JPH03112732U - - Google Patents
Info
- Publication number
- JPH03112732U JPH03112732U JP2113890U JP2113890U JPH03112732U JP H03112732 U JPH03112732 U JP H03112732U JP 2113890 U JP2113890 U JP 2113890U JP 2113890 U JP2113890 U JP 2113890U JP H03112732 U JPH03112732 U JP H03112732U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- circuit board
- connection structure
- conductive film
- anisotropic conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005992 thermoplastic resin Polymers 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
Landscapes
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
第１図は本考案の一実施例の回路基板の接続構
造を示す概略斜視図、第２図は第１図の切断面線
−から見た概略断面図、第３図は本考案の他
の実施例の回路基板の接続構造を示す概略斜視図
、第４図は第３図の切断面線−から見た概略
断面図、第５図は従来の回路基板の接続構造を示
す概略斜視図、第６図は第５図の切断面線−
から見た概略断面図である。
１……液晶表示素子、２，５，６……防湿膜、
３……異方導電膜、４……ＴＡＢ、７……エツジ
部。
Fig. 1 is a schematic perspective view showing a connection structure of a circuit board according to an embodiment of the present invention, Fig. 2 is a schematic sectional view taken from the cutting plane line - of Fig. 1, and Fig. 3 is a schematic perspective view showing a connection structure of a circuit board according to an embodiment of the present invention. 4 is a schematic sectional view taken from the cutting plane line - in FIG. 3; FIG. 5 is a schematic perspective view showing a conventional circuit board connection structure; Figure 6 is the cutting plane line of Figure 5 -
FIG. 1... Liquid crystal display element, 2, 5, 6... Moisture-proof film,
3... Anisotropic conductive film, 4... TAB, 7... Edge portion.
Claims (1)
極に対応する位置に第２電極が形成された第２回
路基板とを、第１電極に一部露出部を残して、導
電性粒子と熱可塑性樹脂とから成る異方導電膜を
介して接続する回路基板の接続構造において、 少なくとも前記第１電極の露出部を前記異方導
電膜を構成する熱可塑性樹脂と同一の樹脂を用い
て被覆することを特徴とする回路基板の接続構造
。[Claims for Utility Model Registration] A first circuit board having a first electrode, a second circuit board having a second electrode formed at a position corresponding to the first electrode, and a part exposed to the first electrode. In a connection structure of a circuit board in which the exposed portion of the first electrode is connected via an anisotropic conductive film made of conductive particles and a thermoplastic resin, at least the exposed portion of the first electrode is made of the thermoplastic resin constituting the anisotropic conductive film. A circuit board connection structure characterized by being coated with the same resin as.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2113890U JPH03112732U (en) | 1990-03-01 | 1990-03-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2113890U JPH03112732U (en) | 1990-03-01 | 1990-03-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03112732U true JPH03112732U (en) | 1991-11-18 |
Family
ID=31524196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2113890U Pending JPH03112732U (en) | 1990-03-01 | 1990-03-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03112732U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007094412A (en) * | 2005-09-27 | 2007-04-12 | Samsung Sdi Co Ltd | Plasma display device |
-
1990
- 1990-03-01 JP JP2113890U patent/JPH03112732U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007094412A (en) * | 2005-09-27 | 2007-04-12 | Samsung Sdi Co Ltd | Plasma display device |
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