JPH03104566A - Grinding wheel - Google Patents
Grinding wheelInfo
- Publication number
- JPH03104566A JPH03104566A JP23774689A JP23774689A JPH03104566A JP H03104566 A JPH03104566 A JP H03104566A JP 23774689 A JP23774689 A JP 23774689A JP 23774689 A JP23774689 A JP 23774689A JP H03104566 A JPH03104566 A JP H03104566A
- Authority
- JP
- Japan
- Prior art keywords
- grinding wheel
- base disc
- base
- reduced
- grinding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006061 abrasive grain Substances 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- 239000000919 ceramic Substances 0.000 claims abstract description 11
- 239000002245 particle Substances 0.000 claims abstract description 9
- 239000002131 composite material Substances 0.000 claims abstract description 7
- 239000000835 fiber Substances 0.000 claims abstract description 7
- 239000011159 matrix material Substances 0.000 claims abstract description 7
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 9
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 9
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- 229910000861 Mg alloy Inorganic materials 0.000 claims description 2
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 2
- 229910002113 barium titanate Inorganic materials 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 10
- 230000000052 comparative effect Effects 0.000 description 12
- 238000003754 machining Methods 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 229910001018 Cast iron Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野］
本発明は．研削面に，ダイヤモンド，、ＣＢＮ（立法晶
窒化ホウ素）等の超砥粒層，或いは一般砥粒層を接合し
た研削砥石に関する．〔従来技術〕
従来，研削砥石は種々のものが提案．実用化されている
．そして，研削砥石としては．金属製のベース円板に超
砥粒層や一般砥粒層を接着したものがある．
該超砥粒層としては，ダイヤモンドやＣＢＮの砥粒をビ
トリファイドボンド結合したものが用いられている（例
えば特公昭５８−３４４３１号公報）．
しかして．上記金属製ベース円板としては．従来，鋼．
鋳鉄，アルξニウム合金などが用いられている．
そして，上記超砥粒を用いた研削砥石は．砥ね自体が一
般の砥粒に比して非常に硬質であるため，砥石摩耗が少
ない．そのため．摩耗による寸法変化やバラツキも少な
く，高精度の研削加工が可能となる．それ故，主として
難削材の研削に使用されている．
〔解決しようとする課題〕
しかしながら，上記従来の研削砥石は，回転時の遠心力
に伴うベース円板の伸びが大きいため加工精度が低下す
るという問題があった．近年においては．加工能率の向
上や砥石寿命の向上がより強く望まれているため．研削
砥石の高周速化はますます要求される．それ故，回転時
における研削砥石の伸びは，できるだけ小さくする必要
がある．
また，従来のベース円板は．超砥粒層よりも熱膨張係数
が大きい．そのため，研削時の熱或いは軸受装置の熱に
よってベース円板が膨張し，ベース円板を含めた研削砥
石全体が熱膨張する．このことは，加工物の寸法精度の
低下をまねく原因となっている．
更に，従来のベース円板は，特に鋼，鋳鉄で作製された
ものは，その重量（比重）が大きい．そのため．研削盤
で研削砥石を回転する際に，モータへの負荷．砥石軸へ
の負荷が大きく，モータや軸受部分での発熱量が大きい
．それ故，これらの熱がベース円板へも伝熱し前記のご
とくベース円板の熱膨張を更に大きくする原因ともなっ
ている．また．上記の問題は，一般の砥粒を用いた研削
砥石においても生ずる．
本発明は上記従来の問題点に鑑み．高周速下においても
高精度の加工ができる研削砥石を提供しようとするもの
である。[Detailed description of the invention] [Industrial application field] The present invention... This article relates to a grinding wheel in which a super abrasive grain layer such as diamond, CBN (cubic boron nitride), or a general abrasive grain layer is bonded to the grinding surface. [Prior art] Various types of grinding wheels have been proposed in the past. It has been put into practical use. And as a grinding wheel. There are types in which a super abrasive grain layer or a general abrasive grain layer is adhered to a metal base disc. As the superabrasive grain layer, a vitrified bond bonding of diamond or CBN abrasive grains is used (for example, Japanese Patent Publication No. 34431/1983). However. As for the metal base disc mentioned above. Conventionally, steel.
Cast iron, aluminum alloy, etc. are used. And the grinding wheel using the above-mentioned super abrasive grains. Since the abrasive itself is much harder than ordinary abrasive grains, there is less wear on the whetstone. Therefore. There is little dimensional change or variation due to wear, and high-precision grinding is possible. Therefore, it is mainly used for grinding difficult-to-cut materials. [Problem to be solved] However, the above-mentioned conventional grinding wheel had the problem of reduced machining accuracy due to the large elongation of the base disk due to centrifugal force during rotation. In recent years. This is because improvements in machining efficiency and grinding wheel life are strongly desired. There is an increasing demand for higher peripheral speeds for grinding wheels. Therefore, the elongation of the grinding wheel during rotation must be kept as small as possible. Also, the conventional base disc. The coefficient of thermal expansion is larger than that of the superabrasive layer. Therefore, the base disk expands due to the heat during grinding or the heat of the bearing device, and the entire grinding wheel including the base disk expands thermally. This causes a decrease in the dimensional accuracy of the workpiece. Furthermore, conventional base discs, especially those made of steel or cast iron, have a large weight (specific gravity). Therefore. Load on the motor when rotating the grinding wheel on a grinding machine. The load on the grinding wheel shaft is large, and the amount of heat generated by the motor and bearings is large. Therefore, this heat is also transferred to the base disk, causing further increase in the thermal expansion of the base disk as described above. Also. The above problem also occurs with grinding wheels that use general abrasive grains. The present invention has been developed in view of the above-mentioned conventional problems. The present invention aims to provide a grinding wheel that can perform highly accurate machining even at high circumferential speeds.
本発明は，砥粒層をベース円板に接着してなる研削砥石
において５上記ベース円板は金属マトリクス中にセラミ
ックスの繊維又は粒子を分散させた複合材を用いてなる
ことを特徴とする研削砥石にある．
本発明において．ベース円板を構戒する複合材は．金属
マトリクス（母材）中にセラミックスの繊維又は粒子を
分散させたもので，ＦＲＭ，ＭＭＣなどと称されている
。かかる金属マトリクスとしては．アルミニウム合金，
マグネシウム合金チタン合金などがある．
また．上記セラミックスとしては，シリコンカーバイド
．ボロン，アルξナ，シリカ，カーボン．チタン酸カリ
ウム．チタン酸バリウム等がある．この中，アルミニウ
ム合金中にシリコンカーバイドを分散させたものが１最
も好ましい。The present invention provides a grinding wheel in which an abrasive grain layer is bonded to a base disc, wherein the base disc is made of a composite material in which ceramic fibers or particles are dispersed in a metal matrix. It's on the whetstone. In the present invention. The composite material that makes up the base disc is... It is a product in which ceramic fibers or particles are dispersed in a metal matrix (base material), and is called FRM, MMC, etc. As such a metal matrix. aluminum alloy,
There are magnesium alloys, titanium alloys, etc. Also. The above ceramics include silicon carbide. Boron, alumina, silica, carbon. Potassium titanate. Examples include barium titanate. Among these, one in which silicon carbide is dispersed in an aluminum alloy is most preferred.
次に．上記セラミックスは，ベース円板中に１０〜３５
重量％含有することが好ましい。ｌＯ％未満では回転時
の伸びが大きく．一方３５％を越えると製品としての安
定性に欠けることと．材料に脆さが出てくるため，好ま
しくない。next. The above ceramics contain 10 to 35
It is preferable that the content is % by weight. If it is less than 1O%, the elongation during rotation will be large. On the other hand, if it exceeds 35%, the product may lack stability. This is not preferable because it makes the material brittle.
また，セラミックスの繊維は，直径１〜３００μｍのも
のを用いることが好ましい。また，セラξツクス粒子は
，粒径Ｏ，ｌ〜３００μｍのものを用いることが好まし
い。この範囲外では，本発明の目的を達成し難い。Further, it is preferable to use ceramic fibers having a diameter of 1 to 300 μm. Moreover, it is preferable to use ceramic particles having a particle size of O, l to 300 μm. Outside this range, it is difficult to achieve the purpose of the present invention.
また．本発明において，ベース円板は，その熱膨張係数
が１５Ｘ１０−’以下で，かつ密度（ｋｇ／Ｃ一）／縦
弾性率（ｋｇｆ／ｃｊ）の比率（Ｎ）が３．５ＸＩＯ−
”以下であることが好ましい．この両者を満足する場合
には．ベース円板の熱膨張及び伸びが特に低くなり，一
層優れた研削砥石を得ることができる．
また．ベース円板と砥粒層との接着に当たっては．エポ
キシ樹脂などの接着剤を用いる．また．本発明において
砥粒は，ダイヤモンドやＣＢＮ等の超砥粒．アルくナ，
炭化珪素などの一般砥粒がある。Also. In the present invention, the base disc has a thermal expansion coefficient of 15X10-' or less and a density (kg/C-)/longitudinal modulus (kgf/cj) ratio (N) of 3.5XIO-'.
"The following is preferable. When both of these conditions are satisfied, the thermal expansion and elongation of the base disc will be particularly low, and an even better grinding wheel can be obtained. Also, the base disc and the abrasive layer An adhesive such as epoxy resin is used for adhesion to the material.Also, in the present invention, the abrasive grains include superabrasive grains such as diamond and CBN.
There are general abrasive grains such as silicon carbide.
また１砥粒層における砥粒の結合は，ビトリファイドボ
ンド，レジノイドボンド又はメタルボンドなどにより行
う．
本発明は１特に超砥粒を用いたビトリファイドポンドの
研削砥石に対して，その効果が大きい．〔作用及び効果
〕
本発明の研削砥石においては，ベース円板の材料として
前記複合材を用いている．しかして．該ベース円板は．
アルミニウム合金等で作製した従来の金属ベース円板に
比して，その熱膨張係数が低い．つまり．金属のみの場
合に比して，該金属に前記セラミックスの繊維又は粒子
を添加した複合材の方が．熱膨張係数が低くなる（実施
例参照）．
また，本発明のベース円板は．回転時の伸びが少なく，
従来品に比して約半分以下である（実施例参照）．更に
．本発明の，ベース円板は，前記比率Ｎについても，従
来品の約半分以下である（実施例参照）．
また．本発明のベース円板は，従来のベース円板に比し
て軽量であるため．研削砥石の回転に伴うモータへの負
荷．砥石軸への負荷が小さく．これらにおける発熱量が
少ない．そのため，ベース円板への伝熱量が少なく．研
削砥石の熱膨張も一層少ない．
それ故．本発明によれば，高周速下においても高精度の
加工ができる研削砥石を提供することができる．
〔実施例〕
本発明にかかる超砥粒を用いた研削砥石を作製し，その
性能につきテストを行い，その結果を第１表に示した。The abrasive grains in one abrasive layer are bonded by vitrified bond, resinoid bond, metal bond, etc. The present invention is particularly effective for vitrified pound grinding wheels using superabrasive grains. [Operations and Effects] In the grinding wheel of the present invention, the above-mentioned composite material is used as the material of the base disc. However. The base disc is.
Its coefficient of thermal expansion is lower than that of conventional metal base discs made of aluminum alloys, etc. In other words. Composite materials in which ceramic fibers or particles are added to metals are better than metals alone. The coefficient of thermal expansion is lower (see examples). Furthermore, the base disc of the present invention is... Less elongation during rotation,
This is about half or less compared to conventional products (see examples). Furthermore. The ratio N of the base disc of the present invention is approximately half or less of that of the conventional product (see Examples). Also. The base disc of the present invention is lighter than conventional base discs. Load on the motor due to rotation of the grinding wheel. The load on the grinding wheel shaft is small. The amount of heat generated in these is small. Therefore, the amount of heat transferred to the base disc is small. The thermal expansion of the grinding wheel is also smaller. Therefore. According to the present invention, it is possible to provide a grinding wheel that can perform highly accurate machining even at high circumferential speeds. [Example] A grinding wheel using the superabrasive grains according to the present invention was manufactured, and its performance was tested. The results are shown in Table 1.
以下．これらを詳述する．まず，上記研削砥石は第１図
及び第２図に示すごとく，超砥粒層からなるセグメント
チンブｌ（第１図）を作製し１ これを第２図に示すご
とくベース円板２に接着した．接着剤としては．エポキ
シ樹脂系接着剤を用いた。該ベース円板２は中央部に回
転軸用穴２０を有する．
そして，上記研削砥石は，ベース円板２の種類を変えて
，３種類作製（ＮＱＩ〜３）した．また，比較のため．
従来のベース円板を用いた研削砥石を４種類作製（阻Ｃ
１〜Ｃ４）した。below. These will be explained in detail. First, as shown in Figs. 1 and 2, for the above-mentioned grinding wheel, a segment chimble 1 (Fig. 1) consisting of a layer of super abrasive grains is prepared, and this is glued to the base disc 2 as shown in Fig. 2. did. As an adhesive. An epoxy resin adhesive was used. The base disc 2 has a rotary shaft hole 20 in the center. Three types of the above-mentioned grinding wheels were manufactured (NQI to 3) by changing the type of base disk 2. Also, for comparison.
We created four types of grinding wheels using conventional base disks (Ki-C
1-C4).
なお，セグメントチップｌは．いずれの研削砥石につい
ても同じである．
即ち．上記研削砥石は，その外径が３０５鵬回転軸用の
穴の径が７６．２ｍ，厚みが１５ｍである．また，セグ
メントチップの寸法は，長さ４Ｏ閣，幅１５■，厚みは
７ｍである．
また，出来上りの超砥粒層の構造は次のようである．
ＣＢＮ砥粒（＃３２５／４００）
５０容量部
ビトリファイドボンド
・・・・１８容量部
気 孔・・・・・・・・・３２容量部，また，テストに
おける研削条件は，下記のようである．
研削砥石周速度・・２７００ｍ／ｍｉｎテーブル送り速
度・・・２０ｍ／ｍｉｎ，切込量・・・・・・５μｍ／
ｐａｓｓ
被削材・・・・・・ＳＫＨ５ １
被削材寸法・・・・・・長さ３００×幅ｌｏｗまた，そ
れぞれのベース円板の材質としては．第ｌ表に示すもの
を用いた。この材質中，アルミニウムはＪＩＳ−Ａ６０
６１を．硬鋼はＪＩＳＳ５５Ｃを用いた．
また，ＳｉＣはシリコンカーバイド， Ａｆｆｉ． ０
，はアルミナを示す．また，粒状ＳｉＣは粒径５〜４０
μｍのものを用いた．また，繊維状Ａｌ．Ｏ，は．直径
５〜２０μｍのものを用いた．ｓｉＣウィスカーは．直
径５〜２ｏＩＩｍのものを用いた．
また，同表におけるＳｉＣ等の添加量（％）はベース円
板中に占める容積割合である．上記測定の結果を．第１
表に示す．
同表において．比率Ｎは密度（ ｋｇ ／ ｃｄ ）を
縦弾性係数（ｋｇ ｆ ／ｃ４）で除した値である．第
１表より知られるごとく，実施例１〜３のベース円板と
比較例Ｃ２とを比較すると，両者は同じアルミニウム合
金を用いているが，実施例１〜３のベース円板は熱膨張
係数が比較例ｃ２に比して約半分ないし３分の１と著し
く小さい．また，前記比率Ｎに関しては．実施例１〜３
のベース円板は比較例ＣＩ−Ｃ４に比して約半分以下で
ある。この比率Ｎは，その値が低いはどべ一ス円板の伸
びが小さいことを示している．またそのため．伸びに関
しては．実施例１〜３のベース円板は比較例０１〜Ｃ４
に比して約半分以下となっている．
なお，前記熱膨張に関しては．硬鋼を用いた比較例Ｃ１
のベース円板は実施例ｌより低く．スーパーインバー又
は給状黒鉛鋳鉄を用いた比較例Ｃ３又はＣ４のベース円
板は実施例２．３より低い。Note that the segment chip l is . The same applies to all grinding wheels. That is. The above-mentioned grinding wheel has an outer diameter of 305 mm, a diameter of the hole for the rotating shaft of 76.2 m, and a thickness of 15 m. In addition, the dimensions of the segment chip are 4 mm long, 15 mm wide, and 7 m thick. The structure of the completed superabrasive layer is as follows. CBN abrasive grains (#325/400) 50 parts by volume Vitrified bond 18 parts by volume Pores 32 parts by volume The grinding conditions in the test are as follows. Grinding wheel peripheral speed: 2700 m/min Table feed speed: 20 m/min, depth of cut: 5 μm/min
pass Work material...SKH5 1 Work material dimensions...Length 300 x width low Also, the material of each base disc is... Those shown in Table 1 were used. Among these materials, aluminum is JIS-A60
61. JISS55C hard steel was used. In addition, SiC is silicon carbide, Affi. 0
, indicates alumina. In addition, granular SiC has a particle size of 5 to 40
A μm one was used. In addition, fibrous Al. O, ha. A diameter of 5 to 20 μm was used. siC whiskers. A diameter of 5 to 2 oIIm was used. In addition, the amount (%) of SiC, etc. added in the same table is the volume percentage occupied in the base disk. The results of the above measurements. 1st
It is shown in the table. In the same table. The ratio N is the value obtained by dividing the density (kg/cd) by the longitudinal elastic modulus (kg f /c4). As is known from Table 1, when comparing the base discs of Examples 1 to 3 and Comparative Example C2, it is found that although both use the same aluminum alloy, the base discs of Examples 1 to 3 have a coefficient of thermal expansion. is significantly smaller, about half to one third, than that of Comparative Example c2. Also, regarding the ratio N. Examples 1-3
The base disk size of the sample was about half or less compared to that of Comparative Example CI-C4. A low value of this ratio N indicates that the elongation of the disk is small. Also for that reason. Regarding elongation. The base disks of Examples 1 to 3 are Comparative Examples 01 to C4.
This is about half or less compared to . Regarding the thermal expansion mentioned above. Comparative example C1 using hard steel
The base disc of is lower than that of Example I. The base disc of Comparative Example C3 or C4 using Super Invar or Feed Graphite Cast Iron is lower than Example 2.3.
しかし．これら比較例Ｃｌ，Ｃ３．Ｃ４は，前記のごと
くいずれも比率Ｎが大きいために，伸びが大きく．比較
例Ｃ２と同様に本発明の目的を達或できない．
上記のごとく，本発明によれば，熱膨張が小さく，伸び
の小さい超砥粒を用いた研削砥石を得ることができる。but. These comparative examples Cl, C3. As mentioned above, C4 has a large ratio N, so it has a large elongation. Similarly to Comparative Example C2, the purpose of the present invention cannot be achieved. As described above, according to the present invention, a grinding wheel using superabrasive grains with low thermal expansion and low elongation can be obtained.
また，実施例Ｉと比較例ＣＩの研削砥石について，実際
の研削性能を比較してみると２被加工物の面粗さが．実
施例ｌでは０．５μＲａ，比較例Ｃ１では１． ４μ
ｍＲａで，本発明の研削砥石は優れた加工精度を有して
いることが分る．ここにＲａは， ＪＩＳＢＯ６０１
により定められた中心線平均あらさをいう．
また，実施例ｌの研削砥石は，比較例Ｃ１に比して軽量
であるため，回転時にモータにかかる負担が小さく，例
えば空回転の場合のモータ電力は前者が０．６ｋｗ，後
者が１．Ｏｋｗである．また．比較例Ｃ３の研削砥石は
１．３ｋｗである．このように，モータ電力が小さいと
いうことは，研削砥石の回転に対するモータ負荷，軸受
負荷が小さいということである．そのため．本発明の研
削砥石を用いる場合には，モータの発熱，軸受の発熱が
小さくなる．その結果，ベース円板の温度上昇も抑えら
れ，熱によるベース円板の伸びも抑えられ．より高精度
の研削ができることになる。In addition, when comparing the actual grinding performance of the grinding wheels of Example I and Comparative Example CI, it was found that the surface roughness of the two workpieces. 0.5 μRa in Example 1 and 1.5 μRa in Comparative Example C1. 4μ
It can be seen that the grinding wheel of the present invention has excellent machining accuracy in terms of mRa. Here Ra is JISBO601
This refers to the centerline average roughness determined by Furthermore, since the grinding wheel of Example 1 is lighter than Comparative Example C1, the load placed on the motor during rotation is small, and for example, the motor power in the case of idle rotation is 0.6 kW for the former and 1.6 kW for the latter. It's okay. Also. The grinding wheel of Comparative Example C3 has a power of 1.3 kW. In this way, a small motor power means that the motor load and bearing load for the rotation of the grinding wheel are small. Therefore. When using the grinding wheel of the present invention, the heat generated by the motor and the bearings is reduced. As a result, the temperature rise of the base disc is suppressed, and the elongation of the base disc due to heat is also suppressed. This allows for higher precision grinding.
また，それ故に．研削砥石の高周速化を一層促進するこ
とができる．Also, therefore. It is possible to further increase the peripheral speed of the grinding wheel.
第１図及び第２図は実施例にかかる研削砥石を示し，第
ｌ図はその超砥粒層の斜視図．第２図は研削砥石の平面
図である．
１．．．セグメントチップ
２．．．ベース円板，
出馴人
株式会社ノリタケカンパニーリミテドFigures 1 and 2 show a grinding wheel according to an embodiment, and Figure 1 is a perspective view of its superabrasive layer. Figure 2 is a plan view of the grinding wheel. 1. ．． ．． Segment chip 2. ．． ．． Base disc, Noritake Co., Ltd. Dejijin Co., Ltd.
Claims (5)
いて、上記ベース円板は金属マトリクス中にセラミック
スの繊維又は粒子を分散させた複合材を用いてなること
を特徴とする研削砥石。(1) A grinding wheel formed by bonding an abrasive grain layer to a base disk, wherein the base disk is made of a composite material in which ceramic fibers or particles are dispersed in a metal matrix. .
ニウム合金、マグネシウム合金、チタン合金のいずれか
であることを特徴とする研削砥石。(2) The grinding wheel according to claim 1, wherein the metal matrix is one of an aluminum alloy, a magnesium alloy, and a titanium alloy.
ーバイド、ボロン、アルミナ、シリカ、カーボン、チタ
ン酸カリウム、チタン酸バリウムの１種又は２種以上で
あることを特徴とする研削砥石。(3) The grinding wheel according to claim 1, wherein the ceramic is one or more of silicon carbide, boron, alumina, silica, carbon, potassium titanate, and barium titanate.
Ｎ等の超砥粒、又はアルミナ、炭化珪素等の一般砥粒で
あることを特徴とする研削砥石。(4) In the first claim, the abrasive grains are diamond, CB
A grinding wheel characterized by being a super abrasive grain such as N or a general abrasive grain such as alumina or silicon carbide.
は、ビトリファイドボンド、レジノイドボンド又はメタ
ルボンドであることを特徴とする研削砥石。(5) The grinding wheel according to claim 1, wherein the abrasive grains in the abrasive layer are bonded by vitrified bond, resinoid bond, or metal bond.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23774689A JPH03104566A (en) | 1989-09-13 | 1989-09-13 | Grinding wheel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23774689A JPH03104566A (en) | 1989-09-13 | 1989-09-13 | Grinding wheel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03104566A true JPH03104566A (en) | 1991-05-01 |
Family
ID=17019858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23774689A Pending JPH03104566A (en) | 1989-09-13 | 1989-09-13 | Grinding wheel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03104566A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07171767A (en) * | 1993-12-17 | 1995-07-11 | Asahi Daiyamondo Kogyo Kk | Metal bond superabrasive stone and method for producing the same |
| JP2007203458A (en) * | 1998-01-30 | 2007-08-16 | Saint-Gobain Abrasives Inc | High speed grinding wheel |
| CN105856082A (en) * | 2016-06-08 | 2016-08-17 | 倪玉明 | Railway rail grinding wheel |
| CN106625297A (en) * | 2016-11-29 | 2017-05-10 | 磐维科技（青岛）有限公司 | CBN (Cubic Boron Nitride) grinding wheel |
| CN108747854A (en) * | 2018-06-29 | 2018-11-06 | 江苏赛扬精工科技有限责任公司 | A vitrified bond diamond grinding wheel with a low-temperature thermosetting layer and preparation method thereof |
-
1989
- 1989-09-13 JP JP23774689A patent/JPH03104566A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07171767A (en) * | 1993-12-17 | 1995-07-11 | Asahi Daiyamondo Kogyo Kk | Metal bond superabrasive stone and method for producing the same |
| JP2007203458A (en) * | 1998-01-30 | 2007-08-16 | Saint-Gobain Abrasives Inc | High speed grinding wheel |
| CN105856082A (en) * | 2016-06-08 | 2016-08-17 | 倪玉明 | Railway rail grinding wheel |
| CN106625297A (en) * | 2016-11-29 | 2017-05-10 | 磐维科技（青岛）有限公司 | CBN (Cubic Boron Nitride) grinding wheel |
| CN108747854A (en) * | 2018-06-29 | 2018-11-06 | 江苏赛扬精工科技有限责任公司 | A vitrified bond diamond grinding wheel with a low-temperature thermosetting layer and preparation method thereof |
| CN108747854B (en) * | 2018-06-29 | 2020-09-25 | 江苏赛扬精工科技有限责任公司 | A kind of ceramic bond diamond grinding wheel with low temperature thermosetting adhesion layer and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6019668A (en) | Method for grinding precision components | |
| US6093092A (en) | Abrasive tools | |
| CZ20003542A3 (en) | Grinding tool | |
| JP2017170554A (en) | Vitrified grindstone for low pressure lapping for lapping machine and polishing method using the same | |
| JP2024024111A (en) | Three layer grinding wheel | |
| US7883398B2 (en) | Abrasive tool | |
| JPH03104566A (en) | Grinding wheel | |
| US7131903B2 (en) | Segmented superabrasive grinding device | |
| JPH03234474A (en) | Grinding wheel | |
| Onishi et al. | Fabrication of new porous metal-bonded grinding wheels by HIP method and machining electronic ceramics | |
| JPH10202538A (en) | Porous diamond cutter for cutting pig-iron of casting or steel | |
| JPH03256674A (en) | Base disc grinding stone | |
| US6319109B1 (en) | Disk-shaped grindstone | |
| JP3083483B2 (en) | Grinding wheel | |
| JPH11333730A (en) | Diamond lapping surface plate | |
| JP2001300856A (en) | Super abrasive tool | |
| JPS62148159A (en) | Super abrasive super finishing whetstone | |
| JPH0890424A (en) | Disc base for grinding wheel | |
| JP2000354968A (en) | Centrifugal molding method of disc type molding | |
| JP2003053668A (en) | Vitrified bond grinding wheel | |
| JPH01188275A (en) | Grinding stone | |
| JPH11188636A (en) | Base disk type grinding wheel | |
| JP3377977B2 (en) | Rotating wheel grindstone | |
| JPS6085869A (en) | Grindstone | |
| JPH0428502B2 (en) |