JPH03110856U - - Google Patents
Info
- Publication number
- JPH03110856U JPH03110856U JP1831190U JP1831190U JPH03110856U JP H03110856 U JPH03110856 U JP H03110856U JP 1831190 U JP1831190 U JP 1831190U JP 1831190 U JP1831190 U JP 1831190U JP H03110856 U JPH03110856 U JP H03110856U
- Authority
- JP
- Japan
- Prior art keywords
- electrode part
- view
- plan
- terminal
- showing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の第１実施例による半導体デバ
イスの電極部構造を示す部分平面図、第２図は第
１図の端子の側面図、第３図は本考案による半導
体デバイスの例を示す平面図、第４図は従来技術
を説明する図、第５図は本考案の第２実施例を示
す平面図、第６図は本考案の第３実施例を示す平
面図、第７Ａ図は本考案の第４実施例を示す平面
図、第７Ｂ図は本考案の第５実施例を示す平面図
、第７Ｃ図は本考案の第６実施例を示す平面図、
第８Ａ図は本考案の第７実施例を示す平面図、第
８Ｂ図は第８Ａ図の線−に沿つた断面図、第
９Ａ図は第７実施例の応用例を示す平面図、第９
Ｂ図は第７実施例の他の応用例を示す平面図、第
１０Ａ図は本考案の第８実施例を示す平面図、第
１０Ｂ図は第１０Ａ図の線−に沿つた断面図
、第１１Ａ図は本考案の第９実施例を示す平面図
、第１１Ｂ図は第１１Ａ図の線−に沿つ
た断面図、第１２図は本考案の第１０実施例を示
す平面図、第１３図は第１２図の基板に端子を取
りつけたところを示す平面図である。
１２……基板、１８……ランド、２０……電極
部、２６……端子、２８……挿入目印。
FIG. 1 is a partial plan view showing the electrode structure of a semiconductor device according to a first embodiment of the present invention, FIG. 2 is a side view of the terminal shown in FIG. 1, and FIG. 3 is an example of a semiconductor device according to the present invention. FIG. 4 is a plan view explaining the prior art, FIG. 5 is a plan view showing a second embodiment of the present invention, FIG. 6 is a plan view showing a third embodiment of the present invention, and FIG. 7A is a plan view showing a third embodiment of the present invention. FIG. 7B is a plan view showing the fifth embodiment of the present invention; FIG. 7C is a plan view showing the sixth embodiment of the present invention;
FIG. 8A is a plan view showing a seventh embodiment of the present invention, FIG. 8B is a sectional view taken along the line - of FIG. 8A, FIG. 9A is a plan view showing an application example of the seventh embodiment, and FIG.
Fig. B is a plan view showing another application example of the seventh embodiment, Fig. 10A is a plan view showing the eighth embodiment of the present invention, Fig. 10B is a sectional view taken along the line - of Fig. 10A, and Fig. 10A is a plan view showing another application example of the seventh embodiment. Figure 11A is a plan view showing a ninth embodiment of the present invention, Figure 11B is a sectional view taken along the line - in Figure 11A, Figure 12 is a plan view showing a tenth embodiment of the present invention, and Figure 13. 13 is a plan view showing terminals attached to the board of FIG. 12. FIG. 12... Board, 18... Land, 20... Electrode part, 26... Terminal, 28... Insertion mark.
Claims (1)
た電極部を有し、端子を該電極部に直角な方向か
ら挿入し且つ該端子を該ランドに固定するように
した半導体デバイスの電極部構造において、該電
極部に該端子の挿入方向に延びる挿入目印を設け
たことを特徴とする半導体デバイスの電極部構造
。 In an electrode part structure of a semiconductor device having an electrode part provided with a plurality of lands on at least one side of a substrate, a terminal is inserted into the electrode part from a direction perpendicular to the electrode part, and the terminal is fixed to the land. An electrode part structure for a semiconductor device, characterized in that the electrode part is provided with an insertion mark extending in the insertion direction of the terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990018311U JP2531130Y2 (en) | 1990-02-27 | 1990-02-27 | Electrode structure of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990018311U JP2531130Y2 (en) | 1990-02-27 | 1990-02-27 | Electrode structure of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03110856U true JPH03110856U (en) | 1991-11-13 |
| JP2531130Y2 JP2531130Y2 (en) | 1997-04-02 |
Family
ID=31521474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990018311U Expired - Lifetime JP2531130Y2 (en) | 1990-02-27 | 1990-02-27 | Electrode structure of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2531130Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5837943A (en) * | 1981-08-31 | 1983-03-05 | Fujitsu Ltd | Manufacture of hybrid integrated circuit |
| JPS5936975A (en) * | 1982-08-25 | 1984-02-29 | Fuji Electric Co Ltd | Solar ray power generator |
-
1990
- 1990-02-27 JP JP1990018311U patent/JP2531130Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5837943A (en) * | 1981-08-31 | 1983-03-05 | Fujitsu Ltd | Manufacture of hybrid integrated circuit |
| JPS5936975A (en) * | 1982-08-25 | 1984-02-29 | Fuji Electric Co Ltd | Solar ray power generator |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2531130Y2 (en) | 1997-04-02 |