JPH03110885U - - Google Patents

Info

Publication number
JPH03110885U
JPH03110885U JP1990019671U JP1967190U JPH03110885U JP H03110885 U JPH03110885 U JP H03110885U JP 1990019671 U JP1990019671 U JP 1990019671U JP 1967190 U JP1967190 U JP 1967190U JP H03110885 U JPH03110885 U JP H03110885U
Authority
JP
Japan
Prior art keywords
lsi package
heat dissipation
dissipation structure
cover
leaf spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990019671U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990019671U priority Critical patent/JPH03110885U/ja
Publication of JPH03110885U publication Critical patent/JPH03110885U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａは本考案のＬＳＩパツケージの放熱構
造の一実施例を示す部分側断面図、第１図ｂは同
図ａにおけるＡ−Ａ線による矢視図、第２図は従
来のＬＳＩパツケージの放熱構造の一例を示す部
分側断面図である。 １……板ばね、２，６……ヒートシンク、３…
…ＬＳＩパツケージ、４……ＰＷＢ、５……カバ
ー、１１……スリツト、１２……ねじ。 Figure 1a is a partial side sectional view showing an embodiment of the heat dissipation structure of the LSI package of the present invention, Figure 1b is a view taken along the line A-A in Figure a, and Figure 2 is a conventional LSI package. FIG. 3 is a partial side sectional view showing an example of a heat dissipation structure. 1... Leaf spring, 2, 6... Heat sink, 3...
...LSI package, 4...PWB, 5...cover, 11...slit, 12...screw.

Claims (1)

【実用新案登録請求の範囲】 １ 回路基板モジユールのカバーとＬＳＩパツケ
ージとの間に挿入されその上面が前記カバーと接
触する板ばねを備えることを特徴とするＬＳＩパ
ツケージの放熱構造。 ２ 前記板ばねはその上面にスリツトを形成した
熱伝導性の良い金属材から成ることを特徴とする
請求項１記載のＬＳＩパツケージの放熱構造。[Claims for Utility Model Registration] 1. A heat dissipation structure for an LSI package, comprising a leaf spring inserted between a cover of a circuit board module and an LSI package, the upper surface of which is in contact with the cover. 2. The heat dissipation structure for an LSI package according to claim 1, wherein the leaf spring is made of a metal material with good thermal conductivity and has a slit formed on its upper surface.
JP1990019671U 1990-02-27 1990-02-27 Pending JPH03110885U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990019671U JPH03110885U (en) 1990-02-27 1990-02-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990019671U JPH03110885U (en) 1990-02-27 1990-02-27

Publications (1)

Publication Number Publication Date
JPH03110885U true JPH03110885U (en) 1991-11-13

Family

ID=31522776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990019671U Pending JPH03110885U (en) 1990-02-27 1990-02-27

Country Status (1)

Country Link
JP (1) JPH03110885U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020087971A (en) * 2018-11-15 2020-06-04 株式会社デンソー Heat dissipation structure for semiconductor component

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62219598A (en) * 1986-03-19 1987-09-26 富士通株式会社 Heat radiation of device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62219598A (en) * 1986-03-19 1987-09-26 富士通株式会社 Heat radiation of device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020087971A (en) * 2018-11-15 2020-06-04 株式会社デンソー Heat dissipation structure for semiconductor component

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