JPH0295242U - - Google Patents
Info
- Publication number
- JPH0295242U JPH0295242U JP1989002985U JP298589U JPH0295242U JP H0295242 U JPH0295242 U JP H0295242U JP 1989002985 U JP1989002985 U JP 1989002985U JP 298589 U JP298589 U JP 298589U JP H0295242 U JPH0295242 U JP H0295242U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- light emitting
- emitting element
- light receiving
- receiving element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の第１の実施例の回路図、第２
図は本考案による共通リードと樹脂モールド金型
との関係を説明するための断面模式図、第３図は
本考案の第２の実施例の回路図、第４図は従来の
半導体光結合装置の一例の回路図、第５図ａ，ｂ
は従来の半導体光結合装置の共通リードと樹脂モ
ールド金型との関係を説明するための断面模式図
である。
１…容器、２，３…共通リード、４…外部リー
ド、５…透明樹脂、６…遮光性樹脂、Ｄ１，Ｄ２
…発光素子、ＰＳ１，ＰＳ２…受光素子、Ｔ１，
Ｔ２…共通端子。
Figure 1 is a circuit diagram of the first embodiment of the present invention;
The figure is a schematic cross-sectional view for explaining the relationship between the common lead and the resin mold according to the present invention, Figure 3 is a circuit diagram of the second embodiment of the present invention, and Figure 4 is a conventional semiconductor optical coupling device. An example circuit diagram of Figure 5 a, b
1 is a schematic cross-sectional view for explaining the relationship between a common lead and a resin molding die of a conventional semiconductor optical coupling device. 1... Container, 2, 3... Common lead, 4... External lead, 5... Transparent resin, 6... Light shielding resin, D 1 , D 2
... Light emitting element, PS 1 , PS 2 ... Light receiving element, T 1 ,
T2 ...Common terminal.
Claims (1)
結合した第１の光結合装置と、第１の発光素子と
第２の受光素子とを光学的に結合し、かつ前記第
１の発光素子の一つの電極を前記第２の発光素子
の一つの電極とを一つの外部引出し端子に共通接
続し、前記第１の受光素子の一つの電極と前記第
２の受光素子の一つの電極とを他の一つの外部引
出し端子に共通接続して成る第２の光接合装置と
をそれぞれ別個に透明樹脂で封止した後前記第１
及び第２の光結合装置を遮光性樹脂で一体化封止
して成る半導体光結合装置において、中央部と左
部及び右部とがほぼ平行でかつ前記中央部と左部
及び右部とほぼ直角な辺で結ばれた井戸型に折曲
げられた共通リードでそれぞれ前記第１の発光素
子の一つの電極と第２の発光素子の一つの電極と
を、及び第１の受光素子の一つの電極と第２の受
光素子の一つの電極とを接続したことを特徴とす
る半導体光結合装置。 a first optical coupling device that optically couples a first light emitting element and a first light receiving element; and a first optical coupling device that optically couples a first light emitting element and a second light receiving element; One electrode of the light emitting element and one electrode of the second light emitting element are commonly connected to one external lead terminal, one electrode of the first light receiving element and one electrode of the second light receiving element. and a second optical junction device formed by commonly connecting the two external lead-out terminals to another external lead-out terminal, respectively, and separately sealed with a transparent resin.
and a semiconductor optical coupling device formed by integrally sealing a second optical coupling device with a light-shielding resin, wherein the central portion, the left portion, and the right portion are substantially parallel, and the central portion, the left portion, and the right portion are approximately parallel to each other; A common lead bent into a well shape connected at right angles connects one electrode of the first light emitting element, one electrode of the second light emitting element, and one electrode of the first light receiving element, respectively. A semiconductor optical coupling device characterized in that an electrode and one electrode of a second light receiving element are connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989002985U JPH0295242U (en) | 1989-01-13 | 1989-01-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989002985U JPH0295242U (en) | 1989-01-13 | 1989-01-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0295242U true JPH0295242U (en) | 1990-07-30 |
Family
ID=31204225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989002985U Pending JPH0295242U (en) | 1989-01-13 | 1989-01-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0295242U (en) |
-
1989
- 1989-01-13 JP JP1989002985U patent/JPH0295242U/ja active Pending
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