JPH0310538U - - Google Patents
Info
- Publication number
- JPH0310538U JPH0310538U JP1989068993U JP6899389U JPH0310538U JP H0310538 U JPH0310538 U JP H0310538U JP 1989068993 U JP1989068993 U JP 1989068993U JP 6899389 U JP6899389 U JP 6899389U JP H0310538 U JPH0310538 U JP H0310538U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- shaft
- movable body
- forming punch
- adjustment mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989068993U JPH0310538U (da) | 1989-06-15 | 1989-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989068993U JPH0310538U (da) | 1989-06-15 | 1989-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0310538U true JPH0310538U (da) | 1991-01-31 |
Family
ID=31603917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989068993U Pending JPH0310538U (da) | 1989-06-15 | 1989-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310538U (da) |
-
1989
- 1989-06-15 JP JP1989068993U patent/JPH0310538U/ja active Pending
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