JPH029464U - - Google Patents
Info
- Publication number
- JPH029464U JPH029464U JP8698988U JP8698988U JPH029464U JP H029464 U JPH029464 U JP H029464U JP 8698988 U JP8698988 U JP 8698988U JP 8698988 U JP8698988 U JP 8698988U JP H029464 U JPH029464 U JP H029464U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- base film
- coverlay
- insulating flexible
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims 4
- 230000002265 prevention Effects 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図はこの考案の一実施例を示す正面図、第
２図は第１図の接続時における断面図、第３図は
従来の断面図、第４図は従来の正面図、第５図は
第４図の接続時における断面図である。
１０……ベースフイルム、１１……銅履、１２
……カバーレイ、１３……接続部、１４……露出
部、１５……補強部。
Fig. 1 is a front view showing an embodiment of this invention, Fig. 2 is a cross-sectional view of the connection shown in Fig. 1, Fig. 3 is a conventional cross-sectional view, Fig. 4 is a conventional front view, and Fig. 5. is a cross-sectional view when the connection shown in FIG. 4 is made. 10... Base film, 11... Copper shoes, 12
...coverlay, 13...connection section, 14...exposed section, 15...reinforcement section.
Claims (1)
のベースフイルムに固着した銅箔と、この銅箔の
全面をカバーする絶縁性のフレキシブルなカバー
レイとを備え、前記銅箔に直行する方向に所定の
幅で前記銅箔は全部露出し、前記カバーレイは一
部を残して前記銅箔の接続部として形成してなる
ことを特徴とするフレキシブル配線板の断線防止
装置。 It comprises an insulating flexible base film, a copper foil fixed to the base film, and an insulating flexible coverlay covering the entire surface of the copper foil. A disconnection prevention device for a flexible wiring board, characterized in that the copper foil is entirely exposed, and a portion of the coverlay is formed as a connecting portion of the copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8698988U JPH029464U (en) | 1988-06-30 | 1988-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8698988U JPH029464U (en) | 1988-06-30 | 1988-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH029464U true JPH029464U (en) | 1990-01-22 |
Family
ID=31311626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8698988U Pending JPH029464U (en) | 1988-06-30 | 1988-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH029464U (en) |
-
1988
- 1988-06-30 JP JP8698988U patent/JPH029464U/ja active Pending