JPH03111456U - - Google Patents
Info
- Publication number
- JPH03111456U JPH03111456U JP2024390U JP2024390U JPH03111456U JP H03111456 U JPH03111456 U JP H03111456U JP 2024390 U JP2024390 U JP 2024390U JP 2024390 U JP2024390 U JP 2024390U JP H03111456 U JPH03111456 U JP H03111456U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- adhesion prevention
- cooling fan
- prevention agent
- automatic soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 230000002265 prevention Effects 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は、この考案の一実施例による自動はん
だ付装置の構成を示す側面図、第２図は、はんだ
付着防止剤除去装置の側面図、第３図は従来のは
んだ付け装置を示す側面図、第４図は印刷配線板
の断面図。
１……フラツクス塗布装置、２……予備加熱装
置、３……はんだ槽、４……冷却フアン、５……
搬送チエーン、６……印刷配線板、１１……はん
だ付着防止剤除去装置、１２……除去用回転ブラ
シ、１３……駆動チエーン、１４……駆動モータ
、１５……飛散防止カバー、１６……収納箱、７
……電子部品、８……はんだ、９……銅箱、１０
……はんだ付着防止剤である。なお、図中、同一
符号は同一または相当部分を示す。
Fig. 1 is a side view showing the configuration of an automatic soldering device according to an embodiment of the invention, Fig. 2 is a side view of a solder adhesion prevention agent removal device, and Fig. 3 is a side view showing a conventional soldering device. 4 are cross-sectional views of the printed wiring board. 1... Flux coating device, 2... Preheating device, 3... Solder bath, 4... Cooling fan, 5...
Conveyance chain, 6... Printed wiring board, 11... Solder adhesion prevention agent removal device, 12... Rotating brush for removal, 13... Drive chain, 14... Drive motor, 15... Scattering prevention cover, 16... storage box, 7
...Electronic parts, 8...Solder, 9...Copper box, 10
...It is a solder adhesion prevention agent. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
んだ槽および冷却フアン各々順次通過し所要箇所
に、はんだ溶液を付着させ一括はんだ付けする。
自動はんだ付け装置において、上記予備加熱装置
、はんだ槽および冷却フアンの後方にはんだが付
着してはならない箇所に、前工程にて塗布された
はんだ付着防止剤を自動的に除去しうるはんだ付
着防止剤除去装置を配設したことを特徴とする自
動はんだ付け装置。 In the process of mounting a printed wiring board, a preheating device, a solder bath, and a cooling fan are passed through each of them one after another, and solder solution is applied to the required locations for batch soldering.
In automatic soldering equipment, the solder adhesion prevention agent can automatically remove the solder adhesion prevention agent applied in the previous process to the areas where solder should not adhere to the back of the preheating device, solder bath, and cooling fan. An automatic soldering device characterized by being equipped with a agent removal device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990020243U JPH084208Y2 (en) | 1990-02-28 | 1990-02-28 | Automatic soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990020243U JPH084208Y2 (en) | 1990-02-28 | 1990-02-28 | Automatic soldering equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03111456U true JPH03111456U (en) | 1991-11-14 |
| JPH084208Y2 JPH084208Y2 (en) | 1996-02-07 |
Family
ID=31523338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990020243U Expired - Lifetime JPH084208Y2 (en) | 1990-02-28 | 1990-02-28 | Automatic soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH084208Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61111669U (en) * | 1984-12-24 | 1986-07-15 | ||
| JPS645766U (en) * | 1987-06-30 | 1989-01-13 |
-
1990
- 1990-02-28 JP JP1990020243U patent/JPH084208Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61111669U (en) * | 1984-12-24 | 1986-07-15 | ||
| JPS645766U (en) * | 1987-06-30 | 1989-01-13 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH084208Y2 (en) | 1996-02-07 |
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