JPH0310536U - - Google Patents

Info

Publication number
JPH0310536U
JPH0310536U JP7200389U JP7200389U JPH0310536U JP H0310536 U JPH0310536 U JP H0310536U JP 7200389 U JP7200389 U JP 7200389U JP 7200389 U JP7200389 U JP 7200389U JP H0310536 U JPH0310536 U JP H0310536U
Authority
JP
Japan
Prior art keywords
block
board
heater
side block
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7200389U
Other languages
English (en)
Other versions
JPH075633Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7200389U priority Critical patent/JPH075633Y2/ja
Publication of JPH0310536U publication Critical patent/JPH0310536U/ja
Application granted granted Critical
Publication of JPH075633Y2 publication Critical patent/JPH075633Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
図は本考案の実施例を示すものであつて、第１
図は位置決め装置の斜視図、第２図は側面図、第
３図は押え部材の斜視図、第４図及び第５図は他
の実施例の側面図及び押え部材の斜視図、第６図
は従来装置の側面図である。 １……ヒータブロツク、２……ヒータレール、
３……基板、６……昇降装置、２３……第１のサ
イドブロツク、２４，２７，４０……押え部材、
３１……第２のサイドブロツク、３４……ばね材
。

Claims (1)

    【実用新案登録請求の範囲】
  1. 昇降装置により昇降自在に配設されたヒータブ
    ロツクと、このヒータブロツク上に設けられたヒ
    ータレールとを備え、このヒータレールの一方の
    側部に、ヒータレール上に載置された基板の一方
    の側面を位置決めする第１のサイドブロツクを設
    けるとともに、ヒータレールの他方の側部上に、
    基板の巾方向に位置調整自在な第２のサイドブロ
    ツクを設け、かつこの第２のサイドブロツクと基
    板の間に、基板を上記第１のサイドブロツクへ押
    圧するばね材を介設し、また基板の上部側方から
    この基板の上方に延出して、この基板を下方に押
    え付けるばね材から成る押え部材を設け、かつこ
    の押え部材を基板の巾方向に位置調整自在とした
    ことを特徴とするワイヤボンダーにおける基板の
    位置決め装置。
JP7200389U 1989-06-20 1989-06-20 ワイヤボンダーにおける基板の位置決め装置 Expired - Lifetime JPH075633Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7200389U JPH075633Y2 (ja) 1989-06-20 1989-06-20 ワイヤボンダーにおける基板の位置決め装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7200389U JPH075633Y2 (ja) 1989-06-20 1989-06-20 ワイヤボンダーにおける基板の位置決め装置

Publications (2)

Publication Number Publication Date
JPH0310536U true JPH0310536U (ja) 1991-01-31
JPH075633Y2 JPH075633Y2 (ja) 1995-02-08

Family

ID=31609547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7200389U Expired - Lifetime JPH075633Y2 (ja) 1989-06-20 1989-06-20 ワイヤボンダーにおける基板の位置決め装置

Country Status (1)

Country Link
JP (1) JPH075633Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52152538U (ja) * 1976-05-15 1977-11-18
JPS61179245U (ja) * 1985-04-27 1986-11-08

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52152538U (ja) * 1976-05-15 1977-11-18
JPS61179245U (ja) * 1985-04-27 1986-11-08

Also Published As

Publication number Publication date
JPH075633Y2 (ja) 1995-02-08

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term