JPH0310502U - - Google Patents

Info

Publication number
JPH0310502U
JPH0310502U JP7134689U JP7134689U JPH0310502U JP H0310502 U JPH0310502 U JP H0310502U JP 7134689 U JP7134689 U JP 7134689U JP 7134689 U JP7134689 U JP 7134689U JP H0310502 U JPH0310502 U JP H0310502U
Authority
JP
Japan
Prior art keywords
substrate
electrodes
layer
glass layer
chip resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7134689U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7134689U priority Critical patent/JPH0310502U/ja
Publication of JPH0310502U publication Critical patent/JPH0310502U/ja
Pending legal-status Critical Current

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  • Details Of Resistors (AREA)
  • Non-Adjustable Resistors (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の原理図、第2図は本考案の各
実施例の構成図、第3図は従来のチツプ抵抗の構
成図、第4図は従来のチツプ抵抗の実装状態図で
ある。 図中、1……セラミツク基板、2……電極、3
……抵抗層、4……オーバコートガラス層、4A
……その端部、7……半田、7A……フイレツト
である。
Fig. 1 is a diagram of the principle of the present invention, Fig. 2 is a block diagram of each embodiment of the present invention, Fig. 3 is a block diagram of a conventional chip resistor, and Fig. 4 is a diagram of the mounting state of a conventional chip resistor. . In the figure, 1...ceramic substrate, 2...electrode, 3
...Resistance layer, 4...Overcoat glass layer, 4A
. . . its end, 7 . . . solder, 7A . . . fillet.

Claims (1)

【実用新案登録請求の範囲】 セラミツク基板1と、 該基板の両端に上面から下面にかけて形成され
た電極2と、 該基板の表面に形成され、両端部が該電極に接
続された抵抗層3と、 該抵抗層の表面を覆うオーバコートガラス層4
とを備え、 該ガラス層の端部4Aを前記電極上において波
型に形成してなることを特徴とするチツプ抵抗。
[Claims for Utility Model Registration] A ceramic substrate 1, electrodes 2 formed on both ends of the substrate from the top to the bottom, and a resistive layer 3 formed on the surface of the substrate, both ends connected to the electrodes. , an overcoat glass layer 4 covering the surface of the resistance layer
A chip resistor comprising: an end portion 4A of the glass layer formed in a wave shape on the electrode.
JP7134689U 1989-06-19 1989-06-19 Pending JPH0310502U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7134689U JPH0310502U (en) 1989-06-19 1989-06-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7134689U JPH0310502U (en) 1989-06-19 1989-06-19

Publications (1)

Publication Number Publication Date
JPH0310502U true JPH0310502U (en) 1991-01-31

Family

ID=31608289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7134689U Pending JPH0310502U (en) 1989-06-19 1989-06-19

Country Status (1)

Country Link
JP (1) JPH0310502U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017126593A (en) * 2016-01-12 2017-07-20 パナソニックIpマネジメント株式会社 Chip resistor
JP2018139248A (en) * 2017-02-24 2018-09-06 パナソニックIpマネジメント株式会社 Chip resistor mounting structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017126593A (en) * 2016-01-12 2017-07-20 パナソニックIpマネジメント株式会社 Chip resistor
JP2018139248A (en) * 2017-02-24 2018-09-06 パナソニックIpマネジメント株式会社 Chip resistor mounting structure

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