JPH0288466U - - Google Patents
Info
- Publication number
- JPH0288466U JPH0288466U JP16456588U JP16456588U JPH0288466U JP H0288466 U JPH0288466 U JP H0288466U JP 16456588 U JP16456588 U JP 16456588U JP 16456588 U JP16456588 U JP 16456588U JP H0288466 U JPH0288466 U JP H0288466U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- base
- resin
- molded product
- wiring lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Reciprocating, Oscillating Or Vibrating Motors (AREA)
Description
第１図は本考案の実施例による樹脂モールド品
の一例としてピツクアツプ駆動用のリニアモータ
の可動子を示す斜視図、第２図はその一部拡大斜
視図、第３図と第４図は型による成型工程を示す
断面図であり、第３図は第４図の―断面図で
ある。第５図はピツクアツプならびにリニアモー
タを示す斜視図、第６図は従来の成型に使用され
る型の断面図である。
３，４…コイル、５…ベース、２０…樹脂、２
０ａ…樹脂壁、２１…プリント板、２２ａ，２２
ｂ…配線パターン、３１…上型、３２…下型。
Fig. 1 is a perspective view showing a movable element of a linear motor for driving a pickup as an example of a resin molded product according to an embodiment of the present invention, Fig. 2 is a partially enlarged perspective view thereof, and Figs. 3 and 4 are molded molds. FIG. 3 is a sectional view showing the molding process according to FIG. 4; FIG. 5 is a perspective view showing a pickup and a linear motor, and FIG. 6 is a sectional view of a mold used in conventional molding. 3, 4...Coil, 5...Base, 20...Resin, 2
0a...Resin wall, 21...Printed board, 22a, 22
b...Wiring pattern, 31...Upper mold, 32...Lower mold.
Claims (1)
たプリント板が貼着されており、前記ベースなら
びにプリント板の一部分が露出し且つベースとプ
リント板の他の部分が樹脂に埋没されている樹脂
モールド品において、キヤビテイの一部が前記プ
リント板の外周を囲むように延びている金型によ
り成型され、プリント板を囲む樹脂壁が形成され
て成る配線リード部を有する樹脂モールド品。 A resin molded product in which a printed board on which a wiring lead pattern is formed is adhered to the surface of a base, a part of the base and printed board are exposed, and other parts of the base and printed board are buried in resin. A resin molded product having a wiring lead portion formed by molding a part of the cavity with a mold extending so as to surround the outer periphery of the printed board, and forming a resin wall surrounding the printed board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16456588U JPH0288466U (en) | 1988-12-19 | 1988-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16456588U JPH0288466U (en) | 1988-12-19 | 1988-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0288466U true JPH0288466U (en) | 1990-07-12 |
Family
ID=31450287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16456588U Pending JPH0288466U (en) | 1988-12-19 | 1988-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0288466U (en) |
-
1988
- 1988-12-19 JP JP16456588U patent/JPH0288466U/ja active Pending