JPH0289870U

JPH0289870U -

Info

Publication number: JPH0289870U
Application number: JP17055788U
Authority: JP
Priority date: 1988-12-28
Filing date: 1988-12-28
Publication date: 1990-07-17

Description

[Brief explanation of drawings]

第１図は本考案の第１実施例の両面実装用プリ
ント基板を示す図、第２図は第１図のプリント基
板の改造後の状態を示す図、第３図は本考案の第
２実施例の両面実装用プリント基板を示す図、第
４図は第３図のプリント基板の改造後の状態を示
す図、第５図は従来のプリント基板を示す図であ
る。図において、２０，７０は両面実装用プリント
基板、２１ａ，７１ａは上面、２１ｂ，７１ｂは
下面、２２−１ａ，２２−２ａ，２２−１ｂ，２
２−２ｂ，７２−１ａ〜７２−６ａ，７２−１ｂ
〜７２−６ｂは半田付けパツド、２３−１ａ，２
２−２ａ，７６ａは第１の上面改造用パツド、２
３−１ｂ，２３−２ｂ，７６ｂは第２の下面改造
用パツド、４０−１ａ，４０−２ａ，７８ａは第
２の上面改造用パツド、４０−１ｂ，４０−２ｂ
，７８ｂは第２の下面改造用パツド、６０〜６５
，１００は改造ワイヤ、を示す。 Fig. 1 is a diagram showing a printed circuit board for double-sided mounting according to the first embodiment of the present invention, Fig. 2 is a diagram showing the state of the printed circuit board in Fig. 1 after modification, and Fig. 3 is a diagram showing a second embodiment of the present invention. FIG. 4 is a diagram showing a modified printed circuit board of FIG. 3, and FIG. 5 is a diagram showing a conventional printed circuit board. In the figure, 20, 70 are printed circuit boards for double-sided mounting, 21a, 71a are upper surfaces, 21b, 71b are lower surfaces, 22-1a, 22-2a, 22-1b, 2
2-2b, 72-1a to 72-6a, 72-1b
~72-6b is a soldering pad, 23-1a, 2
2-2a, 76a are first top surface modification pads;
3-1b, 23-2b, 76b are second pads for modifying the lower surface; 40-1a, 40-2a, 78a are pads for modifying the second upper surface; 40-1b, 40-2b
, 78b is the second lower surface modification pad, 60 to 65
, 100 indicates a modified wire.

Claims

[Claims for Utility Model Registration] A printed circuit board having soldering pads on both sides to which terminals of surface mount components are soldered, wherein the upper surfaces 21a, 71 of the printed circuit boards 20, 70
a, solder pads 22-1a, 72- on the top surface
1a and to which one end of the first modification wire 60, 100 is connected at the time of modification, and a first top modification pad 23-1a, 76a to which the other end of the first modification wire is connected. 2 upper surface modification pads 40-1a and 78a, and are connected to the lower surface soldering pads 22-1a on the lower surfaces 21b and 71b of the printed circuit board, and one end of another modification wire 62 is connected to the lower surface soldering pad 22-1a at the time of modification. for double-sided mounting, comprising a first lower surface modification pad 23-1b to which is connected, and a second lower surface modification pad 41-1b to which the other end of the other modification wire is connected. Printed board.