図である。
１…被処理物、２…非接地電極、３…接地電極
、４…巻取りロール、５…ガイドロール、６…真
空容器、７…ネジ、８…埋込ネジ、９…溶接後研
磨。
FIG. 1 is a schematic diagram showing an embodiment of the device of the present invention, FIG. 2 is a perspective view of a conventional non-grounded electrode, and FIG. 3 is a perspective view of a non-grounded electrode of the present invention. 1... Workpiece, 2... Non-grounded electrode, 3... Grounded electrode, 4... Winding roll, 5... Guide roll, 6... Vacuum container, 7... Screw, 8... Embedded screw, 9... Polishing after welding.
Claims (1)
極２と接地電極３とよりなる電極対の少なくとも
１対と、該電極対の一方の電極の表面に長尺被処
理物１を接触通過させるためのガイドロール５群
を含む被処理物誘導機構とを装設してなり、上記
真空容器内の真空形成手段、プラズマ発生ガス導
入手段および非接地電極へのプラズマ発生用電圧
印加手段を有するプラズマ処理装置において、 非接地電極の表面構造が張合せ、又は、ネジ止
めなどによる継目、すき間、凹孔部、凸起部を有
しない一体化構造であることを特徴とするプラズ
マ処理装置。 ２ 非接地電極が溶接加工の後、研磨加工により
凹孔部、凸起部を除去した請求項１記載のプラズ
マ処理装置。[Claims for Utility Model Registration] 1. In a vacuum container 6, at least one pair of electrodes consisting of a non-grounded electrode 2 and a grounded electrode 3 facing each other, and a long length on the surface of one electrode of the pair of electrodes. It is equipped with a workpiece guide mechanism including 5 groups of guide rolls for allowing the workpiece 1 to pass through in contact with the workpiece 1, and is provided with a vacuum forming means in the vacuum container, a plasma generating gas introducing means, and a plasma to the non-grounded electrode. A plasma processing apparatus having a generating voltage applying means, characterized in that the surface structure of the non-grounded electrode is an integrated structure with no seams, gaps, recesses, or protrusions caused by bonding or screwing. plasma processing equipment. 2. The plasma processing apparatus according to claim 1, wherein the non-grounded electrode is welded and then polished to remove concave portions and protrusions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8442388U JPH028539U (en) | 1988-06-28 | 1988-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8442388U JPH028539U (en) | 1988-06-28 | 1988-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028539U true JPH028539U (en) | 1990-01-19 |
Family
ID=31309112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8442388U Pending JPH028539U (en) | 1988-06-28 | 1988-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028539U (en) |
-
1988
- 1988-06-28 JP JP8442388U patent/JPH028539U/ja active Pending