JPH029599Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a vertical board conveyance mechanism capable of laterally transporting a printed circuit board in a state in which it is vertically and slidably supported.

Conventional board transport mechanisms generally support and transport printed circuit boards in a horizontal position so that they can slide freely, and a mounting head for mounting electronic components is provided above the board transport mechanism to load electronic components from above. It is now possible to carry out the installation of Therefore, there is a drawback that a large space is required in the horizontal direction. Furthermore, if it is necessary to mount electronic components on the lower surface of the printed circuit board, it is necessary to provide a mechanism for reversing the printed circuit board.

In view of the above points, the present invention makes it possible to vertically support and transport printed circuit boards in a slidable manner, thereby reducing the horizontal space and making it possible to mount electronic components on both sides of the printed circuit board. The present invention aims to provide a simplified vertical substrate transport mechanism.

Embodiments of the vertical substrate transport mechanism according to the present invention will be described below with reference to the drawings.

In FIGS. 1 and 2, an upper guide rail 2 and a lower guide rail 3 are provided to support the printed circuit board 1 vertically and slidably. The upper guide rail 2 is attached to the upper frame 4 via adjustment bolts 5 so as to be vertically adjustable, and the lower guide rail 3 is fixed on the base surface 6. A leaf spring 9 is provided on the upper guide rail 2 to prevent the printed circuit board 1 from wobbling. Further, on the lower guide rail 3, an endless band, for example a chain 7, runs along the printed circuit board 1, and the chain 7 has engaging members 8 that engage with the rear end of the circuit board at regular intervals. installed. Board position A is a position where electronic components are mounted, and board positioning pins 11 are disposed along the lower guide rail 3 so as to fit into positioning holes 10 of the printed circuit board 1 at this position.

On the left side of the board position A, as shown in FIG. 2, for example, an insertion head mechanism 21 having an insertion head 20 for inserting electronic components with lead wires, irregularly shaped electronic components, etc. is provided. Further, on the right side of the substrate position A facing this, a clinch mechanism 22 for bending (clinching) the lead wires of the electronic components is disposed.

In the above configuration, the printed circuit board 1 whose rear end is pushed by the engagement member 8 due to the intermittent running of the chain 7
moves vertically forward by a fixed amount to the right. When the printed circuit board 1 is vertically moved to the board position A, the board positioning pins 11 fit into the positioning holes 10 on the board side, thereby positioning the printed circuit board 1. Next, the insertion head 20, which has been sequentially supplied with electronic components from the component supply section 25, performs a predetermined insertion operation from the left side of the printed circuit board 1, and inserts the lead wires of the electronic components into the holes of the printed circuit board 1. At the same time, the right clinch mechanism 22 bends the lead wire of the electronic component.

According to the above embodiment, since the printed circuit board 1 is transported in a vertical state, there is an advantage that it does not take up much space in the horizontal direction. Furthermore, by arranging the mounting heads on the left and right sides of the printed circuit board 1, electronic components can be easily mounted on both sides of the board without reversing the board.

As shown in FIG. 3, instead of the leaf spring, a pulley 32 is provided on the shaft 31 that engages with the long hole 30 of the top guide rail 2, and the pulley 32 is pushed downward (in the direction of pressing the printed circuit board 1) by the spring 33. A structure that biases the body may also be used.

As explained above, according to the vertical substrate transfer mechanism of the present invention, printed circuit boards can be vertically and slidably supported and transferred, thereby reducing the horizontal space and providing space for both sides of the printed circuit board. Mounting of electronic components can be facilitated.

[Brief explanation of drawings]

FIG. 1 is a schematic front view of an embodiment of the vertical board transport mechanism according to the present invention, FIG. 2 is a side view at board position A, and FIG. 3 is a front view showing another example of the configuration of the upper guide rail portion. be. 1... Printed circuit board, 2... Top guide rail, 3... Bottom guide rail, 7... Chain,
8...Engagement member.

Claims (1)

[Scope of utility model registration request] A board is slidably supported vertically by a top guide rail and a bottom guide rail, one of which is vertically adjustable, and one of the board positioning pins, which can be fitted into the positioning holes of the board, are supported vertically and slidably. The board is transported by an endless band disposed along the guide rail, and has an engaging member that intermittently runs parallel to the upper and lower guide rails and engages with the rear end of the board, and stops the board. A vertical board conveyance mechanism, characterized in that the positioning pin is fitted into the positioning hole.