JPH0289854U - - Google Patents

Info

Publication number
JPH0289854U
JPH0289854U JP1988170574U JP17057488U JPH0289854U JP H0289854 U JPH0289854 U JP H0289854U JP 1988170574 U JP1988170574 U JP 1988170574U JP 17057488 U JP17057488 U JP 17057488U JP H0289854 U JPH0289854 U JP H0289854U
Authority
JP
Japan
Prior art keywords
view
diode element
high frequency
diode
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988170574U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15907361&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH0289854(U) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed filed Critical
Priority to JP1988170574U priority Critical patent/JPH0289854U/ja
Priority to DE3943013A priority patent/DE3943013C2/en
Priority to GB8929207A priority patent/GB2226700B/en
Publication of JPH0289854U publication Critical patent/JPH0289854U/ja
Priority to SG594/93A priority patent/SG59493G/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/80—Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Semiconductor Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａは本考案を実施した高周波用ダイオー
ド装置の模式的平面図、第１図ｂはその模式的断
面図、第２図は外観図、第３図は等価回路図、第
４図は要部の構造図である。第５図は本考案の他
の実施例の模式的平面図、第６図は更に他の実施
例の模式的平面図である。第７図はＶＨＦチユー
ナーの入力同調回路部分を示す回路図である。 ４′……抵抗体、１２……ダイオードチツプ、
１５……樹脂、２０……ダイオード素子。 Fig. 1a is a schematic plan view of a high frequency diode device embodying the present invention, Fig. 1b is a schematic sectional view thereof, Fig. 2 is an external view, Fig. 3 is an equivalent circuit diagram, and Fig. 4 is a schematic plan view of a high frequency diode device implementing the present invention. It is a structural diagram of the main part. FIG. 5 is a schematic plan view of another embodiment of the present invention, and FIG. 6 is a schematic plan view of still another embodiment. FIG. 7 is a circuit diagram showing the input tuning circuit portion of the VHF tuner. 4'...Resistor, 12...Diode chip,
15...Resin, 20...Diode element.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ダイオード素子と該ダイオード素子の保護用抵
抗とを樹脂で一体にモールドしたことを特徴とす
る高周波用ダイオード装置。 A high frequency diode device characterized in that a diode element and a protective resistor for the diode element are integrally molded with resin.
JP1988170574U 1988-12-27 1988-12-27 Pending JPH0289854U (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1988170574U JPH0289854U (en) 1988-12-27 1988-12-27
DE3943013A DE3943013C2 (en) 1988-12-27 1989-12-27 TV tuner with an input stage that minimizes unwanted stray capacities
GB8929207A GB2226700B (en) 1988-12-27 1989-12-27 Encapsulated diode and protective resistance
SG594/93A SG59493G (en) 1988-12-27 1993-05-05 Encapsulated diode and protective resistance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988170574U JPH0289854U (en) 1988-12-27 1988-12-27

Publications (1)

Publication Number Publication Date
JPH0289854U true JPH0289854U (en) 1990-07-17

Family

ID=15907361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988170574U Pending JPH0289854U (en) 1988-12-27 1988-12-27

Country Status (4)

Country Link
JP (1) JPH0289854U (en)
DE (1) DE3943013C2 (en)
GB (1) GB2226700B (en)
SG (1) SG59493G (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10032389A1 (en) 2000-07-06 2002-01-17 Philips Corp Intellectual Pty Receiver with variable capacitance diode
NL2027146B1 (en) * 2020-12-17 2022-07-11 Ampleon Netherlands Bv A radiofrequency power package and device with improved ESD performance

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1047411A (en) *
JPS5393781A (en) * 1977-01-27 1978-08-17 Toshiba Corp Semiconductor device
JPS56122134A (en) * 1980-02-29 1981-09-25 Toshiba Corp Resin-sealed type semiconductor device
JPS6018145B2 (en) * 1980-09-22 1985-05-09 株式会社日立製作所 Resin-encapsulated semiconductor device
DE3522652A1 (en) * 1985-06-25 1987-01-08 Blaupunkt Werke Gmbh CIRCUIT ARRANGEMENT FOR TUNING RECEIVERS
US4847572A (en) * 1986-10-30 1989-07-11 Toko, Inc. Electronic tuning circuit for AM receiver

Also Published As

Publication number Publication date
SG59493G (en) 1993-07-09
GB2226700B (en) 1993-02-17
GB2226700A (en) 1990-07-04
DE3943013A1 (en) 1990-06-28
GB8929207D0 (en) 1990-02-28
DE3943013C2 (en) 1994-12-22

Similar Documents

Publication Publication Date Title
JPH0289854U (en)
JPS58166134U (en) electronic tuning tuner
JPH01126628U (en)
JPS6331627U (en)
JPS59181719U (en) Fixed structure of resin molded products
JPS63136343U (en)
JPH01179617U (en)
JPH01176937U (en)
JPS6344479U (en)
JPS6191182U (en)
JPH0330448U (en)
JPS63102254U (en)
JPS61116424U (en)
JPS6257431U (en)
JPH03126056U (en)
JPH045661U (en)
JPH01108964U (en)
JPH0247061U (en)
JPH0213736U (en)
JPH03126062U (en)
JPS60193631U (en) keyboard switch
JPH0262742U (en)
JPS60174311U (en) UHF oscillation circuit
JPH03101543U (en)
JPS5946024U (en) Trimmer integrated resonant line