JPH03102709A - Polyamide-imide ester resin and insulated wire - Google Patents
Polyamide-imide ester resin and insulated wireInfo
- Publication number
- JPH03102709A JPH03102709A JP24163889A JP24163889A JPH03102709A JP H03102709 A JPH03102709 A JP H03102709A JP 24163889 A JP24163889 A JP 24163889A JP 24163889 A JP24163889 A JP 24163889A JP H03102709 A JPH03102709 A JP H03102709A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- polyamide
- acid
- polyisocyanate
- derivative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 58
- 239000011347 resin Substances 0.000 title claims abstract description 58
- 239000004962 Polyamide-imide Substances 0.000 title claims abstract description 32
- 229920002312 polyamide-imide Polymers 0.000 title claims abstract description 32
- 150000002148 esters Chemical class 0.000 title claims abstract description 13
- 239000002253 acid Substances 0.000 claims abstract description 29
- 239000005056 polyisocyanate Substances 0.000 claims abstract description 29
- 229920001228 polyisocyanate Polymers 0.000 claims abstract description 29
- 229920003055 poly(ester-imide) Polymers 0.000 claims abstract description 19
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 13
- 125000003118 aryl group Chemical group 0.000 claims abstract description 12
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims abstract description 7
- 239000002904 solvent Substances 0.000 claims abstract description 7
- 239000004020 conductor Substances 0.000 claims abstract description 5
- 239000004135 Bone phosphate Substances 0.000 claims description 7
- 150000002989 phenols Chemical class 0.000 claims description 7
- 239000003507 refrigerant Substances 0.000 abstract description 10
- 239000004952 Polyamide Substances 0.000 abstract description 2
- 229920002647 polyamide Polymers 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 abstract 2
- 238000005461 lubrication Methods 0.000 abstract 2
- 238000006243 chemical reaction Methods 0.000 description 17
- 239000000243 solution Substances 0.000 description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 11
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 10
- 125000005442 diisocyanate group Chemical group 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- 229930003836 cresol Natural products 0.000 description 9
- 239000002966 varnish Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- -1 aromatic dicarboxylic acid ester Chemical class 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 229920002292 Nylon 6 Polymers 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 239000000314 lubricant Substances 0.000 description 4
- 239000010726 refrigerant oil Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005187 foaming Methods 0.000 description 3
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 3
- MTZUIIAIAKMWLI-UHFFFAOYSA-N 1,2-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC=C1N=C=O MTZUIIAIAKMWLI-UHFFFAOYSA-N 0.000 description 2
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- HPEUJPJOZXNMSJ-UHFFFAOYSA-N Methyl stearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC HPEUJPJOZXNMSJ-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 150000001735 carboxylic acids Chemical group 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- VKOBVWXKNCXXDE-UHFFFAOYSA-N icosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCC(O)=O VKOBVWXKNCXXDE-UHFFFAOYSA-N 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- ISYWECDDZWTKFF-UHFFFAOYSA-N nonadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCCC(O)=O ISYWECDDZWTKFF-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 2
- XEZVDURJDFGERA-UHFFFAOYSA-N tricosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCC(O)=O XEZVDURJDFGERA-UHFFFAOYSA-N 0.000 description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 2
- VNMOIBZLSJDQEO-UHFFFAOYSA-N 1,10-diisocyanatodecane Chemical compound O=C=NCCCCCCCCCCN=C=O VNMOIBZLSJDQEO-UHFFFAOYSA-N 0.000 description 1
- ZTNJGMFHJYGMDR-UHFFFAOYSA-N 1,2-diisocyanatoethane Chemical compound O=C=NCCN=C=O ZTNJGMFHJYGMDR-UHFFFAOYSA-N 0.000 description 1
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 description 1
- IKYNWXNXXHWHLL-UHFFFAOYSA-N 1,3-diisocyanatopropane Chemical compound O=C=NCCCN=C=O IKYNWXNXXHWHLL-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- QUPKOUOXSNGVLB-UHFFFAOYSA-N 1,8-diisocyanatooctane Chemical compound O=C=NCCCCCCCCN=C=O QUPKOUOXSNGVLB-UHFFFAOYSA-N 0.000 description 1
- GHSZVIPKVOEXNX-UHFFFAOYSA-N 1,9-diisocyanatononane Chemical compound O=C=NCCCCCCCCCN=C=O GHSZVIPKVOEXNX-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- 235000021357 Behenic acid Nutrition 0.000 description 1
- 244000188595 Brassica sinapistrum Species 0.000 description 1
- 235000004977 Brassica sinapistrum Nutrition 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- 235000021353 Lignoceric acid Nutrition 0.000 description 1
- CQXMAMUUWHYSIY-UHFFFAOYSA-N Lignoceric acid Natural products CCCCCCCCCCCCCCCCCCCCCCCC(=O)OCCC1=CC=C(O)C=C1 CQXMAMUUWHYSIY-UHFFFAOYSA-N 0.000 description 1
- 241001139947 Mida Species 0.000 description 1
- 229920000715 Mucilage Polymers 0.000 description 1
- KYIMHWNKQXQBDG-UHFFFAOYSA-N N=C=O.N=C=O.CCCCCC Chemical compound N=C=O.N=C=O.CCCCCC KYIMHWNKQXQBDG-UHFFFAOYSA-N 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 101100111862 Schizosaccharomyces pombe (strain 972 / ATCC 24843) but2 gene Proteins 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 229940116226 behenic acid Drugs 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- CAPXPQVDOOOYGS-UHFFFAOYSA-N diisocyanatosilane Chemical compound O=C=N[SiH2]N=C=O CAPXPQVDOOOYGS-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- KFEVDPWXEVUUMW-UHFFFAOYSA-N docosanoic acid Natural products CCCCCCCCCCCCCCCCCCCCCC(=O)OCCC1=CC=C(O)C=C1 KFEVDPWXEVUUMW-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- CAMHHLOGFDZBBG-UHFFFAOYSA-N epoxidized methyl oleate Natural products CCCCCCCCC1OC1CCCCCCCC(=O)OC CAMHHLOGFDZBBG-UHFFFAOYSA-N 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 239000010721 machine oil Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- POULHZVOKOAJMA-UHFFFAOYSA-N methyl undecanoic acid Natural products CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- RLZZZVKAURTHCP-UHFFFAOYSA-N phenanthrene-3,4-diol Chemical compound C1=CC=C2C3=C(O)C(O)=CC=C3C=CC2=C1 RLZZZVKAURTHCP-UHFFFAOYSA-N 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- QZZGJDVWLFXDLK-UHFFFAOYSA-N tetracosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCC(O)=O QZZGJDVWLFXDLK-UHFFFAOYSA-N 0.000 description 1
- 238000002411 thermogravimetry Methods 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
【発明の詳細な説明】
[発明の目的]
(産業上の利用分デf)
本発明は、潤滑性に優れた、耐冷媒用モータに好適なポ
リアミドイミドエステル樹脂及び絶縁電線に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Def) The present invention relates to a polyamide-imide ester resin having excellent lubricity and suitable for refrigerant-resistant motors, and an insulated wire.
〈従来の技術冫
近年、省エネルギーの立陽から各種モータ、各種トラン
スの効率を、さらに1rり上させることが望まれ゛ζお
り、特にターラ、エアー;lンディシコナ、冷蔵庫等の
冷凍機用モータをはじめとする各種モータの効率を上げ
ることが強く要望されている.これらの各種モータの効
率化を図るため、狭いス11ットの中にさらに多くのエ
ナメル線を挿入し、占積率をより高めるという手段がと
られるようになってきた. 従来より、冷凍機用モータ
は、機械的強度、耐摩耗性に優れ、また耐冷媒用にも優
れるポリエステルイミド電線やポリアミドイミドオーバ
ーコートの電線が主に使用されてきた.(発明が解決し
ようとする課題)
しかしながら、上述したようにスロット中に挿入される
エナメル線の占積率を高めるためには、冷凍機油等の液
体の潤滑剤を用いたのでは、潤滑性、すべり性に欠ける
ため、占積率を上げることが困難となった. 一方、固
形バラフィン、カルバナロウ等の固形潤滑剤をエナメル
線に塗布することも試みられている. しかし、固形潤
滑剤を塗布したエナメル線を冷凍機用モータに適用する
と、冷媒により抽出される固形潤滑剤がコンプレッサー
の弁や膨脹機内の冷媒吹き出しノズル等で目づまりを起
こし、冷凍能力を低下させる欠点があった. これらの
欠点を解消するため、ポリアミドイミド樹脂に炭素数2
1以上のisのカルボン酸又はその誘導体を反応させて
、それ自体に潤滑性を有せしめる絶縁電線の提案もなさ
れている(例えば特公昭63−51193号公報、特開
昭57−209967号公報). これらに使用されて
いるポリアミドイミド樹脂は、基本的にN−メチル−2
−ピロリドンのような非プロトン系極性溶媒を使用して
おり、そのためワニスが高価になり工業的有用性に乏し
いという欠点がある. また、ポリエステル樹脂やポリ
エステルイミド樹脂に、炭素数21以上の直鎖のカルボ
ン酸又はその誘導体を反応させて、それ自体に潤滑性を
イfせしめる絶縁電線も提案されている. しかしなが
ら、これを耐冷媒用絶縁電線として使用する場合、実質
上、ポリエステルイミド樹脂/ポリアミドイミド樹脂の
ダブルコートとなるため、工程が複雑で絶縁電線がコス
ト高となる欠点があった.
本発明は、上記の事情に鑑みてなされたもので、潤滑性
、すべり性、耐劣化性、耐冷媒油性に優れたポリアミド
イミドエステル樹脂及びこれを塗布焼き付けてなる絶縁
電線を提供しようとするものである.
[発明の構成1
(課題を解決するための手段)
本発明者らは、フェノール類に可一溶性のポリアミドイ
ミド樹脂に、滑剤変性ポリエステルイミド樹脂を配合す
ることによって潤滑性、ずベリ性、耐劣化性、耐冷媒抽
性に優れた樹脂が得られることを見いだし、本発明を完
成したものである.すなわち、本発明は、
(A)(a)酸成分全体の少なくとも5モル%の二塩基
酸又はその誘導体を含む三塩基酸又はその誘導体からな
る多価カルボン酸と、(b )ポリイソシアネーi〜又
はその誘尋体とを、当量比で1:1の割合でポリアミド
a脂共存下のフェノール系溶媒中で反応させてなるポリ
アミドイミド樹脂、(B)フェノール類でマスクされた
芳香族ポリイソシアネート、及び
(C)滑剤変性ポリエステルイミド樹脂、を必須成分と
することを特徴とするポリアミドイミドエステル樹脂、
並びにそれを塗布・焼f寸してなる絶縁電線である.
以下、本発明を詳細に説明する.
本発明に用いる(A)ポリアミドイミド樹脂は<a >
多価カルボン酸と(b )ポリイソシアネート又はその
2A IQ体とを1=1の当量比でポリアミド樹脂共存
下のフェノール系溶媒中で反応させて得られるものであ
る。 (a )多価カルボン酸は酸成分全体の少なく
とも5モル%の二1M基酸又はその銹尋体を含む三塙基
酸又はその講導体がらなるものである.
二塩基酸又はその誘導体としては、例えば式<I)で示
される芳香族ジカルボン酸、芳香族ジカルボン酸エステ
ル等が用いられる.
R’ OOC−几’ −COOR’ ・・・<I
)ここでR1は、水素原子、アルキル基、フエニル基を
、R2は
R“(COOR’ )3
・・・(n)
(但しXはーCH2+,−co 一,−so2−C (
C H3) 2 . 0−)を表す.これらの化合
物として一般的には、反応性、経済性等により、イソフ
タル酸、テレフタル酸を用いるのが望ましい. 二塩基
酸又はその誘導体の配合割合は、酸成分全体の少なくと
も5モル%であることが好ましい。 5モル%末満で
は絶縁塗膜の可視性に効果なく好ましくない. 可撓性
、ミダ体との密着性、耐クレージング性を改善するには
20モル%以上であることが望ましい.三塩基酸又はそ
の誘導体としては、例えば式(n)、(In)で示され
る芳香族トリ力ルボン酸、芳香族トリ力ルボン酸エステ
ル、芳香族トリ力ルボン酸無水物等が挙げられ、これら
は単独又は2種以上混合して使用する.
ここにRI R’は、水素原子、アルキル基、フェニル
基を、R’ ,R’は
(但し、YはーCH2+,−co+,−302 一C
(C H3 ) 2−.一〇)を表す. これの化合物
として一般的には、耐熱性、高い反応性、経済性等から
トリメリット酸無水物が使用される.二塩基酸若しくは
その誘導体、又は三塩基酸若しくはその誘導体の一部を
少量、例えば酸成分全体の5モル%未満のピロメリット
酸無水物、3.3′4,4′−ベンゾフエノンテトラカ
ルボン酸無水物、3.3’, 4.4’−ジフェニルテ
トラカルボン酸無水物、?タンテトラカルボン酸無水物
等の四塩基酸又はその誘導体、シュウ酸、マロン酸、コ
ハク酸、グルタル酸、アジビン酸、ピメリン酸、スベリ
ン酸、アゼライン酸等の脂肪族二塩基酸又はその誘導体
で置換するこどもできる。<Conventional technology> In recent years, it has been desired to further increase the efficiency of various motors and various transformers by 1r due to energy saving. There is a strong demand for increasing the efficiency of various motors such as motors. In order to improve the efficiency of these various motors, measures have been taken to insert more enamelled wires into a narrow slot to further increase the space factor. Traditionally, refrigerator motors have mainly used polyester-imide wires and polyamide-imide overcoated wires, which have excellent mechanical strength, wear resistance, and resistance to refrigerants. (Problem to be Solved by the Invention) However, as described above, in order to increase the space factor of the enameled wire inserted into the slot, using a liquid lubricant such as refrigerating machine oil does not improve the lubricity. The lack of slip properties made it difficult to increase the space factor. On the other hand, attempts have also been made to apply solid lubricants such as solid paraffin and carbanal wax to enamelled wire. However, when enameled wire coated with a solid lubricant is applied to a refrigerator motor, the solid lubricant extracted by the refrigerant may clog the compressor valve or refrigerant blowout nozzle in the expander, reducing the refrigerating capacity. was there. In order to eliminate these drawbacks, we added 2 carbon atoms to polyamide-imide resin.
There have also been proposals for insulated wires that are made to have lubricating properties by reacting with one or more IS carboxylic acids or derivatives thereof (for example, Japanese Patent Publication No. 51193/1983, Japanese Patent Application Laid-Open No. 209967/1982). .. The polyamideimide resin used in these products is basically N-methyl-2
-Uses an aprotic polar solvent such as pyrrolidone, which has the drawback of making the varnish expensive and lacking in industrial utility. Insulated wires have also been proposed in which polyester resins or polyesterimide resins are reacted with linear carboxylic acids having 21 or more carbon atoms or derivatives thereof to impart lubricity to the wire itself. However, when this is used as a refrigerant-resistant insulated wire, it is essentially a double coat of polyesterimide resin/polyamideimide resin, which has the disadvantage that the process is complicated and the cost of the insulated wire is high. The present invention has been made in view of the above circumstances, and aims to provide a polyamide-imide ester resin having excellent lubricity, slipperiness, deterioration resistance, and refrigerant oil resistance, and an insulated wire made by coating and baking the same. It is. [Structure 1 of the Invention (Means for Solving the Problems) The present inventors have achieved lubricity, slip resistance, and resistance by blending a lubricant-modified polyesterimide resin with a polyamideimide resin that is soluble in phenols. It was discovered that a resin with excellent deterioration resistance and refrigerant extraction resistance could be obtained, and the present invention was completed. That is, the present invention provides (A) a polyhydric carboxylic acid consisting of a tribasic acid or a derivative thereof containing at least 5 mol % of a dibasic acid or a derivative thereof based on the total acid component; and (b) a polyisocyanate i. - or a derivative thereof at an equivalent ratio of 1:1 in a phenolic solvent in the coexistence of polyamide a fat, (B) aromatic polyisocyanate masked with phenols , and (C) a lubricant-modified polyesterimide resin, a polyamideimide ester resin characterized in that it has as an essential component,
It is also an insulated wire made by coating and baking it. The present invention will be explained in detail below. (A) Polyamideimide resin used in the present invention is <a>
It is obtained by reacting a polyhydric carboxylic acid and (b) polyisocyanate or its 2A IQ form at an equivalent ratio of 1=1 in a phenolic solvent in the coexistence of a polyamide resin. (a) The polyhydric carboxylic acid consists of a 21M base acid or a Mitsanawa base acid or its conductor containing at least 5 mol % of the total acid component. As the dibasic acid or its derivative, for example, an aromatic dicarboxylic acid or an aromatic dicarboxylic acid ester represented by the formula <I) can be used. R'OOC-几'-COOR'...<I
) Here, R1 is a hydrogen atom, an alkyl group, or a phenyl group, and R2 is R"(COOR')3...(n) (However, X is -CH2+, -co, -so2-C (
C H3) 2. 0-). Generally, it is desirable to use isophthalic acid and terephthalic acid as these compounds due to reactivity, economical efficiency, etc. The proportion of the dibasic acid or its derivative is preferably at least 5 mol % of the total acid components. If it is less than 5 mol%, it has no effect on the visibility of the insulating coating and is not preferred. In order to improve flexibility, adhesion to mida bodies, and crazing resistance, the content is preferably 20 mol% or more. Examples of tribasic acids or derivatives thereof include aromatic tricarboxylic acids, aromatic tricarboxylic acid esters, aromatic tricarboxylic acid anhydrides, and the like represented by formulas (n) and (In). may be used alone or in combination of two or more. Here, RI R' is a hydrogen atom, an alkyl group, or a phenyl group, and R' and R' are (however, Y is -CH2+, -co+, -3021C
(C H3 ) 2-. 10). Trimellitic anhydride is generally used as this compound due to its heat resistance, high reactivity, and economic efficiency. A small amount of a dibasic acid or a derivative thereof, or a part of a tribasic acid or a derivative thereof, such as less than 5 mol% of the total acid component, such as pyromellitic anhydride, 3,3'4,4'-benzophenonetetracarboxylic acid, etc. Acid anhydride, 3.3', 4.4'-diphenyltetracarboxylic acid anhydride, ? Substitution with tetrabasic acids or derivatives thereof such as tantetracarboxylic anhydride, aliphatic dibasic acids or derivatives thereof such as oxalic acid, malonic acid, succinic acid, glutaric acid, adivic acid, pimelic acid, suberic acid, azelaic acid, etc. Children can do it.
本発明に用いる<A>ポリアミドイミド樹脂の他方の成
分である(b )ポリイソシアネート又はその講導体と
しては、脂肪族、脂環族、芳香族のジイソシアネートが
土に使用される.
適当なジイソシアネートとしては、例えばエチレンジイ
ソシアネート、トリメチレンジイソシアネート、テトラ
メチレンジイソシアネート、ベンタメチレンジイソシア
ネート、ヘキサメチレンジイソシアネート、ペプタメチ
レンジイソシアネート、オクタメチレンジイソシアネー
ト、ノナメチレンジイソシアネート、デカメチレンジイ
ソシアネート、トリメチルへキサメチレンジイソシアネ
ート、モルフォリンジイソシアネー1・、シク口ヘキサ
ンジイソシアネ−1・、3,9−ビス(3−イソシアン
酸プロビル)−2■4.8.10−テl・ラオキサスピ
ロ[ 5,5]ウンデカン、4.4′−ジフェニルメタ
ンジイソシアネート、4.4′−ジフエニルエーテルジ
イソシアネート、4.4′−ジフェニルプロパンジイソ
シアネート、4.4′−ジフエニルスルホンジイソシア
ネ−1−、3.3′−ジフェニルスルホンジイソシアネ
ート、4.4′−ジフエニルスルフィッドジイソシアネ
ート、3.3′−ジメチル−4.4′−ジフェニルメタ
ンジイソシアネート、3.3′−ジクロロー.4.4’
−ジフェニルメタンジイソシアネート、3.3′−ジメ
チル−4,4′−ビスフェニルジイソシアネート、3.
3′−ジメトキシー4.4′−ビスフェニルジイソシア
ネー1・、4.4′−ビスフエニルジイソシアネー1−
、訃フエニレンジイソシアネート、ρ−7エニレンジイ
ソシアネート、2.4−トリレンジ、インシアネー1・
、2.6−トリレンジイソシアネート、n4シリレンジ
イソシアネート、p−キシリレンジイソシアネート等が
挙げられ、これらは単独又は2種以上混合してf史用す
ることができる.
ジイソシアネート以外のポリイソシアネートとしては、
例えば、ポリメチレンポリフエニルポリイソシアネート
、4.4’, 4″一トリイソシアネートトリフェニル
メタン、2.2’, 5.5”−テトライソシアネート
−4.4′−ジメチルジフェニルメタン、2,4.4′
−ジフエニルエーテルトリイソシアネート、トリス(4
−メチル−4−イソシアネートフェニル)インシアヌレ
ート等を挙げることができる. またポリイソシアネー
トのイソシアネート基をフェノール、クレゾール、キシ
レノール等のフェノール類でマスクしたポリイソシアネ
ート誘導体も使用することができる. これらのポリイ
ソシアネートは、得られるポリアミドイミド樹脂の耐熱
性、機械的性質等の要求特性により適宜選択されるが、
電気絶縁ワニスとして特に要求される絶縁皮膜の耐熱性
、機械的特性、経済性の点から芳香族ジイソシアネート
類が好ましい。 その中でも4.4′−ジフエニルメタ
ンジイソシアネート、2,4−トリレンジイソシアネー
ト、2.6−トリレンジイソシアネート、i−Iシリレ
ンジイソシアネート、p−キシリレンジイソシアネート
、4,4′−ジフエニルエーテルジイソシアネートが好
ましい, これらのジイソシアネートはフェノール類で
マスクされた誘桿体の単独又は混合物であることが、前
記特性をもたせるために特に好ましい.
ポリイソシアネート又はその誘導体の配合割合は、二塩
基酸又はその誘導体と三塩基酸又はその誘導体をそれぞ
れ2当量、3当量とした酸成分と、ポリイソシアネート
又はその誘導体のインシアネート成分が当量比で1:1
であることが好ましい.(a )多価カルボン酸と(b
)ポリイソシアネート又はその誘導体とを、ポリアミ
ド樹脂の共存下フェノール系溶媒中で150〜250゜
Cの温度で2〜20時間反応させてポリアミドイミド樹
脂を得る.ここで使用するフェノール系溶媒としては、
フェノール、0−クレゾール、訃クレゾール、p−クレ
ゾール、キシレノール類、クロルフェノール類が用いら
れる. この反応に用いるポリアミド樹脂としては、ナ
イロン6、ナイロン12、ナイロン6・6、ナイロン6
・l2、ナイロン11等が挙げられる. これらの中で
もナイロン6、ナイロン6・6を使用した場合、反応時
間が他のナイロンの時より短く、エナメル線の耐摩耗性
に優れるという利点があるが、要求特性によって適宜選
択することができる. ポリアミド樹脂は、(a )多
価カルボン醜と(b )ポリイソシアネート又はその請
導体との反応開始時に同時に仕込んでもよく、また、一
つの戚分を溶剤に溶解させておき、他の戚分を一時に、
或いは数回に分けて仕込むこともでき、特に仕込み方法
について制限はない. しかし、高分子量のポリアミド
イミド樹脂を得るためには、ポリアミド樹脂を反応開始
時から仕込むことが好ましい. 一方絶縁ワニスとして
用いる場合には、エナメル皮膜を形成する焼付工程にお
いても反応が進行するため、ワニス合成段階においては
比較的後半にポリアミド樹脂を加えることらできる.
ポリアミドイミド樹脂の反応にお番フるポリアミド樹脂
の働きについては明確ではないが、多価カルボン酸とポ
リイソシアネート又はその誘導体との反応を著しく促進
させること、得られたポリアミドイミド樹脂が(Uれた
溶解性を示すことおよび赤外チャート、熱重量分析、ゲ
ル浸透クロマトグラフによる分子量分布測定結果等から
ポリアミドイミド樹脂とポリアミド樹脂が相互に反応一
体化していることが推測される. 、これは、三塩基酸
又はその誘導体とポリイソシアネート又はその誘導体と
の反応において、ポリアミド樹脂がマトリックス効果を
示すと同時に、ポリアミド樹脂のアミド基を中心に高分
子化反応が起こっているものと考えられる. このため
、ポリアミド樹脂の配合割合は、マトリックス効果を発
現させるのに十分な量又は得られるポリアミドイミド樹
脂の使用目的、要求特性に応じて変えることができる。As the polyisocyanate or its conductor (b), which is the other component of the <A> polyamideimide resin used in the present invention, aliphatic, alicyclic, and aromatic diisocyanates are used. Suitable diisocyanates include, for example, ethylene diisocyanate, trimethylene diisocyanate, tetramethylene diisocyanate, bentamethylene diisocyanate, hexamethylene diisocyanate, peptamethylene diisocyanate, octamethylene diisocyanate, nonamethylene diisocyanate, decamethylene diisocyanate, trimethylhexamethylene diisocyanate, morphol. Lin diisocyanate 1., hexane diisocyanate 1., 3,9-bis(3-probyl isocyanate)-2■4.8.10-tel.laoxaspiro[5,5]undecane, 4. 4'-diphenylmethane diisocyanate, 4.4'-diphenyl ether diisocyanate, 4.4'-diphenylpropane diisocyanate, 4.4'-diphenylsulfone diisocyanate-1-, 3.3'-diphenylsulfone diisocyanate, 4 .4'-diphenyl sulfide diisocyanate, 3,3'-dimethyl-4,4'-diphenylmethane diisocyanate, 3,3'-dichloro. 4.4'
-diphenylmethane diisocyanate, 3.3'-dimethyl-4,4'-bisphenyl diisocyanate, 3.
3'-dimethoxy 4.4'-bisphenyl diisocyanate 1-, 4.4'-bisphenyl diisocyanate 1-
, phenylene diisocyanate, ρ-7 phenylene diisocyanate, 2.4-tolylene diisocyanate, incyane 1.
, 2,6-tolylene diisocyanate, n4-silylene diisocyanate, p-xylylene diisocyanate, etc., and these can be used alone or in combination of two or more. Polyisocyanates other than diisocyanates include:
For example, polymethylene polyphenyl polyisocyanate, 4.4', 4"-triisocyanate triphenylmethane, 2.2', 5.5"-tetraisocyanate-4.4'-dimethyldiphenylmethane, 2,4.4'
-diphenyl ether triisocyanate, tris(4
-Methyl-4-isocyanate phenyl)in cyanurate and the like. Polyisocyanate derivatives in which the isocyanate groups of polyisocyanate are masked with phenols such as phenol, cresol, and xylenol can also be used. These polyisocyanates are appropriately selected depending on the required properties such as heat resistance and mechanical properties of the polyamideimide resin obtained.
Aromatic diisocyanates are preferred from the viewpoint of heat resistance, mechanical properties, and economic efficiency of the insulating film, which are particularly required for electrical insulating varnishes. Among them, 4,4'-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, i-I silylene diisocyanate, p-xylylene diisocyanate, and 4,4'-diphenyl ether diisocyanate. Preferably, these diisocyanates are particularly preferably one or a mixture of phenol-masked dirods in order to provide the above-mentioned properties. The blending ratio of the polyisocyanate or its derivative is 2 equivalents and 3 equivalents of the dibasic acid or its derivative and the tribasic acid or its derivative, respectively, and the incyanate component of the polyisocyanate or its derivative in an equivalent ratio of 1. :1
It is preferable that (a) polyhydric carboxylic acid and (b)
) A polyamide-imide resin is obtained by reacting a polyisocyanate or a derivative thereof in a phenolic solvent in the presence of a polyamide resin at a temperature of 150 to 250°C for 2 to 20 hours. The phenolic solvent used here is
Phenol, 0-cresol, 0-cresol, p-cresol, xylenol, and chlorophenol are used. Polyamide resins used in this reaction include nylon 6, nylon 12, nylon 6.6, and nylon 6.
- Examples include l2, nylon 11, etc. Among these, when using nylon 6 and nylon 6.6, the reaction time is shorter than when using other nylons, and the enamelled wire has the advantage of excellent wear resistance, but it can be selected as appropriate depending on the required characteristics. The polyamide resin may be charged at the same time as starting the reaction of (a) polyvalent carbon and (b) polyisocyanate or its conductor, or one component may be dissolved in a solvent and the other component may be added. At one time,
Alternatively, it can be prepared in several batches, and there are no particular restrictions on the preparation method. However, in order to obtain a high molecular weight polyamide-imide resin, it is preferable to charge the polyamide resin from the beginning of the reaction. On the other hand, when used as an insulating varnish, the reaction proceeds during the baking process to form the enamel film, so the polyamide resin can be added relatively late in the varnish synthesis stage. The function of polyamide resin in the reaction of polyamide-imide resin is not clear, but it is known that it significantly accelerates the reaction between polycarboxylic acid and polyisocyanate or its derivatives. It is inferred that the polyamide-imide resin and the polyamide resin react and integrate with each other from the results of molecular weight distribution measurements using infrared charts, thermogravimetric analysis, and gel permeation chromatography. In the reaction between a tribasic acid or its derivative and a polyisocyanate or its derivative, it is thought that the polyamide resin exhibits a matrix effect and, at the same time, a polymerization reaction occurs mainly in the amide groups of the polyamide resin. The blending ratio of the polyamide resin can be changed depending on the amount sufficient to express the matrix effect, the purpose of use of the obtained polyamide-imide resin, and the required characteristics.
例えば電気絶縁ワニスの場合は、ポリアミドイミド樹脂
に対し、3〜40重量%含有ずるように配合することが
望ましい, この配合が3重鼠%末清では十分なマトリ
ックス効果が得られず、また40重量%を超えると絶緑
ワニスから得られるエナメル線の耐熱性が低下し好まし
くない.
本発明に用いる(B)フェノール類でマスクされた芳香
族ポリイソシアネートとしては、前述した(b >で使
用した芳香族ジイソシアネートや芳香族ポリイソシアネ
ートのイソシアネート基をフェノール、クレゾール、キ
シレノール等のフェノール類でマスクしたものが使用さ
れる. 具体的なものとしてはMS−50 (日本ポリ
ウレタン社製、商品名)、コロネートAPステーブル(
日本ポリウレタン社製、商品名〉等が挙げられ、これら
は単独又は2種以上混合して使用することができる.
上述した(A)ポリアミドイミドm#1のみでも電気絶
縁ワニスとして使用することが可能であるが、高線速、
高能率の焼付機を使用してエナメル線を製造する場合、
発泡しやすいという欠点がある. フェノール類でマス
クした芳香族ポリイソシアネートを配合することによっ
て、この発泡を大幅に改首することができる.
本晃明に用いる(C)滑剤変性ポリエステルイミド樹脂
としては、通常のテレフタル酸ジメチル、トリメリット
酸無水物、4.4′−ジアミノジフェニルメタン、エチ
レングリコールからなるポリエステルイミドにおけるア
ルコール成分の一部をトリス(2−ヒドロキシエチル)
イソシアヌレートで置換したポリエステルイミド樹脂を
清剤で変性したものである. ここで用いる滑剤として
は、炭素数18以上の直鎖カルボン酸で、具体的には、
ステアリン酸、ノナデカン酸、エイコサン酸、ドコサン
酸、トリコサン酸、テトラコサン酸、オクタコサン酸及
びこれらの誘導体も使用できる. この滑剤変性ポリエ
ステルイミド樹脂を配合することによって、電線皮膜の
潤滑性及び耐摩耗性を向上させることができる. この
配合割合は、酸成分全体に対し0.5〜5モル%である
ことが望ましい,本発明のポリアミドイミドエステル樹
脂は、前述した(A)ポリアミドイミド樹脂(B)フェ
ノール類でマスクした芳香族ポリイソシアネート、(C
)滑剤変性ポリエステルイミド樹脂をa1合して容易に
製造することがきる. これらの各成分の配合割合は、
全体のポリアミドイミドエステル樹脂に対して(A>ポ
リアミドイミド樹脂を60〜99重量%、(B)フェノ
ールでマスクした芳香族ポリイソシアネートを5〜40
gLjt%、(C)滑剤変性ポリエステルイミド樹脂を
1〜30重量%含有するように配合することが望ましい
. 好ましくは(A)が70〜90fi量%、(B)が
5〜20重量%、(C)が3〜15重量%の範囲である
。 本発明のポリアミドイミドエステル樹脂は、前述し
た(A)〜(C)を必須成分とするが、本発明の目的に
反しない限度において他の成分や添加剤などを添加配合
することもできる. (B)のフェノール類でマス
クした芳香族ポリイソシアネートが3重量%未満では、
発泡しやすくなり、また40重量%を超えるとエナメル
線としての可撓性、耐摩耗性が低下し好ましくない.
(C)の滑剤変性ポリエステルイミド樹脂が1重量%
未溝では潤滑性、耐劣化性や耐冷媒油性に効果なく、ま
た30重量%を超えるとエナメル線としてのブリスター
性は向上するものの巻付ピンホールが発生しやすくなり
、好ましくない6
こうして得たポリアミドイミドエステル樹脂を銅線又は
絶縁層を介して塗布・焼付して絶縁電線を製造すること
ができる. 中でも下引き用にポリエステルイミド樹脂
、上引き用ポリアミドイミドエステル樹脂の場合が特に
好ましい結果が得られる.
(実施例)
次に本発1リ1を実施例によって説明する.[滑剤変性
ポリエステルイミド樹脂◎−1〜3の製造7
■−1
温度計、攬1゛1!機、冷却管、窒素尋人管をつけた2
A四[1フラスコにデレフタル酸ジメチル300g《1
,5モノレ)、トリメリット酸無水1勿270Q(
1.4モル)、4.4’−ジアミノジフエニルメタン1
40 g(0.7モル)、エチレングリコール50a(
0.8モル)、トリス(2−ヒドロキシエチル)イソシ
アヌレート3oog ( 1.1モル)、酊6kナトリ
ウム0.8り、およびヘキストワックスS(ヘキスト社
製、商品名)30gを仕込み、窒素気流中でIQ 4’
l’ Lながら徐々に昇温し、8時間かけて240℃ま
で上げた。For example, in the case of electrical insulating varnish, it is desirable to mix the polyamide-imide resin with a proportion of 3 to 40% by weight. Exceeding the weight percentage is undesirable because the heat resistance of the enameled wire obtained from the evergreen varnish decreases. The phenol-masked aromatic polyisocyanate (B) used in the present invention is obtained by replacing the isocyanate group of the aromatic diisocyanate or aromatic polyisocyanate used in (b) with a phenol such as phenol, cresol, or xylenol. Masked products are used. Specific examples include MS-50 (manufactured by Nippon Polyurethane Co., Ltd., trade name), Coronate AP Stable (
manufactured by Nippon Polyurethane Co., Ltd. (trade name), etc., and these can be used alone or in a mixture of two or more.
Although it is possible to use the above-mentioned (A) polyamideimide m#1 alone as an electrically insulating varnish,
When manufacturing enamelled wire using a high-efficiency baking machine,
The disadvantage is that it tends to foam. By incorporating aromatic polyisocyanate masked with phenols, this foaming can be significantly reduced. As the lubricant-modified polyesterimide resin (C) used in this invention, a part of the alcohol component in the usual polyesterimide consisting of dimethyl terephthalate, trimellitic anhydride, 4,4'-diaminodiphenylmethane, and ethylene glycol is added to tris( 2-hydroxyethyl)
It is a polyesterimide resin substituted with isocyanurate and modified with a detergent. The lubricant used here is a linear carboxylic acid having 18 or more carbon atoms, specifically,
Stearic acid, nonadecanoic acid, eicosanoic acid, docosanoic acid, tricosanoic acid, tetracosanoic acid, octacosanoic acid and derivatives thereof can also be used. By blending this lubricant-modified polyesterimide resin, the lubricity and abrasion resistance of the wire coating can be improved. This blending ratio is desirably 0.5 to 5 mol% based on the total acid component. Polyisocyanate, (C
) It can be easily produced by combining lubricant-modified polyesterimide resin with a1. The blending ratio of each of these ingredients is
Based on the total polyamide-imide ester resin (A>60-99% by weight of polyamide-imide resin, (B) 5-40% of aromatic polyisocyanate masked with phenol)
gLjt%, and (C) lubricant-modified polyesterimide resin is preferably blended in an amount of 1 to 30% by weight. Preferably, the content of (A) is 70 to 90% by weight, the content of (B) is 5 to 20% by weight, and the content of (C) is 3 to 15% by weight. The polyamide-imide ester resin of the present invention has the above-mentioned (A) to (C) as essential components, but other components and additives may be added to the extent that it does not contradict the purpose of the present invention. If the aromatic polyisocyanate masked with phenols (B) is less than 3% by weight,
Foaming tends to occur, and if it exceeds 40% by weight, the flexibility and abrasion resistance of the enamelled wire decreases, which is not preferable.
(C) lubricant-modified polyesterimide resin is 1% by weight
If it is ungrooved, it has no effect on lubricity, deterioration resistance, or refrigerant oil resistance, and if it exceeds 30% by weight, the blister properties of the enamelled wire improve, but winding pinholes tend to occur, which is not desirable6. Insulated wires can be manufactured by coating and baking polyamide-imide ester resin over copper wire or an insulating layer. Among these, particularly favorable results can be obtained using polyesterimide resin for the undercoat and polyamideimide ester resin for the topcoat. (Example) Next, the present invention will be explained using an example. [Production of lubricant-modified polyesterimide resin ◎-1 to 3 7 ■-1 Thermometer, 1゛1! 2 with a machine, cooling pipe, and nitrogen gas pipe attached.
A4 [300g dimethyl derephthalate in 1 flask《1
, 5 monole), trimellitic acid anhydride 1 270Q (
1.4 mol), 4.4'-diaminodiphenylmethane 1
40 g (0.7 mol), ethylene glycol 50a (
0.8 mol), 30 g (1.1 mol) of tris(2-hydroxyethyl)isocyanurate, 0.8 mol of 6K sodium, and 30 g of Hoechst Wax S (manufactured by Hoechst, trade name) in a nitrogen stream. IQ 4'
The temperature was gradually raised to 240° C. over 8 hours.
減圧下でさらに30分間反応を続けfS後、訃クレゾー
ル1040(lを加えて反応を中止して、粘度380ボ
アズ(30℃における)、不揮発分50%の樹脂溶液と
した.
■−2
■−1において、ヘキストヮヅクスSの代わりにヘキス
トワックスE{ヘキスト社製、商品名}を用いた以外は
ずべて◎−1と同一にして反応させ、粘度360ボアズ
(30℃における)、不揮発分51%の樹脂溶液とした
。The reaction was continued for an additional 30 minutes under reduced pressure, and after fS, the reaction was stopped by adding 1040 liters of Moroccan cresol to obtain a resin solution with a viscosity of 380 boads (at 30°C) and a non-volatile content of 50%. ■-2 ■- In 1, the reaction was carried out in the same manner as in ◎-1 except that Hoechst Wax E {manufactured by Hoechst Co., Ltd., trade name} was used instead of Hoechst Wax S. It was made into a resin solution.
■−3
■−1において、ヘキストワックスS3Qgの代わりに
ステアリン酸メチル40 (Jを用いた以外はずべて0
−1と同一にして反応させ、粘度345ボアズ(30℃
における)、不揮発分51%の樹脂溶液とした.
■−4
■−1においてへキストワックスSを除く以外ずべて0
−1と同様にして粘度370ボアズ(30℃)、不揮発
分50%の樹脂溶液とした. 次いでヘキストE30i
;lを加え、十分撹拌混合した.[下引き用ポリエステ
ルイミド樹脂Yの製造]温度計、撹拌機、冷却管、窒素
導入管をつけた21四口フラスコに、テレフタル酸ジメ
チル300g(1.5モル)、トリメリット酸無水物2
70(J( 1.4モル) 、4.4 ’−ジアミノ
ジフェニルメタン140g(0.7モル)、エチレング
リコールsog (o.aモル》、トリス(2−ヒド
ロキシエチル)インシアヌレート300g ( i.
iモル)、および酢酸ナトリウム0.8gを仕込み、窒
素気流中で撹拌しながら徐々に昇温し、8時間かけて2
40℃まで上けた. 次いで減圧下でさらに30分間反
応を続けた後、一一クレゾール10401Jを加えて反
応を停止させた. さらにこの樹脂に、テトラブチルナ
タネ−1−を20g添加混合して粘度40ボアズ(30
℃における)にクレゾールとナフサ2号で調整し、不揮
発分42%の樹脂溶液とした.
実旅例 1
温度言1、攪{1!機、冷却管、室素導入管をつけた2
I四ロフラスコに、l・リメリット酸無水物130g《
0.7モル》、イソフタル酸8bLJ ( 0.5モ
ル)、4,4′−ジフエニルメタンジイソシアネート3
00g(1.2モル}、ナイロン6としてアミランCM
1007 (東レ社製、商品名) 6og 、および訃
クレゾール酸470gを仕込み、窒素気流中で室温から
200℃まで約1時間で昇湿させた. 脱炭酸ガスの発
泡が80〜130℃にかけて多く発生し、さらに200
゜C付近まで継続してみられた. 反応温度を200〜
205゜Cに設定し、クレゾールを還流させながら常圧
で反応させた. 内容物は初めやや不透明であったが2
05℃で3時間経過後、透明溶液となった。 その後さ
らにクレゾールを還流させながら反応を7時間!l続し
、合計10時間後、訃クレゾールを176g加えて反応
を停止させた.100℃まで冷却した後、滑剤変性ポリ
エステルイミド樹脂(製造例◎−1 ) 100(lを
加え、更にフェノール類でマスクした芳香族ポリイソシ
アネートMS−50(日本ポリウレタン社製、商品名)
ioogを加えて十分攪拌混合して均一な樹脂溶液を
製造した. この樹脂溶液は、赤褐色透明でクレゾール
及びナフサ2号で粘度40ボアズ(30℃における)に
調整したところ、不揮発分31%であった.実施例 2
〜5
実施例1と同一の装置を用いて、第1表に示した組成に
よって樹脂溶液を製造した. このv!1脂溶液をクレ
ゾール及びナフサ2一号を用いて粘度39〜75ボアズ
(30℃における)に調整したところ、不揮発分30〜
32%であった.
比較例 1
市販のポリアミドイミド塗料〈不揮発分25%)を用い
て比較例とした.
炉長6I1の竪炉を用いて炉温(上、中、下)430−
380−270℃、線速11 Il/llinの条件で
、直経1lIlの銅線上に下引きとして製造例Yで得た
樹脂溶液を 1回塗布焼付した後、上引き用として実施
例1〜5及び比較例のVA脂溶液を2回塗布焼付して絶
縁電線を製造した. この絶縁電線について、J I
S−C−3003に準じて諸特性を試験して粘果を得た
ので、第1表及び第2表に示した。■-3 In ■-1, all cases were 0 except for using methyl stearate 40 (J) instead of Hoechstwax S3Qg.
The reaction was carried out in the same manner as -1, and the viscosity was 345 boads (30°C).
) and a resin solution with a nonvolatile content of 51%. ■-4 ■-1 All 0 except for Hoechst Wax S
A resin solution with a viscosity of 370 boads (30°C) and a non-volatile content of 50% was prepared in the same manner as in -1. Then Hoechst E30i
;1 was added and thoroughly stirred and mixed. [Manufacture of polyesterimide resin Y for undercoat] In a 21 four-necked flask equipped with a thermometer, stirrer, cooling tube, and nitrogen introduction tube, 300 g (1.5 mol) of dimethyl terephthalate and 2 trimellitic anhydride were added.
70 (J (1.4 mol), 4.4'-diaminodiphenylmethane 140 g (0.7 mol), ethylene glycol sog (o.a mol), tris(2-hydroxyethyl)in cyanurate 300 g (i.
i mol) and 0.8 g of sodium acetate, the temperature was gradually raised while stirring in a nitrogen stream, and the temperature was increased over 8 hours.
The temperature rose to 40℃. Next, the reaction was continued for another 30 minutes under reduced pressure, and then 10401 J of 11-cresol was added to stop the reaction. Furthermore, 20g of tetrabutyl rapeseed 1- was added and mixed to this resin to give a viscosity of 40 Boaz (30
℃) with cresol and naphtha No. 2 to make a resin solution with a nonvolatile content of 42%. Actual travel example 1 Temperature word 1, stirring {1! 2 with a machine, cooling pipe, and nitrogen introduction pipe attached.
In a four-ring flask, add 130 g of l.limellitic anhydride.
0.7 mol], isophthalic acid 8bLJ (0.5 mol), 4,4'-diphenylmethane diisocyanate 3
00g (1.2mol}, amilan CM as nylon 6
1007 (manufactured by Toray Industries, Inc., trade name) and 470 g of cresylic acid were charged, and the temperature was raised from room temperature to 200° C. in about 1 hour in a nitrogen stream. A lot of decarbonation gas foaming occurs from 80 to 130℃, and even more at 200℃.
It was observed to continue up to around °C. Set the reaction temperature to 200~
The temperature was set at 205°C, and the reaction was carried out at normal pressure while refluxing the cresol. The contents were a little opaque at first, but2
After 3 hours at 05°C, a clear solution was obtained. After that, the reaction continued for 7 hours while refluxing the cresol! After a total of 10 hours, 176 g of fresh cresol was added to stop the reaction. After cooling to 100°C, 100 (l) of lubricant-modified polyesterimide resin (manufacturing example ◎-1) was added, and aromatic polyisocyanate MS-50 (manufactured by Nippon Polyurethane Co., Ltd., trade name) was further masked with phenol.
ioog was added and thoroughly stirred and mixed to produce a uniform resin solution. This resin solution was reddish-brown and transparent, and when the viscosity was adjusted to 40 boads (at 30°C) using cresol and naphtha No. 2, the nonvolatile content was 31%. Example 2
~5 Using the same equipment as in Example 1, a resin solution was produced according to the composition shown in Table 1. This v! 1 fat solution was adjusted to a viscosity of 39 to 75 boads (at 30°C) using cresol and naphtha No. 21, and the nonvolatile content was 30 to 75 Boaz.
It was 32%. Comparative Example 1 A comparative example was prepared using a commercially available polyamide-imide paint (non-volatile content: 25%). Using a furnace with a furnace length of 6I1, the furnace temperature (upper, middle, lower) is 430-
At 380-270°C and a line speed of 11 Il/llin, the resin solution obtained in Production Example Y was coated once on a copper wire with a diameter of 1 lIl as an undercoat and baked, and then Examples 1 to 5 were applied as an overcoat. Insulated wires were manufactured by applying and baking the VA fat solution of Comparative Example twice. Regarding this insulated wire, J I
Various properties were tested according to S-C-3003 to obtain mucilage, which are shown in Tables 1 and 2.
本発明の絶縁電線は、潤滑性、耐摩耗性、すべり性、耐
劣化性、耐冷媒油性に優れており、本発Iリ1の顕著な
効果を確認することができた.[発明の効果]
以上の説明および第2表から明らかなように、本発四の
ポリアミドイミドエステル樹脂及び絶縁電線は、潤滑性
、すべり性、耐劣化性、耐冷媒油性に優れており、耐冷
媒用モータ等に好適なものである.The insulated wire of the present invention has excellent lubricity, wear resistance, slipperiness, deterioration resistance, and refrigerant oil resistance, and the remarkable effects of the present invention were confirmed. [Effects of the Invention] As is clear from the above explanation and Table 2, the polyamide-imide ester resin and insulated wire of the present invention have excellent lubricity, slipperiness, deterioration resistance, and refrigerant oil resistance. It is suitable for refrigerant motors, etc.
Claims (1)
基酸又はその誘導体を含む三塩 基酸又はその誘導体からなる多価カルボン 酸と、(b)ポリイソシアネート又はその 誘導体とを、当量比で1:1の割合でポリ アミド樹脂共存下のフェノール系溶媒中で 反応させてなるポリアミドイミド樹脂、 (B)フェノール類でマスクされた芳香族 ポリイソシアネート、及び (C)滑剤変性ポリエステルイミド樹脂 を必須成分とするポリアミドイミドエステル樹脂を導体
上に直接又は他の絶縁層を介して塗布・焼付してなるこ
とを特徴とする絶縁電線。 2(A)(a)酸成分全体の少なくとも5モル%の二塩
基酸又はその誘導体を含む三塩 基酸又はその誘導体からなる多価カルボン 酸と、(b)ポリイソシアネート又はその 誘導体とを、当量比で1:1の割合でポリ アミド樹脂共存下のフェノール系溶媒中で 反応させてなるポリアミドイミド樹脂、 (B)フェノール類でマスクされた芳香族 ポリイソシアネート、及び (C)滑剤変性ポリエステルイミド樹脂 を必須成分とするポリアミドイミドエステル樹脂。[Scope of Claims] 1(A) (a) a polyhydric carboxylic acid consisting of a tribasic acid or a derivative thereof containing at least 5 mol % of a dibasic acid or its derivative based on the total acid component; and (b) a polyisocyanate or (B) Aromatic polyisocyanate masked with phenols; (C) An insulated wire characterized in that it is made by applying and baking a polyamide-imide ester resin containing a lubricant-modified polyester-imide resin as an essential component onto a conductor directly or through another insulating layer. 2(A) (a) A polycarboxylic acid consisting of a tribasic acid or a derivative thereof containing at least 5 mol % of a dibasic acid or a derivative thereof based on the total acid component, and (b) a polyisocyanate or a derivative thereof, in an equivalent amount. A polyamide-imide resin obtained by reacting in a phenolic solvent in the coexistence of a polyamide resin at a ratio of 1:1, (B) an aromatic polyisocyanate masked with phenols, and (C) a lubricant-modified polyesterimide resin. Polyamideimide ester resin is an essential component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24163889A JPH03102709A (en) | 1989-09-18 | 1989-09-18 | Polyamide-imide ester resin and insulated wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24163889A JPH03102709A (en) | 1989-09-18 | 1989-09-18 | Polyamide-imide ester resin and insulated wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03102709A true JPH03102709A (en) | 1991-04-30 |
Family
ID=17077294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24163889A Pending JPH03102709A (en) | 1989-09-18 | 1989-09-18 | Polyamide-imide ester resin and insulated wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03102709A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012185907A (en) * | 2011-03-03 | 2012-09-27 | Hitachi Magnet Wire Corp | Insulated cable |
-
1989
- 1989-09-18 JP JP24163889A patent/JPH03102709A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012185907A (en) * | 2011-03-03 | 2012-09-27 | Hitachi Magnet Wire Corp | Insulated cable |
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