JPH0310663Y2 - - Google Patents
Info
- Publication number
- JPH0310663Y2 JPH0310663Y2 JP9468885U JP9468885U JPH0310663Y2 JP H0310663 Y2 JPH0310663 Y2 JP H0310663Y2 JP 9468885 U JP9468885 U JP 9468885U JP 9468885 U JP9468885 U JP 9468885U JP H0310663 Y2 JPH0310663 Y2 JP H0310663Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- chip
- flat part
- case
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 27
- 238000007789 sealing Methods 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 4
- 239000011888 foil Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、縦横兼用型のチツプ形電解コンデン
サに関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a chip-type electrolytic capacitor that can be used both vertically and horizontally.
本願出願人は、昭和58年実用新案登録願第
70089号〓チツプ形電解コンデンサ〓により外装
ケースを使用したチツプ形電解コンデンサを提案
した。第4図および第5図に示すように、この種
のチツプ形電解コンデンサ1は、コンデンサ素子
2をゴム封口体3と共に一方を開口とした有底状
のケース4内に組込み、コンデンサ素子2からの
ゴム封口体3を介したリード線5,6の外部導出
部分を圧延して偏平部51,61とした電解コン
デンサ7を一方を開口とした樹脂材からなる有底
状の外装ケース8に組込み、開口部に充填剤9を
充填した後に硬化させ、外部端子となる偏平部5
1,61を外装ケース8に沿つて配設したもので
ある。
The applicant of this application is the utility model registration application no.
No. 70089 (Chip-type electrolytic capacitor) proposed a chip-type electrolytic capacitor that uses an external case. As shown in FIGS. 4 and 5, this type of chip-type electrolytic capacitor 1 has a capacitor element 2 assembled together with a rubber sealing member 3 in a bottomed case 4 with one side open. An electrolytic capacitor 7 is assembled into a bottomed exterior case 8 made of a resin material with an opening on one side by rolling the external lead-out portions of the lead wires 5 and 6 through the rubber sealing body 3 to form flat parts 51 and 61. , the opening is filled with a filler 9 and then hardened to form a flat part 5 that becomes an external terminal.
1 and 61 are arranged along the outer case 8.
このような従来例においては、専ら第6図に示
すようにチツプ形電解コンデンサ1の長手方向を
基板10上に載置し、基板10上の導体ランド1
0A,10Bと外部端子であるリード線5,6の
偏平部51,61とを半田10C付けしていた。
つまり、チツプ形電解コンデンサ1を横形として
使用していたのである。
In such a conventional example, as shown in FIG.
0A, 10B and flat portions 51, 61 of lead wires 5, 6, which are external terminals, were soldered 10C.
In other words, the chip type electrolytic capacitor 1 was used as a horizontal type.
しかしながら、電子部品の実装密度の向上が期
待されている昨今では、第7図に示すようにチツ
プ形電解コンデンサ1を自立させて半田10C付
けし、縦型として使用する場合もある。このよう
な場合、実装時の安定性を悪いばかりでなく、半
田付け面積を大きくとれず、半田不良となること
が多いという欠点がある。 However, these days, it is expected that the packaging density of electronic components will be improved, and as shown in FIG. 7, the chip electrolytic capacitor 1 is sometimes made to stand on its own and soldered 10C to be used as a vertical type capacitor. In such a case, there is a drawback that not only is stability during mounting poor, but also a large soldering area cannot be secured, which often results in solder defects.
しかるに、本考案は上述の欠点を除去するため
に、すでに形成されている偏平部に他の偏平部を
固着し、横型として使用した場合は勿論のこと、
縦型として使用した場合であつても良好な半田付
けが可能な縦横兼用型のチツプ形電解コンデンサ
を提供するものである。
However, in order to eliminate the above-mentioned drawbacks, the present invention fixes another flat part to the already formed flat part, and of course when used as a horizontal type,
To provide a chip-type electrolytic capacitor that can be used both vertically and horizontally, and which can be soldered well even when used vertically.
以下に、本考案に係る縦横兼用型のチツプ形電
解コンデンサの一実施例を第1図乃至第3図と共
に説明する。
An embodiment of a vertically and horizontally used chip type electrolytic capacitor according to the present invention will be described below with reference to FIGS. 1 to 3.
アルミニウム箔の陽極箔と陰極箔を電解紙を介
して捲回され、電解液を含浸されたアルミニウム
コンデンサ素子2は、ゴム封口体3と共に、一方
を開口とした有底状のアルミニウムケース4内に
組込まれる。ケース4の開放端はカール加工41
が施され、またゴム封口体3の位置する部分は絞
り加工42が施される。コンデンサ素子2の陽極
箔と陰極箔にそれぞれ一端を固着され、かつゴム
封口体3を介して導出されたリード線5,6の他
端は圧延され、第1の偏平部51,61を構成す
る。この第1の偏平部51,61は互いに平行で
あつて、コの字形に折り曲げられている。また、
第1の偏平部51,61のゴム封口体3からの導
出部分にはそれぞれ逆方向にコの字形に折り曲げ
られた他の板状の第2の偏平部52,62が固着
されている。そして、このように構成された電解
コンデンサ7は、一方を開口とした有底状の外装
ケース8内に組込まれる。開口部には充填剤9を
充填し、硬化させる。なお、外部端子となる偏平
部51,52,61,62の折曲加工は外装ケー
ス8内に電解コンデンサ7を組込む前、あるいは
組込み後に形成するかはいずれでも良い。さら
に、偏平部51,52,61,62の外表面は第
1図に示すように外装ケースに8の外表面より突
出していても良く、また、第3図に示すように外
装ケースに8の外表面と同一平面上であつても良
いものである。 An aluminum capacitor element 2 in which an anode foil and a cathode foil of aluminum foil are wound with electrolytic paper interposed therebetween and impregnated with an electrolytic solution is placed together with a rubber sealing body 3 in a bottomed aluminum case 4 with one side open. Incorporated. The open end of case 4 is curled 41
is applied, and the portion where the rubber sealing body 3 is located is subjected to a drawing process 42. The other ends of the lead wires 5 and 6, which have one end fixed to the anode foil and the cathode foil of the capacitor element 2 and are led out through the rubber sealing body 3, are rolled to form first flat parts 51 and 61. . The first flat parts 51 and 61 are parallel to each other and bent into a U-shape. Also,
Other plate-shaped second flat parts 52, 62 each bent in a U-shape in opposite directions are fixed to the leading-out portions of the first flat parts 51, 61 from the rubber sealing body 3. The electrolytic capacitor 7 thus configured is assembled into a bottomed exterior case 8 with one side open. Filler 9 is filled into the opening and hardened. Note that the bending of the flat portions 51, 52, 61, and 62, which will become external terminals, may be performed either before or after the electrolytic capacitor 7 is assembled into the exterior case 8. Furthermore, the outer surfaces of the flat parts 51, 52, 61, and 62 may protrude from the outer surface of the outer case 8 as shown in FIG. It may be on the same plane as the outer surface.
以上に述べた本考案によると、外部端子は互い
に平行に形成された一対の第1偏平部51と第2
偏平部52、および第1偏平部61と第2偏平部
62とから構成されるために、チツプ形電解コン
デンサ1Aを縦形として使用した場合、基板上で
の載置面積を2倍にすることができ、半田面積を
大きくとることができるという利点を奏するもの
である。また、第3図に示すように、横形として
使用した場合には基板10上の導体ランド10
A,10Bに対して、半田付けされる第1の偏平
部51,61とは反対側の第2の偏平部52,6
2に他の電子部品11を半田付けすることができ
るという利点を奏するものである。
According to the present invention described above, the external terminal has a pair of first flat portions 51 and second flat portions formed parallel to each other.
Since it is composed of the flat part 52, the first flat part 61, and the second flat part 62, when the chip electrolytic capacitor 1A is used as a vertical type, the mounting area on the board can be doubled. This has the advantage that the solder area can be increased. Further, as shown in FIG. 3, when used horizontally, the conductor land 10 on the substrate 10
A, 10B, second flat parts 52, 6 opposite to the first flat parts 51, 61 to be soldered
This provides an advantage in that other electronic components 11 can be soldered to 2.
第1図は本考案に係るチツプ形電解コンデンサ
を示す側断面図、第2図は本考案に係るチツプ形
電解コンデンサを示す正面図、第3図は本考案に
係るチツプ形電解コンデンサを横形として基板上
に載置した状態を示す斜視図、第4図は従来例を
示す側断面図、第5図は従来例を示す正面図、第
6図は従来例を横形として基板上に載置した状態
を示す側面図、第7図は従来例を縦形として基板
上に載置した状態を示す側面図である。
図中、1,1A……チツプ形電解コンデンサ、
2……コンデンサ素子、3……封口体、4……ケ
ース、5,6……リード線、51,52,61,
62……偏平部、7……電解コンデンサ、8……
外装ケース、9……充填剤、10……基板、10
A,10B……導体ランド、10C……半田、1
1……電子部品。
Figure 1 is a side sectional view showing a chip type electrolytic capacitor according to the present invention, Figure 2 is a front view showing a chip type electrolytic capacitor according to the present invention, and Figure 3 is a horizontal cross-sectional view of the chip type electrolytic capacitor according to the present invention. Fig. 4 is a side sectional view showing the conventional example, Fig. 5 is a front view showing the conventional example, and Fig. 6 shows the conventional example placed horizontally on the substrate. FIG. 7 is a side view showing the state in which the conventional example is placed vertically on a substrate. In the figure, 1,1A...chip type electrolytic capacitor,
2... Capacitor element, 3... Sealing body, 4... Case, 5, 6... Lead wire, 51, 52, 61,
62... Flat part, 7... Electrolytic capacitor, 8...
Exterior case, 9...Filler, 10...Substrate, 10
A, 10B...Conductor land, 10C...Solder, 1
1...Electronic parts.
Claims (1)
たケース内に組込み、コンデンサ素子からの封口
体を介した2本のリード線をそれぞれ圧延して第
1の偏平部とした電解コンデンサを一方を開口と
した有底状の外装ケース内に組込み、開口部に充
填剤を充填し、外部端子としての第1の偏平部を
外装ケースに沿つてコの字形に並列に配設したチ
ツプ形電解コンデンサにおいて、第1の偏平部に
対して反対方向に延長する他の第2の偏平部を固
着し、外装ケースに沿つて逆コの字形に並列に配
設してなるチツプ形電解コンデンサ。 The capacitor element and the sealing body were assembled in a case with one side open, and the two lead wires from the capacitor element through the sealing body were each rolled to form a first flat part.The electrolytic capacitor was made one side open. In a chip-type electrolytic capacitor that is assembled in a bottomed exterior case, the opening is filled with a filler, and the first flat parts serving as external terminals are arranged in parallel in a U-shape along the exterior case. A chip-type electrolytic capacitor in which a second flat part extending in the opposite direction to the first flat part is fixed and arranged in parallel in an inverted U-shape along an exterior case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9468885U JPH0310663Y2 (en) | 1985-06-22 | 1985-06-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9468885U JPH0310663Y2 (en) | 1985-06-22 | 1985-06-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS624124U JPS624124U (en) | 1987-01-12 |
| JPH0310663Y2 true JPH0310663Y2 (en) | 1991-03-15 |
Family
ID=30653389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9468885U Expired JPH0310663Y2 (en) | 1985-06-22 | 1985-06-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310663Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0670339B2 (en) * | 1991-03-29 | 1994-09-07 | 忠彦 藤城 | Framework scaffolding |
| JP2500899B2 (en) * | 1993-03-17 | 1996-05-29 | アサヒ産業株式会社 | How to build a frame scaffold |
-
1985
- 1985-06-22 JP JP9468885U patent/JPH0310663Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS624124U (en) | 1987-01-12 |
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