JPH0289843U - - Google Patents

Info

Publication number
JPH0289843U
JPH0289843U JP16999988U JP16999988U JPH0289843U JP H0289843 U JPH0289843 U JP H0289843U JP 16999988 U JP16999988 U JP 16999988U JP 16999988 U JP16999988 U JP 16999988U JP H0289843 U JPH0289843 U JP H0289843U
Authority
JP
Japan
Prior art keywords
heatsink
lsi package
type lsi
mounting
thermal resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16999988U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16999988U priority Critical patent/JPH0289843U/ja
Publication of JPH0289843U publication Critical patent/JPH0289843U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例の断面図、第2図は
第1図の実施例に熱抵抗調整用放熱器を取付けた
場合の正面図、第3図は本考案の第2の実施例の
断面図である。 1……PGA型LSIパツケージ、2……放熱
器、3,3A……熱抵抗調整用放熱器、4……フ
イン取付部、5……フイン、7……おねじ、8…
…めねじ、9……リード、10……取付けねじ、
11……フイン取付棒、12……挿入穴。
Fig. 1 is a sectional view of one embodiment of the present invention, Fig. 2 is a front view of the embodiment of Fig. 1 with a heat sink for adjusting thermal resistance attached, and Fig. 3 is a second embodiment of the invention. FIG. 3 is an example cross-sectional view. 1...PGA type LSI package, 2...heatsink, 3,3A...heatsink for adjusting thermal resistance, 4...fin mounting part, 5...fin, 7...male thread, 8...
...Female thread, 9...Lead, 10...Mounting screw,
11... Fin mounting rod, 12... Insertion hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数のフインを有する放熱器が上面に設けられ
たPGA型LSIパツケージにおいて、前記放熱
器のフイン取付部に熱抵抗調整用放熱器を取付け
るための取付穴を設けたことを特徴とするPGA
型LSIパツケージ。
A PGA type LSI package in which a heatsink having a plurality of fins is provided on the top surface, wherein a mounting hole for mounting a heatsink for adjusting thermal resistance is provided in a fin mounting portion of the heatsink.
Type LSI package.
JP16999988U 1988-12-28 1988-12-28 Pending JPH0289843U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16999988U JPH0289843U (en) 1988-12-28 1988-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16999988U JPH0289843U (en) 1988-12-28 1988-12-28

Publications (1)

Publication Number Publication Date
JPH0289843U true JPH0289843U (en) 1990-07-17

Family

ID=31460560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16999988U Pending JPH0289843U (en) 1988-12-28 1988-12-28

Country Status (1)

Country Link
JP (1) JPH0289843U (en)

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