JPH03112937U - - Google Patents
Info
- Publication number
- JPH03112937U JPH03112937U JP2173590U JP2173590U JPH03112937U JP H03112937 U JPH03112937 U JP H03112937U JP 2173590 U JP2173590 U JP 2173590U JP 2173590 U JP2173590 U JP 2173590U JP H03112937 U JPH03112937 U JP H03112937U
- Authority
- JP
- Japan
- Prior art keywords
- leads
- heating element
- footprint patterns
- brought
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の原理図、第２図は本考案の実
施例を示す斜視図、第３図は実施例の説明図、第
４図はＴＡＢ搭載例を示す構成図、第５図はボン
デイング方法の説明図、第６図は従来例のボンデ
イング工具の斜視図である。
図において、１，１ａ……プリント基板、２，
２ａ，２ｂ……フツトプリントパターン、４……
部品、４ａ……ＴＡＢ部品、５，５ａ，５ｂ……
ボンデイング工具、６……発熱体、６ａ〜６ｄ…
…発熱部、７，７ａ〜７ｄ……先端面、４０，４
０ａ，４０ｂ……リードを示す。
Fig. 1 is a diagram showing the principle of the present invention, Fig. 2 is a perspective view showing an embodiment of the invention, Fig. 3 is an explanatory diagram of the embodiment, Fig. 4 is a configuration diagram showing an example of mounting a TAB, and Fig. 5 is a perspective view showing an embodiment of the invention. FIG. 6, which is an explanatory diagram of the bonding method, is a perspective view of a conventional bonding tool. In the figure, 1, 1a... printed circuit board, 2,
2a, 2b...foot print pattern, 4...
Parts, 4a...TAB parts, 5, 5a, 5b...
Bonding tool, 6... Heating element, 6a to 6d...
...Heating part, 7,7a-7d...Tip surface, 40,4
0a, 40b... Indicates read.
Claims (1)
複数のリード４０をボンデイング工具５の発熱体
６の先端面７に接触させて該部品４を保持し、 該プリント基板１上に形成され、表面にハンダ
層３を有する複数のフツトプリントパターン２及
び該複数のリード４０を受像手段８によつて受像
して夫々の映像をデイスプレイ９に表示して位置
合わせし、 該複数のフツトプリントパターン２に該複数の
リード４０を当接して押圧し、 該発熱体６を発熱させて該ハンダ層３を溶融し
て該フツトプリントパターン２に該リード４０を
接合するボンデイング装置において、 前記発熱体６の少なくとも前記先端面７を前記
リード４０の色と識別可能な色に着色したことを
特徴とするボンデイング工具。[Claims for Utility Model Registration] A plurality of arranged leads 40 of a component 4 mounted on a printed circuit board 1 are brought into contact with a tip surface 7 of a heating element 6 of a bonding tool 5 to hold the component 4; 1, the plurality of footprint patterns 2 having the solder layer 3 on the surface thereof and the plurality of leads 40 are imaged by the image receiving means 8, and respective images are displayed on the display 9 and aligned; In a bonding device, a plurality of leads 40 are brought into contact with and pressed against a plurality of footprint patterns 2, and the heating element 6 generates heat to melt the solder layer 3 and bond the leads 40 to the footprint patterns 2. . A bonding tool, characterized in that at least the tip end surface 7 of the heating element 6 is colored in a color distinguishable from the color of the lead 40.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2173590U JPH03112937U (en) | 1990-03-02 | 1990-03-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2173590U JPH03112937U (en) | 1990-03-02 | 1990-03-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03112937U true JPH03112937U (en) | 1991-11-19 |
Family
ID=31524767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2173590U Pending JPH03112937U (en) | 1990-03-02 | 1990-03-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03112937U (en) |
-
1990
- 1990-03-02 JP JP2173590U patent/JPH03112937U/ja active Pending