JPH0295250U - - Google Patents
Info
- Publication number
- JPH0295250U JPH0295250U JP1989004706U JP470689U JPH0295250U JP H0295250 U JPH0295250 U JP H0295250U JP 1989004706 U JP1989004706 U JP 1989004706U JP 470689 U JP470689 U JP 470689U JP H0295250 U JPH0295250 U JP H0295250U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- lead frame
- view
- sealed insulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989004706U JPH0295250U (2) | 1989-01-18 | 1989-01-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989004706U JPH0295250U (2) | 1989-01-18 | 1989-01-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0295250U true JPH0295250U (2) | 1990-07-30 |
Family
ID=31207455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989004706U Pending JPH0295250U (2) | 1989-01-18 | 1989-01-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0295250U (2) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104741685A (zh) * | 2015-04-10 | 2015-07-01 | 苏州斯莱克精密设备股份有限公司 | 一种用于金属罐的罐口切边装置 |
-
1989
- 1989-01-18 JP JP1989004706U patent/JPH0295250U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104741685A (zh) * | 2015-04-10 | 2015-07-01 | 苏州斯莱克精密设备股份有限公司 | 一种用于金属罐的罐口切边装置 |