JPH03102757U - - Google Patents

Info

Publication number
JPH03102757U
JPH03102757U JP1158690U JP1158690U JPH03102757U JP H03102757 U JPH03102757 U JP H03102757U JP 1158690 U JP1158690 U JP 1158690U JP 1158690 U JP1158690 U JP 1158690U JP H03102757 U JPH03102757 U JP H03102757U
Authority
JP
Japan
Prior art keywords
conductive pattern
printed circuit
circuit board
double
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1158690U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1158690U priority Critical patent/JPH03102757U/ja
Publication of JPH03102757U publication Critical patent/JPH03102757U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案による両面プリント基板の断面
図、第２図は従来の片面プリント基板の断面図で
ある。 １，１１……絶縁基板、１ａ，１１ａ……基板
表面、１ｂ，１１ｂ……基板裏面、２，１２……
導電パターン、３，１３……貫通孔、４，１４…
…電子部品、５，１５……リード、６……ジヤン
パー線、７……チツプ部品、８，１６……半田付
け部。 FIG. 1 is a sectional view of a double-sided printed circuit board according to the present invention, and FIG. 2 is a sectional view of a conventional single-sided printed circuit board. 1, 11...Insulated substrate, 1a, 11a...Substrate surface, 1b, 11b...Substrate back surface, 2, 12...
Conductive pattern, 3, 13... Through hole, 4, 14...
...Electronic parts, 5, 15... Leads, 6... Jumper wires, 7... Chip parts, 8, 16... Soldering parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板の両面に導電パターンが形成され、該
導電パターンの所定の部位に貫通孔を有する両面
プリント基板において、リードを有する電子部品
のリードを前記貫通孔に挿入して、前記基板表面
と基板裏面の前記導電パターン間を接続してなる
両面プリント基板。 In a double-sided printed circuit board in which a conductive pattern is formed on both sides of an insulating substrate and a through hole is provided at a predetermined portion of the conductive pattern, a lead of an electronic component having a lead is inserted into the through hole, and a conductive pattern is formed on both sides of the board. A double-sided printed circuit board formed by connecting the conductive patterns.
JP1158690U 1990-02-09 1990-02-09 Pending JPH03102757U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1158690U JPH03102757U (en) 1990-02-09 1990-02-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1158690U JPH03102757U (en) 1990-02-09 1990-02-09

Publications (1)

Publication Number Publication Date
JPH03102757U true JPH03102757U (en) 1991-10-25

Family

ID=31515107

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1158690U Pending JPH03102757U (en) 1990-02-09 1990-02-09

Country Status (1)

Country Link
JP (1) JPH03102757U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006167442A (en) * 2004-11-18 2006-06-29 Koizumi Seisakusho:Kk Batting rod

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006167442A (en) * 2004-11-18 2006-06-29 Koizumi Seisakusho:Kk Batting rod

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