JPH029449U - - Google Patents
Info
- Publication number
- JPH029449U JPH029449U JP1988086577U JP8657788U JPH029449U JP H029449 U JPH029449 U JP H029449U JP 1988086577 U JP1988086577 U JP 1988086577U JP 8657788 U JP8657788 U JP 8657788U JP H029449 U JPH029449 U JP H029449U
- Authority
- JP
- Japan
- Prior art keywords
- island
- groove
- molded package
- cage
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01515—Forming coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988086577U JPH029449U (lt) | 1988-07-01 | 1988-07-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988086577U JPH029449U (lt) | 1988-07-01 | 1988-07-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH029449U true JPH029449U (lt) | 1990-01-22 |
Family
ID=31311215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988086577U Pending JPH029449U (lt) | 1988-07-01 | 1988-07-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH029449U (lt) |
-
1988
- 1988-07-01 JP JP1988086577U patent/JPH029449U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0390922U (lt) | ||
| JPS62166010U (lt) | ||
| JPS6185159U (lt) | ||
| JPH01176944U (lt) | ||
| JPH01176928U (lt) | ||
| JPH02104636U (lt) | ||
| JPS5991818U (ja) | スタ−テイツクミキサ−をもつリム成形型 | |
| JPH0234223U (lt) | ||
| JPS6411708U (lt) | ||
| JPS6448210U (lt) | ||
| JPH028139U (lt) | ||
| JPS5938003U (ja) | 立体化粧板用型装置 | |
| JPH0415854U (lt) | ||
| JPH0291351U (lt) | ||
| JPS6420314U (lt) | ||
| JPS6320446U (lt) | ||
| JPS61919U (ja) | 成形型 | |
| JPS6237937U (lt) | ||
| JPS611827U (ja) | 樹脂モ−ルドコイル | |
| JPH0181348U (lt) | ||
| JPH0362807U (lt) | ||
| JPS6455008U (lt) | ||
| JPS62134253U (lt) | ||
| JPS6186967U (lt) | ||
| JPH01148310U (lt) |