JPH0285527U - - Google Patents
Info
- Publication number
- JPH0285527U JPH0285527U JP16560988U JP16560988U JPH0285527U JP H0285527 U JPH0285527 U JP H0285527U JP 16560988 U JP16560988 U JP 16560988U JP 16560988 U JP16560988 U JP 16560988U JP H0285527 U JPH0285527 U JP H0285527U
- Authority
- JP
- Japan
- Prior art keywords
- shrinkable tube
- heat
- flexible heat
- diamond
- spacer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- 125000006850 spacer group Chemical group 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000011324 bead Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Description
図面は本考案の実施の一例を示す横断面図であ
る。 １……ワイヤーロープ、２……ダイヤモンドセ
グメント、３……粘着剤層、４……スペーサ、２
０……ダイヤモンドビーズ。
る。 １……ワイヤーロープ、２……ダイヤモンドセ
グメント、３……粘着剤層、４……スペーサ、２
０……ダイヤモンドビーズ。
Claims (1)
- ダイヤモンドビーズ間に設けたワイヤーロープ
被覆用スペーサを可撓性熱収縮チユーブで構成す
ると共に、該可撓性熱収縮チユーブ製スペーサの
内周面に熱賦活型接着剤又はゴム系粘着剤層を設
けるようにしたことを特徴とするダイヤモンドワ
イヤソー。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16560988U JPH0285527U (ja) | 1988-12-21 | 1988-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16560988U JPH0285527U (ja) | 1988-12-21 | 1988-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0285527U true JPH0285527U (ja) | 1990-07-05 |
Family
ID=31452253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16560988U Pending JPH0285527U (ja) | 1988-12-21 | 1988-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0285527U (ja) |
-
1988
- 1988-12-21 JP JP16560988U patent/JPH0285527U/ja active Pending