JPH0289872U - - Google Patents
Info
- Publication number
- JPH0289872U JPH0289872U JP16953788U JP16953788U JPH0289872U JP H0289872 U JPH0289872 U JP H0289872U JP 16953788 U JP16953788 U JP 16953788U JP 16953788 U JP16953788 U JP 16953788U JP H0289872 U JPH0289872 U JP H0289872U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- gold
- slit
- plated terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
第１図の実施例の樹脂コート工程を説明するため
の印刷配線板の平面図、第３図は従来の印刷配線
板の一例の断面図である。
１……スリツト、２……面取り部、３……エポ
キシ樹脂、４……マスキングテープ、５……基材
、６……銅箔、７……金めつき。
Fig. 1 is a sectional view of an embodiment of the present invention, Fig. 2 is a plan view of a printed wiring board for explaining the resin coating process of the embodiment of Fig. 1, and Fig. 3 is a diagram of a conventional printed wiring board. It is a sectional view of an example. 1... Slit, 2... Chamfered portion, 3... Epoxy resin, 4... Masking tape, 5... Base material, 6... Copper foil, 7... Gold plating.
Claims (1)
板において、前記金めつき端子先端の面取り部及
びスリツト部にコートされる樹脂を有することを
特徴とする印刷配線板。 What is claimed is: 1. A printed wiring board comprising a gold-plated terminal with a slit, the printed wiring board comprising a resin coated on the chamfered portion of the tip of the gold-plated terminal and on the slit portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16953788U JPH0289872U (en) | 1988-12-28 | 1988-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16953788U JPH0289872U (en) | 1988-12-28 | 1988-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289872U true JPH0289872U (en) | 1990-07-17 |
Family
ID=31459690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16953788U Pending JPH0289872U (en) | 1988-12-28 | 1988-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289872U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008263156A (en) * | 2007-03-20 | 2008-10-30 | Hitachi Chem Co Ltd | Printed wiring board |
-
1988
- 1988-12-28 JP JP16953788U patent/JPH0289872U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008263156A (en) * | 2007-03-20 | 2008-10-30 | Hitachi Chem Co Ltd | Printed wiring board |
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