JPH02856B2 - - Google Patents
Info
- Publication number
- JPH02856B2 JPH02856B2 JP55143809A JP14380980A JPH02856B2 JP H02856 B2 JPH02856 B2 JP H02856B2 JP 55143809 A JP55143809 A JP 55143809A JP 14380980 A JP14380980 A JP 14380980A JP H02856 B2 JPH02856 B2 JP H02856B2
- Authority
- JP
- Japan
- Prior art keywords
- chip carrier
- semiconductor element
- semiconductor
- circuit board
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
本発明は半導体素子を実装するためのチツプキ
ヤリアに係り、特に半導体素子を実装した際に、
該半導体素子の表裏両面が露出されるようになる
チツプキヤリアに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a chip carrier for mounting semiconductor devices, and particularly, when mounting semiconductor devices,
The present invention relates to a chip carrier in which both the front and back sides of the semiconductor element are exposed.
高い発熱を生ずる集積回路部品は、従来第１図
に示すような放射熱体ａを備えたものが用いられ
る。即ち半導体素子１がキヤリア２に固着され、
該キヤリア２に取付けられた金属柱３の外周面
に、複数個の金属フイン４が互に離隔されて平行
に配置され、半導体素子１に生じた熱を外部に伝
達している。なお、５はリード線、６は回路基板
である。 Conventionally, integrated circuit components that generate a high amount of heat are equipped with a radiant heating element a as shown in FIG. That is, the semiconductor element 1 is fixed to the carrier 2,
A plurality of metal fins 4 are arranged in parallel and spaced apart from each other on the outer peripheral surface of a metal column 3 attached to the carrier 2, and transmit heat generated in the semiconductor element 1 to the outside. Note that 5 is a lead wire and 6 is a circuit board.
この形式の放熱体ａは強制空冷であり、半導体
素子１からキヤリア２外表面までの放熱を固体の
熱伝達によつている。従つて半導体素子１の片面
は当然キヤリア２に接続している必要がある。こ
の結果、集積回路は片面にのみ形成するのが常織
とされていて、両面に形成することによつて、高
集積度化を計ることは不可能であつた。また沸騰
冷却を行うに当り半導体素子１の裏面に、沸騰の
核となる起伏を形成することができないという欠
点があつた。 This type of heat radiator a is forced air cooled, and heat is radiated from the semiconductor element 1 to the outer surface of the carrier 2 by solid heat transfer. Therefore, one side of the semiconductor element 1 must naturally be connected to the carrier 2. As a result, it has been customary for integrated circuits to be formed only on one side, and it has been impossible to increase the degree of integration by forming them on both sides. Another disadvantage is that when performing boiling cooling, it is not possible to form undulations on the back surface of the semiconductor element 1, which will serve as the core of boiling.
本発明の目的は半導体素子の裏面を用いて沸騰
の核を作り、沸騰冷却の効率化をはかつた半導体
素子冷却装置を提供することにある。 SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor device cooling device that uses the back surface of a semiconductor device to create a boiling nucleus and improves the efficiency of boiling cooling.
本発明の特徴はチツプキヤリアを枠型とし、半
導体素子を周囲のみで固定するようにし、さらに
又半導体素子は一方の面に集積回路が形成される
とともに、他方の面に沸騰冷却を行うための起伏
が形成されていることにより上記目的を達してい
る。 The feature of the present invention is that the chip carrier is frame-shaped, the semiconductor element is fixed only at the periphery, and the semiconductor element has an integrated circuit formed on one side and undulations on the other side for boiling cooling. The above objective is achieved by the formation of .
以下、実施例により本発明を説明する。 The present invention will be explained below with reference to Examples.
第２図は本発明による沸騰冷却用チツプキヤリ
アの１実施例を説明するためのイは斜視図、ロは
Ｘ−X′断面図、ハは底面図である。 2 is a perspective view, b is a sectional view taken along line X-X', and c is a bottom view for explaining one embodiment of the evaporative cooling chip carrier according to the present invention.
図において、チツプキヤリア７は枠型（割合せ
形）に形成され、かつ半導体素子１を両側より挾
み固定している。固定された半導体素子１の両面
は露出された状態でチツプキヤリア７のリード８
にワイヤボンデング９されている。該リード８は
枠型のチツプキヤリア７の内部において、一般の
積層技術により形成されたパターン１０と接続さ
れ、かつ該パターン１０はチツプキヤリア７の底
部に露出している半田を持つ端子１１に接続され
ている。 In the figure, the chip carrier 7 is formed into a frame shape (ratio-shaped) and clamps and fixes the semiconductor element 1 from both sides. Both sides of the fixed semiconductor element 1 are exposed and connected to the leads 8 of the chip carrier 7.
Wire bonding 9 is carried out. The leads 8 are connected inside the frame-shaped chip carrier 7 to a pattern 10 formed by a general lamination technique, and the pattern 10 is connected to a terminal 11 having solder exposed at the bottom of the chip carrier 7. There is.
上記のように半導体素子１が実装されたチツプ
キヤリア７を複数個第３図に示すように回路基板
１２に搭載して、その外周を放熱フインのあるパ
ツケージ１３（金属製）で覆つて、かつ該パツケ
ージ１３の内部に冷媒液体（例えばフルオロカー
ボン等）１４が充填された場合、該冷媒液体１４
に半導体素子１の両面が接触され、冷却が行われ
ることにより大きな冷却効果が得られる。 A plurality of chip carriers 7 on which semiconductor elements 1 are mounted as described above are mounted on a circuit board 12 as shown in FIG. When the inside of the package 13 is filled with a refrigerant liquid (for example, fluorocarbon, etc.) 14, the refrigerant liquid 14
Both sides of the semiconductor element 1 are brought into contact with the semiconductor element 1 and cooled, thereby obtaining a large cooling effect.
また、半導体素子１の両面が露出されるので、
発熱量の大きな半導体素子の場合には半導体素子
の裏面をエツチング等で加工し、冷媒液の沸騰の
核になる起伏を形成することにより、さらに大き
な冷却効果を与えることがきでる。 Furthermore, since both sides of the semiconductor element 1 are exposed,
In the case of a semiconductor element that generates a large amount of heat, an even greater cooling effect can be obtained by etching the back surface of the semiconductor element to form undulations that will become the core of boiling of the refrigerant liquid.
以上実施例により本発明を説明したが、本発明
によれば、チツプキヤリアを枠型とし、半導体素
子を周囲のみで固定するようにし、さらに又半導
体素子は一方の面に集積回路が形成されるととも
に、他方の面に沸騰冷却を行うための起伏が形成
されていることにより沸騰冷却の効率化をはかる
ことが可能である。 The present invention has been described above with reference to the embodiments. According to the present invention, the chip carrier is formed into a frame shape, the semiconductor element is fixed only at the periphery, and furthermore, the semiconductor element has an integrated circuit formed on one side. By forming undulations on the other surface for performing boiling cooling, it is possible to improve the efficiency of boiling cooling.
第１図は従来の放熱体を有する半導体素子を説
明するための断面図、第２図は本発明によるチツ
プキヤリアの１実施例を説明するためのイは斜視
図、ロはＸ−X′断面図、ハは底面図、第３図は
本発明の沸騰冷却用チツプキヤリアを適用したモ
ジユールの１例を示す断面図を示す。
図において、１は半導体素子、７はチツプキヤ
リア、８はリード、９はワイヤボンデング、１０
はパターン、１１は端子、１２は回路基板、１３
はパツケージ、１４は冷媒液体である。
FIG. 1 is a cross-sectional view for explaining a semiconductor element having a conventional heat sink, FIG. 2 is a perspective view for explaining one embodiment of a chip carrier according to the present invention, and B is a cross-sectional view taken along line X-X'. , C shows a bottom view, and FIG. 3 shows a sectional view showing an example of a module to which the evaporative cooling chip carrier of the present invention is applied. In the figure, 1 is a semiconductor element, 7 is a chip carrier, 8 is a lead, 9 is a wire bonding device, and 10 is a chip carrier.
is a pattern, 11 is a terminal, 12 is a circuit board, 13
is a package, and 14 is a refrigerant liquid.
Claims (1)
キヤリアと、該チツプキヤリアに固定された両面
が露出し一方の面に回路が形成され他方の面に沸
騰の核となる起伏が形成された半導体素子と、該
チツプキヤリアを搭載する回路基板と、該チツプ
キヤリアを覆い回路基板に取付けられた放熱フイ
ンを有するパツケージと、該パツケージ内に該半
導体素子の両面を浸漬する冷媒液体とを有するこ
とを特徴とする半導体素子冷却装置。 ２ 上記チツプキヤリアは内部パターンで接続さ
れる上記半導体素子への接続リードと上記回路基
板に搭載される底面に露出する端子とを有するこ
とを特徴とする特許請求の範囲第１項記載の半導
体素子冷却装置。[Claims] 1. A frame-shaped chip carrier that fixes a semiconductor element only at its periphery, and both sides fixed to the chip carrier are exposed, a circuit is formed on one surface, and undulations that become the core of boiling are formed on the other surface. a circuit board on which the chip carrier is mounted; a package that covers the chip carrier and has heat dissipation fins attached to the circuit board; and a refrigerant liquid that immerses both sides of the semiconductor chip in the package. A semiconductor device cooling device characterized by: 2. The semiconductor device cooling according to claim 1, wherein the chip carrier has a connection lead to the semiconductor device connected by an internal pattern and a terminal mounted on the circuit board and exposed on the bottom surface. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55143809A JPS5768060A (en) | 1980-10-15 | 1980-10-15 | Chip carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55143809A JPS5768060A (en) | 1980-10-15 | 1980-10-15 | Chip carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5768060A JPS5768060A (en) | 1982-04-26 |
| JPH02856B2 true JPH02856B2 (en) | 1990-01-09 |
Family
ID=15347468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55143809A Granted JPS5768060A (en) | 1980-10-15 | 1980-10-15 | Chip carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5768060A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6820684B1 (en) * | 2003-06-26 | 2004-11-23 | International Business Machines Corporation | Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader |
-
1980
- 1980-10-15 JP JP55143809A patent/JPS5768060A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5768060A (en) | 1982-04-26 |
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