JPH03108672U - - Google Patents
Info
- Publication number
- JPH03108672U JPH03108672U JP1760390U JP1760390U JPH03108672U JP H03108672 U JPH03108672 U JP H03108672U JP 1760390 U JP1760390 U JP 1760390U JP 1760390 U JP1760390 U JP 1760390U JP H03108672 U JPH03108672 U JP H03108672U
- Authority
- JP
- Japan
- Prior art keywords
- mount
- letter
- view
- stationery
- envelopes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 claims 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
Landscapes
- Packages (AREA)
Description
第１図は全体の斜視図、第２図は第１図Ａ−Ａ
線に沿う断面略図、第３図は台紙の平面図、第４
図はパツケージとした状態の斜視図である。
１……台紙、２……切り取り線、３……折り線
、４……パツケージ構成部、５……便箋、６……
封筒、７……宛名書シート、８……リボン、９…
…セロハン接着テープ、１０……透明袋、１１…
…感圧接着層、１２……開閉可能の蓋。
Figure 1 is an overall perspective view, Figure 2 is Figure 1 A-A
A schematic cross-sectional view along the line, Figure 3 is a plan view of the mount, Figure 4 is a plan view of the mount.
The figure is a perspective view of the package. 1... Mounting paper, 2... Cutting line, 3... Folding line, 4... Package component, 5... Letter paper, 6...
Envelope, 7...Address sheet, 8...Ribbon, 9...
...Cellophane adhesive tape, 10...Transparent bag, 11...
...Pressure-sensitive adhesive layer, 12... Lid that can be opened and closed.
Claims (1)
袋に入れて商品とされるレターセツトにおいて、
台紙に切り取り線および折り線をつけることで同
台紙に設けられたパツケージ構成部をもつことを
特徴とするレターセツト用の台紙。 In letter sets, where stationery, envelopes, etc. are stacked on a backing paper and placed in a packaging bag,
A mount for a letter set characterized by having a package component part provided on the mount by cutting out and folding lines on the mount.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1760390U JPH076147Y2 (en) | 1990-02-24 | 1990-02-24 | Mount for letter set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1760390U JPH076147Y2 (en) | 1990-02-24 | 1990-02-24 | Mount for letter set |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03108672U true JPH03108672U (en) | 1991-11-08 |
| JPH076147Y2 JPH076147Y2 (en) | 1995-02-15 |
Family
ID=31520789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1760390U Expired - Lifetime JPH076147Y2 (en) | 1990-02-24 | 1990-02-24 | Mount for letter set |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH076147Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6028739B2 (en) | 2013-03-07 | 2016-11-16 | 株式会社村田製作所 | Manufacturing method of electronic parts |
-
1990
- 1990-02-24 JP JP1760390U patent/JPH076147Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH076147Y2 (en) | 1995-02-15 |
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