JPH03112873A - Solder for ceramics junction - Google Patents

Abstract

PURPOSE:To prevent generation of breakage of a ceramics in bonding the ceramics to a metal by bonding solder plates to a plate of Cu, Ni or an alloy thereof and forming many holes, concave parts or projecting parts on the splicing surface between the ceramics. CONSTITUTION:Onto the upper and lower surfaces of a plate 11 of Cu, Ni or a Cu-Ni alloy, solder plates 12 and 12' of an Ag solder, etc., are bonded and many holes, concave parts or projecting parts are uniformly formed over the whole surface of at least the side bonded to a ceramics in order to reduce the splicing surface area, thus obtaining the objective solder 10 for ceramics junction. The obtained solder has a high soldering strength, capable of providing a stable junction having a low scatter and capable of readily controlling the thickness of the solder layer.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to improvements in brazing materials used for brazing ceramics and metals.

(Prior Art) Conventionally, in brazing ceramics and metals, a metallized layer 2 is formed on the surface of the ceramic l as shown in FIG. 9, and between this metallized layer 2 and metal 3, C
Ceramic bonding brazing material 6 having Ag brazing plates 5.5' bonded to the upper and lower surfaces of plates 4 made of U, Ni, or alloys thereof is arranged and bonded.

(Problem to be Solved by the Invention) By the way, when the metallized layer 2 of the ceramic l and the metal 3 are brazed using the above brazing material 6 for ceramic bonding, the ceramic l cracks due to the difference in expansion coefficient during heating and cooling. Occur. Therefore, precision control of the thickness of the brazing filler metal 6 for ceramic bonding is required.
Since voids occur due to insufficient volume of the solder, and the solder does not spread sufficiently over the joint surface, the strength of the brazing is low and the dispersion is wide.

Therefore, in the present invention, when ceramics and metal are brazed,
It is an object of the present invention to provide a brazing material for joining ceramics, which does not cause cracks in the ceramics, has high strength, is stable in brazing with little variation, and can easily control the thickness of the brazing material.

(Means for Solving the Problems) To solve the above problems, the brazing material for ceramic bonding of the present invention is a brazing material for ceramic bonding in which brazing material plates are laminated on the upper and lower surfaces of plates of Cu, Ni, or their alloys. The brazing filler metal is characterized by having a large number of holes, recesses, or protrusions uniformly provided on the surface to be bonded to the ceramic, thereby reducing the bonding area.

(Function) As described above, the brazing material for ceramic bonding of the present invention has a large number of holes, recesses, or protrusions uniformly provided on the surface to be bonded to the ceramic, reducing the bonding area. Brazing absorbs and alleviates the strain caused by expansion and contraction over time, and does not cause cracks in ceramics.Also, it is easy to control the thickness of the filler metal, there is no shortage of volume of the filler metal, and voids do not occur. Since the solder spreads sufficiently over the ceramic joint surface, the brazing is strong and has little variation.

(Examples) Various examples of the brazing filler metal for ceramic bonding of the present invention will be described below with reference to the drawings.

Ceramic bonding brazing material IO of Example 1 shown in FIG.
A strip plate 12.1 of Ag brazing filler metal (AgCu 28%) with a thickness of 0.1 mm and a width of 20 mm is placed on the upper and lower surfaces of a strip plate 11 made of Cu with a thickness of 2.3 mm and a width of 20 mm.
2' are pasted together, and there are 4 rectangular holes 13 with a length of 4 mm and a width of 4 mm on the entire surface at a pitch of 5 mm in the width direction, and 5 rectangular holes 13 in the longitudinal direction.
A large number of holes are punched through the holes at a mm pitch by punching.

Ceramic bonding brazing material 14 of Example 2 shown in FIG.
A strip plate 16.1 of Ag brazing filler metal (AgCu 28%) with a thickness of 0.1 mm and a width of 20 mm is placed on the upper and lower surfaces of a strip plate 15 made of Ni with a thickness of 2.3 mm and a width of 20 mm.
6' are pasted together, and rectangular recesses 17 measuring 4 mm in length, 4 mm in width, and 2 mm in depth are formed on the upper surface side, which is the bonding surface side with the ceramic, 4 rectangular recesses 17 are formed at a pitch of 5 mm in the width direction, and 5 rectangular recesses 17 are formed in the longitudinal direction.
A large number of them are formed at a mm pitch by press compression molding.

Ceramic bonding brazing material 18 of Example 3 shown in FIG.
is a strip-shaped plate made of 30% Cu-Ni alloy with a thickness of 2.3 mm and a width of 20 mm.
A strip plate 20.20' of Ag brazing filler material (AgCu 28%) with a width of 20 mm and a width of 20 mm is pasted together, and the upper surface side, which is the joint surface with the ceramic, has a length of 3n++n and a width of 3+nm,
Four rectangular convex portions 21 with a height of 2 mm are left at a pitch of 5 mm in the width direction and a large number at a pitch of 5 mm in the longitudinal direction by vertical and horizontal grooving.

Ceramic bonding brazing material 22 of Example 4 shown in FIG.
In this example, a strip plate 24 of Ag brazing filler metal (AgCu 28%) with a thickness of 0.1 mm and a width of 20 mm is laminated on the lower surface of a strip base material 23 made of Cu with a thickness of 2.3 mm and a width of 20 mm. Length 3m+n, width 3m on table 23 side
m, four rectangular protrusions 25 with a height of 2 mm are formed at a pitch of 5 mm in the width direction, and a large number of 5 ml in the longitudinal direction at 11 pitches are left by vertical and horizontal grooving, and the rectangular protrusions 25
A semi-cylindrical Ag brazing material is placed on the top surface of the material, and an Ag brazing material 26 is laminated thereon by furnace brazing.

The brazing filler metals for ceramic bonding of Examples 1 to 4 were each cut into 20 mm pieces in the longitudinal direction, and they were cut into pieces of 20 mm each in the longitudinal direction, as shown in FIGS.
The 15 μm thick brazing plated with i is formed on the vertical 2
It was placed between an AI, O, ceramic 1 with a diameter of 0 mm, a width of 20 mm, and a thickness of 1 mm, and a Cu metal 3 with a length of 20 mm, a width of 20 mm, and a thickness of 5 mm.
Brazing was performed in an electric furnace in a N, gas) atmosphere.

On the other hand, as shown in Fig. 9, a 20 m vertical
Ceramics bonding solder in which a plate 5.5' of Ag solder (AgCu 28%) with a length of 20 mm, a width of 20 mm and a thickness of 0.1 mm is laminated on the upper and lower surfaces of a plate 4 with a width of 20 mm and a thickness of 2.3 mm. The metallized layer 2 of Mo and Mn is plated with Ni to a thickness of 15 μm, and the brazing is performed using an A1 plate with a length of 20 mm, a width of 20 mm, and a thickness of 1 mm formed on the surface.
201 ceramic l, length 20mm, width 20mm,
It was placed between a 5 mm thick Cu metal and brazed in an electric furnace at 810° C. in an inert gas (N2 gas) atmosphere.

In this way, 100 products each were inspected for brazing ceramics and metals that were brazed using the brazing fillers for ceramic bonding of Examples 1 to 4 and the brazing filler metal for ceramic bonding of the conventional example, and the strength of the brazing was measured. The results shown in the table below were obtained.

As is clear from the table below, 100 products were sold by brazing ceramics and metal using the conventional brazing filler metal for ceramic bonding. In contrast, there were no defective products as described above in the brazing products made by brazing ceramics and metals using the ceramic bonding brazing materials of Examples 1 to 4. . In addition, brazing ceramics and metals using conventional brazing fillers for ceramics bonding had low strength and large variations, making it unstable.
The brazing of ceramics and metal according to Examples 1 to 4 was stable with high strength (small variation).

In addition, the hole 13 of the brazing filler metal lO for ceramic bonding in Example 1
, recess I7 of the ceramic bonding brazing material 14 of Example 2
, convex portion 21 of ceramic bonding brazing material 18 of Example 3
, the convex portion 25 of the brazing filler metal 22 for ceramic bonding of Example 4
is not limited to a rectangle, but may also be a rhombus or a triangle. In addition, the hole 13 in Example 1 and the recess 1 in Example 2
7 may be circular or oval. Furthermore, Example 4
The Ag brazing material to be brazed to the upper surface of the convex portion 25 is not limited to a spherical shape, but may be disc-shaped or chip-shaped.

(Effects of the Invention) As can be seen from the above explanation, the brazing filler metal for ceramic bonding of the present invention has a large number of holes, recesses, or protrusions uniformly provided on the surface to be bonded to the ceramic, reducing the bonding area. Therefore, during brazing, the strain caused by expansion and contraction over time is absorbed and alleviated, and cracks do not occur in the ceramic due to interference effects. In addition, the control of the filler metal is easy, there is no insufficient volume of the filler metal, no voids are generated, and the filler metal spreads sufficiently over the bonding surface of the ceramic.
Brazing has the excellent effect of providing high strength and reducing variation.

[Brief explanation of drawings]

1 to 4 are perspective views showing embodiments of the brazing filler metal for bonding ceramics of the present invention, and FIGS. 5 to 8 show the bonding of ceramics and metal using the brazing filler metal for bonding ceramics of each embodiment of the present invention. FIG. 9 is a longitudinal sectional view showing the state of brazing between ceramics and metal using a conventional brazing material for joining ceramics. 10, 14.18.22... Brazing filler metal for ceramic bonding, 11.15, 19.23 = Cu, Ni,
Cu-Ni alloy plate, 12. 12', 16
．． 16', 20.20' 24...Ag brazing material plate, 13...hole, 17...recess, 21...
- Convex portion, 25...Convex portion, 26...Ag solder.

Claims (1)

[Claims] 1. In a brazing filler metal for ceramic bonding in which a brazing filler metal plate is bonded to the upper and lower surfaces of a plate of Cu or Ni or an alloy thereof, a large number of holes, recesses, or protrusions are formed over the entire surface at least on the side to be bonded to the ceramics. A brazing filler metal for bonding ceramics, characterized in that it is uniformly provided and the bonding area is reduced.