JPH0310569U - - Google Patents
Info
- Publication number
- JPH0310569U JPH0310569U JP6988389U JP6988389U JPH0310569U JP H0310569 U JPH0310569 U JP H0310569U JP 6988389 U JP6988389 U JP 6988389U JP 6988389 U JP6988389 U JP 6988389U JP H0310569 U JPH0310569 U JP H0310569U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- bonded
- treated
- treated portion
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000004381 surface treatment Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例の回路基板の電気部
品を取付ける前の状態を示す斜視図、第２図は同
上電気部品を取付ける状態後を示す断面図、第３
図は他の実施例を示す回路基板を示す斜視図であ
る。
１……回路基板、４……非表面処理部、５……
電気部品としてのトランス、７……接着剤。
FIG. 1 is a perspective view of a circuit board according to an embodiment of the present invention before electrical components are attached; FIG. 2 is a sectional view of the circuit board after the electrical components are attached; FIG.
The figure is a perspective view showing a circuit board showing another embodiment. 1... Circuit board, 4... Non-surface treated section, 5...
Transformer as an electrical component, 7...Adhesive.
Claims (1)
にて接着して固定する回路基板において、一部に
表面処理を施さない非表面処理部を形成し、この
非表面処理部に前記電気部品を接着することを特
徴とした回路基板。 In a circuit board that has been surface-treated and on which electrical components are bonded and fixed using an adhesive, a non-surface-treated portion is formed where no surface treatment is applied, and the electrical component is bonded to this non-surface-treated portion. A circuit board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6988389U JPH0310569U (en) | 1989-06-15 | 1989-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6988389U JPH0310569U (en) | 1989-06-15 | 1989-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0310569U true JPH0310569U (en) | 1991-01-31 |
Family
ID=31605570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6988389U Pending JPH0310569U (en) | 1989-06-15 | 1989-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310569U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012039551A3 (en) * | 2010-09-20 | 2012-05-18 | 주식회사 미르엠케이 | Puzzle-type printed circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63133594A (en) * | 1986-11-25 | 1988-06-06 | 株式会社神戸製鋼所 | Board for forming electric circuit |
-
1989
- 1989-06-15 JP JP6988389U patent/JPH0310569U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63133594A (en) * | 1986-11-25 | 1988-06-06 | 株式会社神戸製鋼所 | Board for forming electric circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012039551A3 (en) * | 2010-09-20 | 2012-05-18 | 주식회사 미르엠케이 | Puzzle-type printed circuit board |