JPH03101521U - - Google Patents

Info

Publication number
JPH03101521U
JPH03101521U JP1990009193U JP919390U JPH03101521U JP H03101521 U JPH03101521 U JP H03101521U JP 1990009193 U JP1990009193 U JP 1990009193U JP 919390 U JP919390 U JP 919390U JP H03101521 U JPH03101521 U JP H03101521U
Authority
JP
Japan
Prior art keywords
semiconductor device
die
groove
chip
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990009193U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990009193U priority Critical patent/JPH03101521U/ja
Publication of JPH03101521U publication Critical patent/JPH03101521U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements

Landscapes

  • Wire Bonding (AREA)
JP1990009193U 1990-02-01 1990-02-01 Pending JPH03101521U (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990009193U JPH03101521U (2) 1990-02-01 1990-02-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990009193U JPH03101521U (2) 1990-02-01 1990-02-01

Publications (1)

Publication Number Publication Date
JPH03101521U true JPH03101521U (2) 1991-10-23

Family

ID=31512797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990009193U Pending JPH03101521U (2) 1990-02-01 1990-02-01

Country Status (1)

Country Link
JP (1) JPH03101521U (2)

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