JPH0287004A - Apparatus for measuring pattern width of printed wiring board - Google Patents

Apparatus for measuring pattern width of printed wiring board

Info

Publication number
JPH0287004A
JPH0287004A JP63239044A JP23904488A JPH0287004A JP H0287004 A JPH0287004 A JP H0287004A JP 63239044 A JP63239044 A JP 63239044A JP 23904488 A JP23904488 A JP 23904488A JP H0287004 A JPH0287004 A JP H0287004A
Authority
JP
Japan
Prior art keywords
image
pattern
radius
hole
pattern width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63239044A
Other languages
Japanese (ja)
Inventor
Shunichi Ueda
俊一 上田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP63239044A priority Critical patent/JPH0287004A/en
Publication of JPH0287004A publication Critical patent/JPH0287004A/en
Pending legal-status Critical Current

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Analysis (AREA)

Abstract

PURPOSE:To accurately measure a pattern width by calculating the center of a through-hole and the min. radius between said center and the outside of the annular pattern in contact with the outside of said through-hole and subtracting the radius of the through-hole from the min. radius. CONSTITUTION:The image signal of a substrate 13 is inputted to the A/D converter 16 of an image processor 15 as an analogue signal from an image sensor 14 to output a multivalent image 17. This multivalent image 17 is processed at a certain threshold level by a binarization processing part 18 and a binary image 19 wherein an annular pattern is set to a white image and other part is set to a black image is outputted to a pattern width measuring and processing part 20 to measure a pattern width. The center of a through-hole and the min. radius between said center and the outside of the annular pattern in contact with the outside of said through-hole are calculated by the processing part 20 and the radius of the through-hole is subtracted from the min. radius to measure the min. pattern width.

Description

【発明の詳細な説明】 〔発明の目的〕 (産業上の利用分野) 本発明は、印刷配線板のパターン幅測定装置に関する。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a pattern width measuring device for printed wiring boards.

(従来の技術) 従来の印刷配線板(以下基板という)のパターン幅を画
像処理で測定する装置のなかには、第4図に示す黒画像
となるスルホール1とレジス1へのパターン2間の環状
パターン3の最小幅4を測るために、黒画像を膨張処理
したり白画像を収縮したりして、スルホール1とパター
ン2がつながるまでの処理画素数から測るものがある。
(Prior Art) Some devices that measure the pattern width of a conventional printed wiring board (hereinafter referred to as a board) by image processing include an annular pattern between a through hole 1 and a pattern 2 on a resist 1, which results in a black image as shown in FIG. In order to measure the minimum width 4 of 3, there is a method that expands a black image or contracts a white image and measures the number of pixels processed until through hole 1 and pattern 2 are connected.

(発明が解決しようとする課題) ところが、この画素数は、第5図の(a)から(d)の
ように、同じパターン幅4でも入力画像の角度で例えば
第5図(、)では6画素、(b)では8画素となるので
、従来の単純な膨張−収縮処理では正確にパターン幅を
測れない。
(Problem to be Solved by the Invention) However, as shown in FIGS. 5(a) to (d), even if the pattern width is 4, the number of pixels is 6 at the angle of the input image, for example in FIG. Since there are 8 pixels in (b), the pattern width cannot be accurately measured using the conventional simple expansion and contraction process.

そこで、本発明の目的は、パターン幅を正確に測ること
のできる印刷配線板のパターン幅測定装置を得ることで
ある。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a pattern width measuring device for printed wiring boards that can accurately measure pattern widths.

〔発明の構成〕[Structure of the invention]

(課題を解決するための手段および作用)本発明は、印
刷配線板のパターンの画像信号を処理してパターンの幅
を測る印刷配線板のバタン幅測定装置において、」1記
画像装置に、スルホルの中心とこの中心からその外側の
パターンの外像線間の最小半径を求め、この最小半径か
らスルホールの半径を減算するパターン幅測定部を設け
ることで、撮像パターンの向きに無関係に正確にパター
ン幅を測ることのできる印刷配線板のパターン幅測定装
置である。
(Means and Effects for Solving the Problems) The present invention provides a button width measuring device for a printed wiring board that processes an image signal of a pattern on a printed wiring board to measure the width of the pattern. By providing a pattern width measurement unit that calculates the minimum radius between the center of the image line and the outer image line of the pattern outside this center and subtracts the radius of the through hole from this minimum radius, the pattern can be accurately measured regardless of the orientation of the imaged pattern. This is a printed wiring board pattern width measuring device that can measure the width.

(実施例) 以下、本発明の印刷配線板のパターン幅測定装置の一実
施例を図面で説明する。
(Example) Hereinafter, an example of the pattern width measuring device for a printed wiring board according to the present invention will be described with reference to the drawings.

第1図は、本発明の基板のパターン幅側装置の構成を示
すブロック図で、基板13の画像信号は、イメージセン
サ14がらアナログ信号として画像処理装置15のA/
D変換器16に入力されて多値画像17が出力され、こ
の多値画像17は2値化処理部18であるしきい値レベ
ルで処理され、環状パターン3を白画像とし他を黒画像
にした2値画像19がパターン幅測定処理部20へ出力
されてパターン幅が測定される。
FIG. 1 is a block diagram showing the configuration of the device on the pattern width side of the substrate according to the present invention, in which the image signal of the substrate 13 is outputted as an analog signal from the image sensor 14 to the A/F of the image processing device 15.
It is input to the D converter 16 and outputs a multivalued image 17. This multivalued image 17 is processed at a threshold level by a binarization processing unit 18, and the annular pattern 3 is made into a white image and the others are made into a black image. The resulting binary image 19 is output to the pattern width measurement processing section 20, and the pattern width is measured.

第2図(a)は、抽出されたスルホール部の2値画像1
9で、斜線部が環状パターン3を示す白画像、内部の円
形部がスルホール1を示す黒画像となる。
Figure 2(a) shows the extracted binary image 1 of the through-hole area.
9, the shaded area becomes a white image showing the annular pattern 3, and the inner circular part becomes a black image showing the through hole 1.

次に、パターン幅測定のためのスルホール1の中心座標
と半径の求め方を第2図(b)で説明する。
Next, how to determine the center coordinates and radius of the through hole 1 for pattern width measurement will be explained with reference to FIG. 2(b).

まず、スルホール1を横断する直線Aを引き、この直線
Aとスルホール1の外周(すなわち黒画像と白画像の境
)との交点をax+azとし、線a□。
First, draw a straight line A that crosses the through hole 1, set the intersection of this straight line A and the outer periphery of the through hole 1 (that is, the boundary between the black image and the white image) as ax+az, and draw a line a□.

a2の中心をa。とする。次に、このa。を通り線Aに
垂直な直線Bを引き、スルホール1の外周との交点をす
、、b2とし、線b1.b、の中点をす。とする。ここ
でa。+ boが、スルホール1の中心座標となる。
The center of a2 is a. shall be. Next, this a. , draw a straight line B perpendicular to line A, let the intersection with the outer periphery of through hole 1 be b2, and draw line b1. Find the midpoint of b. shall be. Here a. +bo is the center coordinate of through hole 1.

又、スルホール1の半径rは、 r:b1b2 となる。Also, the radius r of the through hole 1 is r:b1b2 becomes.

次に、こうしてスルホール1の中心座標a。l bnと
半径rを求めた後、最小幅4を測定する方法を第2図(
C)と第3図で説明する。
Next, the center coordinate a of the through hole 1 is thus determined. After determining l bn and radius r, the method for measuring the minimum width 4 is shown in Figure 2 (
C) and FIG. 3.

まず、点す。からある半径Ωで円周画素の集合6を求め
、全画素が白か否かを見る。もし全画素が白のときはQ
十ΔQ=Q□の新しい半径で調べ、黒が混入していると
きは、Q−ΔQの新たな半径で全画素が白か否かをみる
。この手順を繰り返すことで、白画像で構成する最大半
径j(maxを求める。
First, turn it on. Find a set 6 of circumferential pixels with a certain radius Ω from Ω, and check whether all pixels are white. If all pixels are white, Q
Check with a new radius of 10ΔQ=Q□, and if black is mixed in, check whether all pixels are white with a new radius of Q−ΔQ. By repeating this procedure, the maximum radius j(max) of the white image is determined.

そして、最小幅4は Qmax −rで求めることがで
きる。
Then, the minimum width 4 can be determined by Qmax - r.

更に、最小幅4がある許容値(m)以上あるかどうかを
見るときには、半径Q=m+rとして円周画素の集合6
を求めて全面画素が白か否かを見ればよく、全部臼であ
れば良、黒が混入すれば不良と判定できる。
Furthermore, when checking whether the minimum width 4 is greater than or equal to a certain tolerance value (m), the set 6 of circumferential pixels is set as the radius Q=m+r.
All you have to do is find out whether the pixels on the entire surface are white or not. If all the pixels are solid, it is determined to be good, and if black is mixed in, it is determined to be defective.

なお、上記実施例では、あるしきい値レベルで2値画像
に変換(第1図参照)した後に中心座標(ao+bo)
と半径rを求めて最小幅4を算出したが、2値画像に変
換しなくて、2値画像に対して白・黒を判定した代りに
、多値画像に対してしきい値レベルとの高低を判定する
ことで、第2〜3図で説明した手法と同様にして、中心
座標(an 1bo)と半径rを求めて、最小幅4を算
出してもよい。
In the above embodiment, after converting to a binary image at a certain threshold level (see Figure 1), the center coordinates (ao+bo)
The minimum width 4 was calculated by determining the radius r, but instead of converting the image to a binary image, instead of determining black and white for the binary image, the threshold level and the threshold level for the multi-value image were determined. By determining the height, the minimum width 4 may be calculated by determining the center coordinates (an 1bo) and radius r in the same manner as the method described in FIGS. 2 and 3.

〔発明の効果〕〔Effect of the invention〕

以上、本発明によれば、印刷配線板のパターンの画像を
取込む画像入力部からの画像信号を処理して、パターン
の幅を測る印刷配線板のパターン幅測定装置において、
上記画像処理装置に、スルホールの中心とこの中心から
その外側に接する環状パターンの外側間の最小半径を求
め、この最小半径からスルホールの半径を減算して最小
パターン幅を測る処理部を設けたので、撮像される印刷
配線板の向きに無関係に正確にパターン幅を測ることの
できる印刷配線板のパターン幅測定装置を得ることがで
きる。
As described above, according to the present invention, in the pattern width measuring device for a printed wiring board that measures the width of the pattern by processing the image signal from the image input unit that captures the image of the pattern on the printed wiring board,
The above image processing device is equipped with a processing unit that calculates the minimum radius between the center of the through hole and the outside of the annular pattern that touches the outside from this center, and subtracts the radius of the through hole from this minimum radius to measure the minimum pattern width. Therefore, it is possible to obtain a pattern width measuring device for a printed wiring board that can accurately measure the pattern width regardless of the orientation of the printed wiring board imaged.

【図面の簡単な説明】 第1図は本発明の印刷配線板のパターン幅測定装置の一
実施例を示すブロック図、第2図と第3図は本発明の印
刷配線板のパターン幅測定装置の作用を示す説明図、第
4図と第5図は従来の印刷配線板のパターン幅測定装置
の作用を示す説明図である。 4・・・最小パターン幅   13・・・印刷配線板1
4・・・イメージセンサ   15・・・画像処理装置
16・・・A/D変換器     20・・・パターン
幅測定処理部第 図 体) (c) (dン 第 図
[Brief Description of the Drawings] Fig. 1 is a block diagram showing an embodiment of the printed wiring board pattern width measuring device of the present invention, and Figs. 2 and 3 are the printed wiring board pattern width measuring device of the present invention. FIGS. 4 and 5 are explanatory diagrams showing the operation of a conventional printed wiring board pattern width measuring device. 4...Minimum pattern width 13...Printed wiring board 1
4...Image sensor 15...Image processing device 16...A/D converter 20...Pattern width measurement processing section (Fig.

Claims (1)

【特許請求の範囲】[Claims]  撮像された印刷配線板のパターンの画像信号を画像処
理装置で処理して前記パターンの幅を測定する印刷配線
板のパターン幅測定装置において、前記画像処理装置に
、前記印刷配線板のスルホールの中心とこの中心からそ
の外側のパターンの外像間の最小半径を求め、この最小
半径から前記スルホールの半径を減算するパターン幅測
定部を設けたことを特徴とする印刷配線板のパターン幅
測定装置。
In a pattern width measuring device for a printed wiring board, which processes an image signal of an imaged pattern of a printed wiring board with an image processing device to measure the width of the pattern, the image processing device is configured to measure the width of the pattern through the printed wiring board. A pattern width measuring device for a printed wiring board, characterized in that a pattern width measuring section is provided for determining the minimum radius between the outer image of the pattern from the center thereof and subtracting the radius of the through hole from this minimum radius.
JP63239044A 1988-09-26 1988-09-26 Apparatus for measuring pattern width of printed wiring board Pending JPH0287004A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63239044A JPH0287004A (en) 1988-09-26 1988-09-26 Apparatus for measuring pattern width of printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63239044A JPH0287004A (en) 1988-09-26 1988-09-26 Apparatus for measuring pattern width of printed wiring board

Publications (1)

Publication Number Publication Date
JPH0287004A true JPH0287004A (en) 1990-03-27

Family

ID=17039040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63239044A Pending JPH0287004A (en) 1988-09-26 1988-09-26 Apparatus for measuring pattern width of printed wiring board

Country Status (1)

Country Link
JP (1) JPH0287004A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103471509A (en) * 2013-03-25 2013-12-25 深圳信息职业技术学院 An image analysis test method and system applied to a placement machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103471509A (en) * 2013-03-25 2013-12-25 深圳信息职业技术学院 An image analysis test method and system applied to a placement machine

Similar Documents

Publication Publication Date Title
JPS633450B2 (en)
JPH0287004A (en) Apparatus for measuring pattern width of printed wiring board
JPH05231842A (en) Shape pattern inspection method and device
JPS62233746A (en) Checker for chip mounted board
JP2658594B2 (en) Surface mount IC lead displacement inspection equipment
JPH0524669B2 (en)
JP3013255B2 (en) Shape measurement method
JPH03278195A (en) Number of sheets measuring instrument
JPS6375503A (en) Positioning device for parts with lead
JPH02190776A (en) Pattern inspecting device
JPH0133870B2 (en)
JPH06281411A (en) Measuring method for hole position
JP3418497B2 (en) Component recognition method
JP2570223B2 (en) Measurement device for parts position
JP2536727B2 (en) Pattern inspection device
JP3119688B2 (en) Tilt detection method
JPH02133885A (en) Inspecting method for pattern
JPH0721807B2 (en) Wiring pattern error detector
JPH07107711A (en) Iron core coil deviation detection method
JPH05180618A (en) Position-recognizing method for object
JPS62299705A (en) Inspecting instrument for package parts
JPS6148705A (en) Position detecting device
JPH0559547U (en) Image target detection device
JP3069401B2 (en) Inspection method of roundness by image processing
JPH0579661U (en) Image target detection device